MOTOROLA MC10H124FN

SEMICONDUCTOR TECHNICAL DATA
! !
The MC10H124 is a quad translator for interfacing data and control
signals between a saturated logic section and the MECL section of digital
systems. The 10H part is a functional/pinout duplication of the standard
MECL 10K family part, with 100% improvement in propagation delay, and
no increase in power–supply current.
L SUFFIX
CERAMIC PACKAGE
CASE 620–10
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
• Propagation Delay, 1.5 ns Typical
• Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
• Voltage Compensated
• MECL 10K–Compatible
FN SUFFIX
PLCC
CASE 775–02
MAXIMUM RATINGS
Symbol
Rating
Unit
Power Supply (VCC = 5.0 V)
Characteristic
VEE
–8.0 to 0
Vdc
Power Supply (VEE = –5.2 V)
VCC
0 to +7.0
Vdc
5
VI
0 to VCC
Vdc
6
4
2
Output Current — Continuous
— Surge
Iout
50
100
mA
7
3
Operating Temperature Range
TA
0 to +75
°C
Tstg
–55 to +150
–55 to +165
°C
Input Voltage (VCC = 5.0 V) TTL
Storage Temperature Range — Plastic
— Ceramic
LOGIC DIAGRAM
1
10
12
15
ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%, VCC = 5.0 V ± 5.0%)
0°
Characteristic
Negative Power
Supply Drain
Current
Positive Power Supply
pp y
D i Current
Drain
C
t
25°
75°
11
Symbol
Min
Max
Min
Max
Min
Max
Unit
IE
—
72
—
66
—
72
mA
ICCH
ICCL
—
16
—
16
—
18
mA
—
25
—
25
—
25
mA
—
—
200
50
—
—
200
50
—
—
200
50
—
—
–12.8
–3.2
—
—
–12.8
–3.2
—
—
–12.8
–3.2
5.5
—
5.5
—
5.5
—
Vdc
Reverse Current
Pin 6
Pin 7
IR
Forward Current
Pin 6
Pin 7
IF
Input Breakdown
Voltage
V(BR)in
13
14
GND = PIN 16
VCC ( +5.0 VDC) = PIN 9
VEE ( –5.2 VDC) = PIN 8
µA
DIP
PIN ASSIGNMENT
mA
Input Clamp Voltage
VI
—
–1.5
—
–1.5
—
–1.5
Vdc
High Output Voltage
VOH
–1.02
–0.84
–0.98
–0.81
–0.92
–0.735
Vdc
Low Output Voltage
VOL
–1.95
–1.63
–1.95
–1.63
–1.95
–1.60
Vdc
High Input Voltage
VIH
2.0
—
2.0
—
2.0
—
Vdc
Low Input Voltage
VIL
—
0.8
—
0.8
—
0.8
Vdc
NOTE:
Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table,
after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit
board and transverse air flow greater than 500 Ifpm is maintained. Outputs are terminated through a
50–ohm resistor to –2.0 volts.
BOUT
1
16
GND
AOUT
2
15
COUT
BOUT
3
14
DOUT
AOUT
4
13
DOUT
AIN
COMMON
STROBE
BIN
5
12
COUT
6
11
DIN
7
10
CIN
VEE
8
9
VCC
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
Tables on page 6–36 of the Motorola MECL Data
Book (DL122/D).
9/96
 Motorola, Inc. 1996
2–5
REV 6
MC10H124
ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%, VCC = 5.0 V ± 5.0%)
0°
Characteristic
25°
75°
Symbol
Min
Max
Min
Max
Min
Max
Unit
tpd
tr
0.55
2.25
0.55
2.4
0.85
2.95
ns
Rise Time
0.5
1.5
0.5
1.6
0.5
1.7
ns
Fall Time
tf
0.5
1.5
0.5
1.6
0.5
1.7
ns
AC PARAMETERS
Propagation Delay
APPLICATIONS INFORMATION
An advantage of this device is that TTL–level
information can be transmitted differentially, via balanced
twisted pair lines, to MECL equipment, where the signal
can be received by the MC10H115 or MC10H116
differential line receivers. The power supply
requirements are ground, +5.0 volts, and –5.2 volts.
The MC10H124 has TTL–compatible inputs and
MECL complementary open–emitter outputs that allow
use as an inverting/non–inverting translator or as a
differential line driver. When the common strobe input is
at the low–logic level, it forces all true outputs to a MECL
low–logic state and all inverting outputs to a MECL
high–logic state.
MOTOROLA
2–6
MECL Data
DL122 — Rev 6
MC10H124
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
0.007 (0.180) M T L–M
B
Y BRK
–N–
U
N
S
0.007 (0.180) M T L–M
S
S
N
S
D
–L–
–M–
Z
W
20
D
1
V
0.010 (0.250)
G1
X
S
T L–M
S
N
S
VIEW D–D
A
0.007 (0.180) M T L–M
S
N
S
R
0.007 (0.180) M T L–M
S
N
S
Z
C
H
–T–
SEATING
PLANE
F
VIEW S
G1
0.010 (0.250) S T L–M
S
0.007 (0.180)
M
T L–M
S
N
S
VIEW S
S
N
S
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
MECL Data
DL122 — Rev 6
N
K
0.004 (0.100)
J
S
K1
E
G
0.007 (0.180) M T L–M
2–7
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
–––
0.025
–––
0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
–––
0.020
2_
10 _
0.310
0.330
0.040
–––
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
–––
0.64
–––
8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
–––
0.50
2_
10 _
7.88
8.38
1.02
–––
MOTOROLA
MC10H124
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
–A–
16
9
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
–B–
C
L
DIM
A
B
C
D
E
F
G
H
K
L
M
N
–T–
K
N
SEATING
PLANE
M
E
F
J
G
D
16 PL
0.25 (0.010)
16 PL
0.25 (0.010)
M
T A
T B
M
–A–
9
1
8
B
F
C
L
S
–T–
SEATING
PLANE
K
H
G
D
M
J
16 PL
0.25 (0.010)
M
MILLIMETERS
MIN
MAX
19.05
19.93
6.10
7.49
–––
5.08
0.39
0.50
1.27 BSC
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0_
15 _
0.51
1.01
S
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
16
S
INCHES
MIN
MAX
0.750
0.785
0.240
0.295
–––
0.200
0.015
0.020
0.050 BSC
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0_
15 _
0.020
0.040
T A
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
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are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
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51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298
◊
MOTOROLA
2–8
*MC10H124/D*
MC10H124/D
MECL Data
DL122 — Rev 6