NLSV4T244 D

NLSV4T244
4-Bit Dual-Supply
Non-Inverting Level
Translator
The NLSV4T244 is a 4−bit configurable dual−supply voltage level
translator. The input An and output Bn ports are designed to track two
different power supply rails, VCCA and VCCB respectively. Both
supply rails are configurable from 0.9 V to 4.5 V allowing universal
low−voltage translation from the input An to the output Bn port.
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MARKING
DIAGRAMS
UQFN12
MU SUFFIX
CASE 523AE
Features
•
•
•
•
•
•
•
•
•
•
Wide VCCA and VCCB Operating Range: 0.9 V to 4.5 V
High−Speed w/ Balanced Propagation Delay
Inputs and Outputs have OVT Protection to 4.5 V
Non−preferential VCCA and VCCB Sequencing
Outputs at 3−State until Active VCC is Reached
Power−Off Protection
Outputs Switch to 3−State with VCCB at GND
Ultra−Small Packaging: 1.7 mm x 2.0 mm UQFN12
NLVSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These are Pb−Free Devices
1
URMG
G
UR = Specific Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
14
SOIC−14
D SUFFIX
CASE 751A
14
1
SV4T244G
AWLYWW
1
14
14
1
TSSOP−14
DT SUFFIX
CASE 948G
Typical Applications
1
• Mobile Phones, PDAs, Other Portable Devices
A
L, WL
Y, YY
W, WW
G or G
Important Information
• ESD Protection for All Pins:
HBM (Human Body Model) > 1500 V
SV4T
244
ALYWG
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information on page 2 of
this data sheet.
© Semiconductor Components Industries, LLC, 2015
October, 2015 − Rev. 6
1
Publication Order Number:
NLSV4T244/D
NLSV4T244
OE
VCCA
1
A1
11
VCCB
2
10
B1
A2
3
9
B2
A3
4
8
B3
A4
5
7
B4
12
6
GND
(Top View)
OE VCCB B1
B2
B3
NC
B4
14
13
12
11
10
9
8
1
2
3
4
5
6
7
VCCA
A1
A2
A3
A4
NC
GND
Figure 1. Pin Assignments
VCCA
VCCB
A1
B1
A2
B2
A3
B3
A4
B4
OE
Figure 2. Logic Diagram
TRUTH TABLE
PIN ASSIGNMENT
Inputs
PIN
FUNCTION
VCCA
Input Port DC Power Supply
VCCB
Outputs
OE
An
Bn
Output Port DC Power Supply
L
L
L
GND
Ground
L
H
H
An
Input Port
H
X
3−State
Bn
Output Port
OE
Output Enable
ORDERING INFORMATION
Device
NLSV4T244MUTAG
NLVSV4T244MUTAG*
NLSV4T244DR2G
NLSV4T244DTR2G
Package
Shipping †
UQFN12
(Pb−Free)
3000 / Tape and Reel
SO−14
(Pb−Free)
2500 / Tape and Reel
SC70−6UQFN12TSSOP−14
(Pb−Free)
302500 / Tape and Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D
*NLVSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and
PPAP Capable.
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2
NLSV4T244
MAXIMUM RATINGS
Symbol
VCCA, VCCB
VI
VC
VO
Rating
Value
DC Supply Voltage
Condition
Unit
−0.5 to +5.5
V
An
−0.5 to +5.5
V
OE
−0.5 to +5.5
V
(Power Down)
Bn
−0.5 to +5.5
(Active Mode)
Bn
−0.5 to +5.5
V
(Tri−State Mode)
Bn
−0.5 to +5.5
V
DC Input Voltage
Control Input
DC Output Voltage
VCCA = VCCB = 0
V
IIK
DC Input Diode Current
−20
VI < GND
mA
IOK
DC Output Diode Current
−50
VO < GND
mA
IO
DC Output Source/Sink Current
±50
mA
ICCA, ICCB
DC Supply Current Per Supply Pin
±100
mA
IGND
DC Ground Current per Ground Pin
±100
mA
TSTG
Storage Temperature
−65 to +150
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
RECOMMENDED OPERATING CONDITIONS
Symbol
VCCA, VCCB
Parameter
Bus Input Voltage
VC
Control Input
VIO
Bus Output Voltage
Dt / DV
Max
Unit
0.9
4.5
V
GND
4.5
V
OE
GND
4.5
V
(Power Down Mode)
Bn
GND
4.5
V
(Active Mode)
Bn
GND
VCCB
V
(Tri−State Mode)
Bn
GND
4.5
V
−40
+105
°C
0
10
nS
Positive DC Supply Voltage
VI
TA
Min
Operating Temperature Range
Input Transition Rise or Rate
VI, from 30% to 70% of VCC; VCC = 3.3 V ±0.3 V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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3
NLSV4T244
DC ELECTRICAL CHARACTERISTICS
−405C to +855C
Symbol
VIH
Parameter
Test Conditions
Input HIGH Voltage
(An, OE)
VCCA (V)
VCCB (V)
Min
Max
Unit
3.6 – 4.5
0.9 – 4.5
2.2
−
V
2.7 – 3.6
2.0
−
2.3 – 2.7
1.6
−
1.4 − 2.3
0.65 * VCCA
−
0.9 – 1.4
VIL
Input LOW Voltage
(An, OE)
0.9 * VCCA
−
−
0.8
2.7 – 3.6
−
0.8
2.3 – 2.7
−
0.7
1.4 − 2.3
−
0.35 * VCCA
3.6 – 4.5
0.9 – 4.5
0.9 – 1.4
VOH
Output HIGH Voltage
−
0.1 * VCCA
IOH = −100 mA; VI = VIH
0.9 – 4.5
0.9 – 4.5
VCCB – 0.2
−
IOH = −0.5 mA; VI = VIH
0.9
0.9
0.75 * VCCB
−
IOH = −2 mA; VI = VIH
1.4
1.4
1.05
−
IOH = −6 mA; VI = VIH
1.65
1.65
1.25
−
2.3
2.3
2.0
−
2.3
2.3
1.8
−
2.7
2.7
2.2
−
2.3
2.3
1.7
−
3.0
3.0
2.4
−
IOH = −12 mA; VI = VIH
IOH = −18 mA; VI = VIH
VOL
Output LOW Voltage
IOH = −24 mA; VI = VIH
3.0
3.0
2.2
−
IOL = 100 mA; VI = VIL
0.9 – 4.5
0.9 – 4.5
−
0.2
IOL = 0.5 mA; VI = VIL
1.1
1.1
−
0.3
IOL = 2 mA; VI = VIL
1.4
1.4
−
0.35
IOL = 6 mA; VI = VIL
1.65
1.65
−
0.3
IOL = 12 mA; VI = VIL
2.3
2.3
−
0.4
2.7
2.7
−
0.4
2.3
2.3
−
0.6
3.0
3.0
−
0.45
3.0
3.0
−
0.6
IOL = 18 mA; VI = VIL
IOL = 24 mA; VI = VIL
V
V
V
Input Leakage Current
VI = VCCA or GND
0.9 – 4.5
0.9 – 4.5
−1.0
1.0
mA
IOFF
Power−Off Leakage Current
OE = 0 V
0
0.9 – 4.5
0.9 – 4.5
0
−1.0
−1.0
1.0
1.0
mA
ICCA
Quiescent Supply Current
VI = VCCA or GND;
IO = 0, VCCA = VCCB
0.9 – 4.5
0.9 − 4.5
−
2.0
mA
ICCB
Quiescent Supply Current
VI = VCCA or GND;
IO = 0, VCCA = VCCB
0.9 – 4.5
0.9 − 4.5
−
2.0
mA
ICCA + ICCB Quiescent Supply Current
VI = VCCA or GND;
IO = 0, VCCA = VCCB
0.9 – 4.5
0.9 – 4.5
−
4.0
mA
II
DICCA
Increase in ICC per Input Voltage, VI = VCCA – 0.6 V;
Other Inputs at VCCA or GND
VI = VCCA or GND
4.5
3.6
4.5
3.6
−
10
5.0
mA
DICCB
Increase in ICC per Input Voltage, VI = VCCA – 0.6 V;
Other Inputs at VCCA or GND
VI = VCCA or GND
4.5
3.6
4.5
3.6
−
10
5.0
mA
0.9 – 4.5
0.9 – 4.5
−1.0
1.0
mA
IOZ
I/O Tri−State Output Leakage
Current
TA = 25°C, OE = VCCA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
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4
NLSV4T244
TOTAL STATIC POWER CONSUMPTION (ICCA + ICCB)
−405C to +855C
VCCB (V)
4.5
VCCA (V)
Min
3.3
Max
Min
2.8
Max
Min
1.8
Max
Min
0.9
Max
Min
Max
Unit
4.5
2
2
2
2
< 1.5
μA
3.3
2
2
2
2
< 1.5
μA
2.8
<2
<1
<1
< 0.5
< 0.5
μA
1.8
<1
<1
< 0.5
< 0.5
< 0.5
μA
0.9
< 0.5
< 0.5
< 0.5
< 0.5
< 0.5
μA
NOTE:
Connect ground before applying supply voltage VCCA or VCCB. This device is designed with the feature that the power−up
sequence of VCCA and VCCB will not damage the IC.
AC ELECTRICAL CHARACTERISTICS
−405C to +855C
VCCB (V)
4.5
Symbol
tPLH,
tPHL
(Note 1)
tPHZ,
tPLZ
(Note 1)
tOSHL,
tOSLH
(Note 1)
Max
Min
2.8
Max
Min
1.8
Max
Unit
2.1
2.3
nS
2.1
2.3
2.6
2.1
2.3
2.5
2.8
2.1
2.4
2.5
2.7
3.0
1.2
2.4
2.7
2.8
3.0
3.3
4.5
2.6
3.8
4.0
4.1
4.3
3.3
3.7
3.9
4.1
4.3
4.6
2.5
3.9
4.1
4.3
4.5
4.8
1.8
4.1
4.4
4.5
4.7
5.0
1.2
4.4
4.7
4.8
5.0
5.3
4.5
2.6
3.8
4.0
4.1
4.3
3.3
3.7
3.9
4.1
4.3
4.6
2.5
3.9
4.1
4.3
4.5
4.8
1.8
4.1
4.4
4.5
4.7
5.0
1.2
4.4
4.7
4.8
5.0
5.3
4.5
0.15
0.15
0.15
0.15
0.15
3.3
0.15
0.15
0.15
0.15
0.15
2.5
0.15
0.15
0.15
0.15
0.15
1.8
0.15
0.15
0.15
0.15
0.15
1.2
0.15
0.15
0.15
0.15
0.15
VCCA (V)
Propagation
Delay,
4.5
1.6
1.8
2.0
3.3
1.7
1.9
An to Bn
2.8
1.9
1.8
Output
Enable,
OE to Bn
Output
Disable,
OE to Bn
Output to
Output
Skew,
Time
Min
1.2
Max
Parameter
(Note 1)
tPZH,
tPZL
Min
3.3
Max
Min
nS
nS
nS
1. Propagation delays defined per Figure 3.
CAPACITANCE
Symbol
Parameter
Test Conditions
Typ (Note 2)
Unit
CIN
Control Pin Input Capacitance
VCCA = VCCB = 3.3 V, VI = 0 V or VCCA/B
3.5
pF
CI/O
I/O Pin Input Capacitance
VCCA = VCCB = 3.3 V, VI = 0 V or VCCA/B
5.0
pF
CPD
Power Dissipation Capacitance
VCCA = VCCB = 3.3 V, VI = 0 V or VCCA, f = 10 MHz
20
pF
2. Typical values are at TA = +25°C.
3. CPD is defined as the value of the IC’s equivalent capacitance from which the operating current can be calculated from:
ICC(operating) ^ CPD x VCC x fIN x NSW where ICC = ICCA + ICCB and NSW = total number of outputs switching.
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5
NLSV4T244
VCC
RL
Pulse
Generator
VCCO x 2
OPEN
GND
DUT
CL
RL
Figure 3. AC (Propagation Delay) Test Circuit
Test
Switch
tPLH, tPHL
OPEN
tPLZ, tPZL
VCCO x 2
tPHZ, tPZH
GND
CL = 15 pF or equivalent (includes probe and jig capacitance)
RL = 2 kW or equivalent
ZOUT of pulse generator = 50 W
VIH
Input (An)
Vm
Vm
0V
tPHL
tPLH
Output (Bn)
Vm
VOH
Vm
VOL
Waveform 1 − Propagation Delays
tR = tF = 2.0 ns, 10% to 90%; f = 1 MHz; tW = 500 ns
VIH
OEn
Vm
Vm
0V
tPZH
tPHZ
Output (Bn)
VOH
VY
Vm
≈0V
tPZL
tPLZ
≈ VCC
Vm
Output (Bn)
VX
VOL
Waveform 2 − Output Enable and Disable Times
tR = tF = 2.0 ns, 10% to 90%; f = 1 MHz; tW = 500 ns
Figure 4. AC (Propagation Delay) Test Circuit Waveforms
VCC
Symbol
3.0 V – 4.5 V
2.3 V − 2.7 V
1.65 V − 1.95 V
1.4 V − 1.6 V
0.9 V − 1.3 V
VmA
VCCA/2
VCCA/2
VCCA/2
VCCA/2
VCCA/2
VmB
VCCB/2
VCCB/2
VCCB/2
VCCB/2
VCCB/2
VX
VOL + 10% VOH
VOL + 10% VOH
VOL + 10% VOH
VOL + 10% VOH
VOL + 10% VOH
VY
VOH x 0.9
VOH x 0.9
VOH x 0.9
VOH x 0.9
VOH x 0.9
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6
NLSV4T244
PACKAGE DIMENSIONS
UQFN12 1.7x2.0, 0.4P
CASE 523AE
ISSUE A
D
ÉÉ
ÉÉ
ÉÉ
PIN 1 REFERENCE
2X
0.10 C
2X
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND 0.30 MM
FROM TERMINAL TIP.
4. MOLD FLASH ALLOWED ON TERMINALS
ALONG EDGE OF PACKAGE. FLASH 0.03
MAX ON BOTTOM SURFACE OF
TERMINALS.
5. DETAIL A SHOWS OPTIONAL
CONSTRUCTION FOR TERMINALS.
A B
L1
DETAIL A
E
NOTE 5
TOP VIEW
DIM
A
A1
A3
b
D
E
e
K
L
L1
L2
DETAIL B
A
0.05 C
DETAIL B
OPTIONAL
CONSTRUCTION
12X
0.05 C
A1
A3
8X
C
SIDE VIEW
SEATING
PLANE
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.127 REF
0.15
0.25
1.70 BSC
2.00 BSC
0.40 BSC
0.20
---0.45
0.55
0.00
0.03
0.15 REF
K
5
MOUNTING FOOTPRINT
SOLDERMASK DEFINED
7
DETAIL A
e
2.00
1
12X
11
L
12X
L2
BOTTOM VIEW
1
b
0.10
M
C A B
0.05
M
C
0.32
NOTE 3
0.40
PITCH
2.30
11X
0.22
12X
0.69
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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7
NLSV4T244
PACKAGE DIMENSIONS
SOIC−14
D SUFFIX
CASE 751A−03
ISSUE K
D
A
B
14
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
8
A3
E
H
L
1
0.25
M
DETAIL A
7
B
13X
M
b
0.25
M
C A
S
B
S
e
DETAIL A
h
A
X 45 _
M
A1
C
SEATING
PLANE
DIM
A
A1
A3
b
D
E
e
H
h
L
M
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
0.19
0.25
0.35
0.49
8.55
8.75
3.80
4.00
1.27 BSC
5.80
6.20
0.25
0.50
0.40
1.25
0_
7_
SOLDERING FOOTPRINT*
6.50
14X
1.18
1
1.27
PITCH
14X
0.58
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
8
INCHES
MIN
MAX
0.054 0.068
0.004 0.010
0.008 0.010
0.014 0.019
0.337 0.344
0.150 0.157
0.050 BSC
0.228 0.244
0.010 0.019
0.016 0.049
0_
7_
NLSV4T244
PACKAGE DIMENSIONS
TSSOP−14
DT SUFFIX
CASE 948G
ISSUE B
14X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
S
S
N
2X
14
L/2
0.25 (0.010)
8
M
B
−U−
L
PIN 1
IDENT.
F
7
1
0.15 (0.006) T U
N
S
DETAIL E
K
A
−V−
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
K1
J J1
SECTION N−N
−W−
C
0.10 (0.004)
−T− SEATING
PLANE
D
H
G
DETAIL E
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
INCHES
MIN
MAX
MIN MAX
4.90
5.10 0.193 0.200
4.30
4.50 0.169 0.177
−−−
1.20
−−− 0.047
0.05
0.15 0.002 0.006
0.50
0.75 0.020 0.030
0.65 BSC
0.026 BSC
0.50
0.60 0.020 0.024
0.09
0.20 0.004 0.008
0.09
0.16 0.004 0.006
0.19
0.30 0.007 0.012
0.19
0.25 0.007 0.010
6.40 BSC
0.252 BSC
0_
8_
0_
8_
SOLDERING FOOTPRINT
7.06
1
0.65
PITCH
14X
0.36
14X
1.26
DIMENSIONS: MILLIMETERS
ON Semiconductor and the
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specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
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