TIP140 D

TIP140, TIP141, TIP142,
(NPN); TIP145, TIP146,
TIP147, (PNP)
Darlington Complementary
Silicon Power Transistors
Designed for general−purpose amplifier and low frequency
switching applications.
Features
• High DC Current Gain −
•
•
•
Min hFE = 1000 @ IC
= 5.0 A, VCE = 4 V
Collector−Emitter Sustaining Voltage − @ 30 mA
VCEO(sus) = 60 Vdc (Min) − TIP140, TIP145
= 80 Vdc (Min) − TIP141, TIP146
= 100 Vdc (Min) − TIP142, TIP147
Monolithic Construction with Built−In Base−Emitter Shunt Resistor
These are Pb−Free Devices*
MAXIMUM RATINGS
Rating
Symbol
TIP140
TIP145
TIP141
TIP146
TIP142
TIP147
Unit
Collector − Emitter Voltage
VCEO
60
80
100
Vdc
Collector − Base Voltage
VCB
60
80
100
Vdc
Emitter − Base Voltage
VEB
Collector Current
− Continuous
− Peak (Note 1)
IC
5.0
Vdc
Adc
10
15
Base Current − Continuous
IB
0.5
Adc
Total Power Dissipation
@ TC = 25_C
PD
125
W
TJ, Tstg
−65 to +150
_C
Operating and Storage
Junction Temperature Range
10 AMPERE
DARLINGTON
COMPLEMENTARY SILICON
POWER TRANSISTORS
60−100 VOLTS, 125 WATTS
SOT−93 (TO−218)
CASE 340D
STYLE 1
TO−247
CASE 340L
STYLE 3
NOTE: Effective June 2012 this device will
be available only in the TO−247
package. Reference FPCN# 16827.
ORDERING INFORMATION
THERMAL CHARACTERISTICS
Characteristic
http://onsemi.com
Symbol
Max
Unit
Thermal Resistance,
Junction−to−Case
RqJC
1.0
°C/W
Thermal Resistance,
Junction−to−Ambient
RqJA
35.7
°C/W
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. 5 ms, v 10% Duty Cycle.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2012
May, 2012 − Rev. 6
1
Publication Order Number:
TIP140/D
TIP140, TIP141, TIP142, (NPN); TIP145, TIP146, TIP147, (PNP)
MARKING DIAGRAMS
TO−247
TO−218
TIP14x
AYWWG
AYWWG
TIP14x
1 BASE
1 BASE
3 EMITTER
2 COLLECTOR
2 COLLECTOR
TIP14x
A
Y
WW
G
3 EMITTER
=
=
=
=
=
Device Code
Assembly Location
Year
Work Week
Pb−Free Package
DARLINGTON SCHEMATICS
NPN
TIP140
TIP141
TIP142
PNP
TIP145
TIP146
TIP147
COLLECTOR
BASE
COLLECTOR
BASE
≈ 8.0 k
≈ 40
≈ 8.0 k
EMITTER
≈ 40
EMITTER
ORDERING INFORMATION
Package
Shipping
TIP140G
Device
SOT−93 (TO−218)
(Pb−Free)
30 Units / Rail
TIP141G
SOT−93 (TO−218)
(Pb−Free)
30 Units / Rail
TIP142G
SOT−93 (TO−218)
(Pb−Free)
30 Units / Rail
TIP145G
SOT−93 (TO−218)
(Pb−Free)
30 Units / Rail
TIP146G
SOT−93 (TO−218)
(Pb−Free)
30 Units / Rail
TIP147G
SOT−93 (TO−218)
(Pb−Free)
30 Units / Rail
TIP140G
TO−247
(Pb−Free)
30 Units / Rail
TIP141G
TO−247
(Pb−Free)
30 Units / Rail
TIP142G
TO−247
(Pb−Free)
30 Units / Rail
TIP145G
TO−247
(Pb−Free)
30 Units / Rail
TIP146G
TO−247
(Pb−Free)
30 Units / Rail
TIP147G
TO−247
(Pb−Free)
30 Units / Rail
http://onsemi.com
2
TIP140, TIP141, TIP142, (NPN); TIP145, TIP146, TIP147, (PNP)
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎ
ÎÎÎÎ
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎ
ÎÎÎÎ
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎ
ÎÎÎÎ
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎ
ÎÎÎÎ
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎ
ÎÎÎÎ
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎ
ÎÎÎÎ
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ELECTRICAL CHARACTERISTICS (TC = 25_C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
60
80
100
−
−
−
−
−
−
−
−
−
−
−
−
2.0
2.0
2.0
−
−
−
−
−
−
1.0
1.0
1.0
−
−
20
1000
500
−
−
−
−
−
−
−
−
2.0
3.0
Unit
OFF CHARACTERISTICS
Collector−Emitter Sustaining Voltage (Note 2)
(IC = 30 mA, IB = 0)
VCEO(sus)
TIP140, TIP145
TIP141, TIP146
TIP142, TIP147
Collector Cutoff Current
(VCE = 30 Vdc, IB = 0)
(VCE = 40 Vdc, IB = 0)
(VCE = 50 Vdc, IB = 0)
TIP140, TIP145
TIP141, TIP146
TIP142, TIP147
Collector Cutoff Current
(VCB = 60 V, IE = 0)
(VCB = 80 V, IE = 0)
(VCB = 100 V, IE = 0)
TIP140, TIP145
TIP141, TIP146
TIP142, TIP147
Vdc
ICEO
mA
ICBO
Emitter Cutoff Current (VBE = 5.0 V)
mA
IEBO
mA
ON CHARACTERISTICS (Note 2)
DC Current Gain
(IC = 5.0 A, VCE = 4.0 V)
(IC = 10 A, VCE = 4.0 V)
hFE
−
Collector−Emitter Saturation Voltage
(IC = 5.0 A, IB = 10 mA)
(IC = 10 A, IB = 40 mA)
VCE(sat)
Vdc
Base−Emitter Saturation Voltage
(IC = 10 A, IB = 40 mA)
VBE(sat)
−
−
3.5
Vdc
Base−Emitter On Voltage
(IC = 10 A, VCE = 4.0 Vdc)
VBE(on)
−
−
3.0
Vdc
td
−
0.15
−
ms
tr
−
0.55
−
ms
ts
−
2.5
−
ms
tf
−
2.5
−
ms
SWITCHING CHARACTERISTICS
Resistive Load (See Figure 1)
Delay Time
Rise Time
Storage Time
(VCC = 30 V, IC = 5.0 A,
IB = 20 mA, Duty Cycle v 2.0%,
IB1 = IB2, RC & RB Varied, TJ = 25_C)
Fall Time
2. Pulse Test: Pulse Width = 300 ms, Duty Cycle v 2.0%.
10
VCC
-30 V
RB & RC VARIED TO OBTAIN DESIRED CURRENT LEVELS
D1, MUST BE FAST RECOVERY TYPE, eg:
1N5825 USED ABOVE IB ≈ 100 mA
MSD6100 USED BELOW IB ≈ 100 mA
RC
ts
SCOPE
t, TIME (s)
μ
TUT
V2
approx
+12 V
RB
51
0
V1
appox.
-8.0 V
D1
≈ 8.0 k
PNP
NPN
5.0
≈ 40
2.0
tf
1.0
tr
0.5
+4.0 V
25 ms
tr, tf ≤ 10 ns
DUTY CYCLE = 1.0%
td @ VBE(off) = 0
0.2
for td and tr, D1 is disconnected
and V2 = 0
0.1
0.2
For NPN test circuit reverse diode and voltage polarities.
Figure 1. Switching Times Test Circuit
0.5
1.0
3.0
5.0
IC, COLLECTOR CURRENT (AMP)
Figure 2. Switching Times
http://onsemi.com
3
VCC = 30 V
IC/IB = 250
IB1 = IB2
TJ = 25°C
10
20
TIP140, TIP141, TIP142, (NPN); TIP145, TIP146, TIP147, (PNP)
TYPICAL CHARACTERISTICS
NPN
TIP140, TIP141, TIP142
PNP
TIP145, TIP146, TIP147
20,000
TJ = 150°C
TJ = 150°C
100°C
25°C
2000
-55°C
1000
500
100°C
10,000
hFE , DC CURRENT GAIN
hFE , DC CURRENT GAIN
5000
7000
25°C
5000
-55°C
3000
2000
VCE = 4.0 V
300
0.5
VCE = 4.0 V
1.0
2.0
3.0 4.0 5.0
IC, COLLECTOR CURRENT (AMPS)
7.0
1000
0.5
10
0.7
1.0
2.0
3.0 4.0 5.0
IC, COLLECTOR CURRENT (AMPS)
7.0
10
VCE(SAT) , COLLECTOR-EMITTER SATURATION VOLTAGE (VOLTS)
VCE(SAT) , COLLECTOR-EMITTER SATURATION VOLTAGE (VOLTS)
Figure 3. DC Current Gain versus Collector Current
5.0
3.0
2.0
IC = 10 A, IB = 4.0 mA
IC = 5.0 A, IB = 10 mA
1.0
IC = 1.0 A, IB = 2.0 mA
0.7
0.5
-75
-50
-25
0
25
50
75 100 125
TJ, JUNCTION TEMPERATURE (°C)
150
175
5.0
3.0
2.0
IC = 10 A, IB = 4.0 mA
IC = 5.0 A, IB = 10 mA
1.0
IC = 1.0 A, IB = 2.0 mA
0.7
0.5
-75 -50
-25
0
25 50
75 100 125
TJ, JUNCTION TEMPERATURE (°C)
150
175
4.0
3.6
VBE, BASE-EMITTER VOLTAGE (VOLTS)
VBE, BASE-EMITTER VOLTAGE (VOLTS)
Figure 4. Collector−Emitter Saturation Voltage
VCE = 4.0 V
3.2
2.8
2.4
IC = 10 A
2.0
1.6
5.0 A
1.2
0.8
-75
1.0 A
-25
25
75
125
4.0
3.6
3.2
2.8
2.4
IC = 10 A
2.0
1.6
5.0 A
1.2
0.8
-75
175
VCE = 4.0 V
1.0 A
-25
25
75
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 5. Base−Emitter Voltage
http://onsemi.com
4
125
175
TIP140, TIP141, TIP142, (NPN); TIP145, TIP146, TIP147, (PNP)
ACTIVE−REGION SAFE OPERATING AREA
There are two limitations on the power handling ability of
a transistor: average junction temperature and second
breakdown. Safe operating area curves indicate IC − VCE
limits of the transistor that must be observed for reliable
operation; i.e., the transistor must not be subjected to greater
dissipation than the curves indicate.
The data of Figure 6 is based on TJ(pk) = 150_C; TC is
variable depending on conditions. At high case
temperatures, thermal limitations will reduce the power that
can be handled to values less than the limitations imposed by
second breakdown.
IC, COLLECTOR CURRENT (AMPS)
IC, COLLECTOR CURRENT (AMP) (mA)
20
10
7.0
5.0
3.0
2.0
dc
TJ = 150°C
SECONDARY BREAKDOWN LIMIT
BONDING WIRE LIMIT
THERMAL LIMITATION @ TC = 25°C
1.0
TIP140, 145
TIP141, 146
TIP142, 147
30
50
20
15
70
VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)
0.2
10
15
10
7.0
5.0
100 mJ
2.0
1.0
0.5 1.0
2.0
5.0
10 20
L, UNCLAMPED INDUCTIVE LOAD (mH)
100
Figure 6. Active−Region Safe Operating Area
Figure 7. Unclamped Inductive Load
VCE MONITOR
INPUT
VOLTAGE
COLLECTOR
CURRENT
MPS-U52
100 mH
RBB1
INPUT
50
TUT
1.5k
50
VCC = 20 V
IC
MONITOR
RBB2
= 100
VBB2 = 0
VBB1 = 10 V
50
RS = 0.1
w ≈ 7.0 ms (SEE NOTE 1)
5.0 V
0
100 ms
0
1.42 A
VCE(sat)
-20 V
COLLECTOR
VOLTAGE
V(BR)CER
TEST CIRCUIT
NOTE 1: Input pulse width is increased until ICM = 1.42 A.
NOTE 2: For NPN test circuit reverse polarities.
VOLTAGE AND CURRENT WAVEFORMS
Figure 8. Inductive Load
http://onsemi.com
5
100
hfe , SMALL-SIGNAL FORWARD CURRENT
TRANSFER RATIO
TIP140, TIP141, TIP142, (NPN); TIP145, TIP146, TIP147, (PNP)
100
70
50
VCE = 10 V
IC = 1.0 A
TJ = 25°C
PNP
PNP
NPN
20
10
7.0
5.0
NPN
2.0
1.0
1.0
2.0
3.0
5.0
f, FREQUENCY (MHz)
7.0
10
Figure 9. Magnitude of Common Emitter
Small−Signal Short−Circuit Forward
Current Transfer Ratio
PD, POWER DISSIPATION (WATTS)
5.0
4.0
3.0
2.0
1.0
0
0
40
80
120
160
TA, FREE-AIR TEMPERATURE (°C)
200
Figure 10. Free−Air Temperature Power Derating
http://onsemi.com
6
TIP140, TIP141, TIP142, (NPN); TIP145, TIP146, TIP147, (PNP)
PACKAGE DIMENSIONS
SOT−93 (TO−218)
CASE 340D−02
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
C
Q
B
U
DIM
A
B
C
D
E
G
H
J
K
L
Q
S
U
V
4
A
L
S
E
1
K
2
3
J
H
D
MILLIMETERS
MIN
MAX
--20.35
14.70
15.20
4.70
4.90
1.10
1.30
1.17
1.37
5.40
5.55
2.00
3.00
0.50
0.78
31.00 REF
--16.20
4.00
4.10
17.80
18.20
4.00 REF
1.75 REF
STYLE 1:
PIN 1.
2.
3.
4.
V
G
INCHES
MIN
MAX
--0.801
0.579
0.598
0.185
0.193
0.043
0.051
0.046
0.054
0.213
0.219
0.079
0.118
0.020
0.031
1.220 REF
--0.638
0.158
0.161
0.701
0.717
0.157 REF
0.069
BASE
COLLECTOR
EMITTER
COLLECTOR
TO−247
CASE 340L−02
ISSUE F
−T−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
C
−B−
E
U
N
L
4
A
−Q−
1
2
0.63 (0.025)
3
P
−Y−
K
F 2 PL
W
J
D 3 PL
0.25 (0.010)
M
Y Q
T B
M
STYLE 3:
PIN 1.
2.
3.
4.
H
G
M
DIM
A
B
C
D
E
F
G
H
J
K
L
N
P
Q
U
W
S
http://onsemi.com
7
MILLIMETERS
MIN
MAX
20.32
21.08
15.75
16.26
4.70
5.30
1.00
1.40
1.90
2.60
1.65
2.13
5.45 BSC
1.50
2.49
0.40
0.80
19.81
20.83
5.40
6.20
4.32
5.49
--4.50
3.55
3.65
6.15 BSC
2.87
3.12
BASE
COLLECTOR
EMITTER
COLLECTOR
INCHES
MIN
MAX
0.800
8.30
0.620
0.640
0.185
0.209
0.040
0.055
0.075
0.102
0.065
0.084
0.215 BSC
0.059
0.098
0.016
0.031
0.780
0.820
0.212
0.244
0.170
0.216
--0.177
0.140
0.144
0.242 BSC
0.113
0.123
TIP140, TIP141, TIP142, (NPN); TIP145, TIP146, TIP147, (PNP)
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
http://onsemi.com
8
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
TIP140/D