MOTOROLA MC10H424FN

SEMICONDUCTOR TECHNICAL DATA
The MC10H424 is a Quad TTL–to–ECL translator with an ECL strobe.
Power supply requirements are ground, +5.0 volts, and –5.2 volts.
L SUFFIX
CERAMIC PACKAGE
CASE 620–10
• Propagation Delay, 1.5 ns Typical
• Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
• Voltage Compensated
• MECL 10K — Compatible
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
FN SUFFIX
PLCC
CASE 775–02
MAXIMUM RATINGS
Symbol
Rating
Unit
Power Supply (VCC = 5.0 V)
Characteristic
VEE
–8.0 to 0
Vdc
Power Supply (VEE = – 5.2 V)
VCC
0 to +7.0
Vdc
VI
0 to VEE
Vdc
Input Voltage (ECL)
Input Voltage (TTL)
LOGIC DIAGRAM
VI
0 to VCC
Vdc
5
Output Current — Continuous
— Surge
Iout
50
100
mA
6
4
2
Operating Temperature Range
TA
0 to +75
°C
7
3
Tstg
–55 to +150
–55 to +165
°C
Storage Temperature Range — Plastic
— Ceramic
1
ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ± 5%, VCC = 5.0 V ± 5.0%)
0°
Characteristic
25°
12
15
75°
Symbol
Min
Max
Min
Max
Min
Max
Unit
Negative Power Supply
Drain Current
IE
—
72
—
66
—
72
mAdc
Positive Power Supply
pp y
D i Current
Drain
C
t
ICCH
ICCL
—
16
—
16
—
18
mAdc
—
25
—
25
—
25
mAdc
Reverse Current Pin
5,7,10,11
IR
—
50
—
50
—
50
µAdc
Forward Current Pin
5,7,10,11
IF
—
–3.2
—
–3.2
—
–3.2
mAdc
IinH
—
450
—
310
—
310
µAdc
Input LOW Current Pin 6
IinL
0.5
—
0.5
—
0.3
—
µAdc
Input Breakdown Voltage
V(BR)in
5.5
—
5.5
—
5.5
—
Vdc
Input Clamp Voltage
VI
—
–1.5
—
–1.5
—
–1.5
Vdc
High Output Voltage
VOH
–1.02
–0.84
–0.98
–0.81
–0.92
–0.735
Low Output Voltage
VOL
–1.95
–1.63
–1.95
–1.63
–1.95
High Input Voltage Pin
5,7,10,11
VIH
2.0
—
2.0
—
+2.0
Low Input Voltage Pin
5,7,10,11
VIL
—
0.8
—
0.8
High Input Voltage Pin 6
VIH
–1.17
–0.84
–1.13
Low Input Voltage Pin 6
VIL
–1.95
–1.48
–1.95
Input HIGH Current Pin 6
10
11
13
14
GND
VCC (+5.0 VDC)
VEE (–5.2 VDC)
= PIN 16
= PIN 9
= PIN 8
DIP
PIN ASSIGNMENT
BOUT
1
16
GND
Vdc
AOUT
2
15
COUT
–1.60
Vdc
BOUT
3
14
DOUT
—
Vdc
AOUT
4
13
DOUT
—
0.8
Vdc
5
12
COUT
–0.81
–1.07
–0.735
Vdc
AIN
COMMON
STROBE
6
11
DIN
–1.48
–1.95
–1.45
Vdc
BIN
7
10
CIN
VEE
8
9
VCC
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
Tables on page 6–11 of the Motorola MECL Data
Book (DL122/D).
3/93
 Motorola, Inc. 1996
2–117
REV 5
MC10H424
AC PARAMETERS
Propagation Delay
Data
Strobe
tpd
Rise Time
tr
tf
Fall Time
ns
0.5
0.5
2.2
2.2
0.5
0.5
2.3
2.3
0.5
0.5
2.4
2.4
0.5
2.0
0.5
2.0
0.5
2.2
ns
0.5
2.0
0.5
2.0
0.5
2.2
ns
NOTE:
Each MECL 10H series circuit has been designed to meet the dc specifications
shown in the test table, after thermal equilibrium has been established. The
circuit is in a test socket or mounted on a printed circuit board and transverse
air flow greater than 500 Ifpm is maintained. Outputs are terminated through
a 50–ohm resistor to –2.1 volts.
APPLICATIONS INFORMATION
The MC10H424 has TTL–compatible inputs, an ECL strobe
and MECL complementary open–emitter outputs that allow
use as an inverting/non–inverting translator or as a differential
line driver. When the common strobe input is at the low–logic
level, it forces all true outputs to a MECL low–logic state and
MOTOROLA
all inverting outputs to a MECL high–logic state.
An advantage of this device is that TTL–level information
can be transmitted differentially, via balanced twisted pair
lines, to MECL equipment, where the signal can be received
by the MC10H115 or MC10H116 differential line receivers.
2–118
MECL Data
DL122 — Rev 6
MC10H424
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
0.007 (0.180) M T L–M
B
Y BRK
–N–
U
N
S
0.007 (0.180) M T L–M
S
S
N
S
D
–L–
–M–
Z
W
20
D
1
V
0.010 (0.250)
G1
X
S
T L–M
S
N
S
VIEW D–D
A
0.007 (0.180) M T L–M
S
N
S
R
0.007 (0.180) M T L–M
S
N
S
Z
C
H
–T–
SEATING
PLANE
F
VIEW S
G1
0.010 (0.250) S T L–M
S
0.007 (0.180)
M
T L–M
S
N
S
VIEW S
S
N
S
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
MECL Data
DL122 — Rev 6
N
K
0.004 (0.100)
J
S
K1
E
G
0.007 (0.180) M T L–M
2–119
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
–––
0.025
–––
0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
–––
0.020
2_
10 _
0.310
0.330
0.040
–––
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
–––
0.64
–––
8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
–––
0.50
2_
10 _
7.88
8.38
1.02
–––
MOTOROLA
MC10H424
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
–A–
16
9
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
–B–
C
L
DIM
A
B
C
D
E
F
G
H
K
L
M
N
–T–
K
N
SEATING
PLANE
M
E
F
J
G
D
16 PL
0.25 (0.010)
16 PL
0.25 (0.010)
M
T A
T B
M
–A–
9
1
8
B
F
C
L
S
–T–
SEATING
PLANE
K
H
G
D
M
J
16 PL
0.25 (0.010)
M
MILLIMETERS
MIN
MAX
19.05
19.93
6.10
7.49
–––
5.08
0.39
0.50
1.27 BSC
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0_
15 _
0.51
1.01
S
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
16
S
INCHES
MIN
MAX
0.750
0.785
0.240
0.295
–––
0.200
0.015
0.020
0.050 BSC
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0_
15 _
0.020
0.040
T A
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
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arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
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are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
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◊
MOTOROLA
2–120
*MC10H424/D*
MC10H424/D
MECL Data
DL122 — Rev 6