MSRD620CTG, MSRD620CTT4G, SSRD8620CTT4G SWITCHMODE Soft Ultrafast Recovery Power Rectifier http://onsemi.com Plastic DPAK Package State−of−the−art geometry features epitaxial construction with glass passivation and metal overlay contact. Ideally suited for low voltage, high frequency switching power supplies, free wheeling diode and polarity protection diodes. SOFT ULTRAFAST RECTIFIER 6.0 AMPERES, 200 VOLTS Features Soft Ultrafast Recovery (35 ns typ) Highly Stable Oxide Passivated Junction Matched Dual Die Construction − May Be Paralleled for High Current Output Short Heat Sink Tab Manufactured − Not Sheared Epoxy Meets UL 94 V−0 @ 0.125 in. AEC−Q101 Qualified and PPAP Capable SSRD8 Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements These Devices are Pb−Free and are RoHS Compliant* DPAK CASE 369C 1 2, 4 3 MARKING DIAGRAM AYWW S 620TG Mechanical Characteristics Case: Epoxy, Molded Weight: 0.4 Grams (Approximately) Finish: All External Surfaces Corrosion Resistant and Terminal Lead and Mounting Surface Temperature for Soldering Purposes: A Y WW G ORDERING INFORMATION Leads are Readily Solderable 260C Max. for 10 Seconds ESD Ratings: Machine Model = C Human Body Model = 2 = Assembly Location = Year = Work Week = Pb−Free Package Package Shipping† MSRD620CTG DPAK (Pb−Free) 75 Units/Rail MSRD620CTT4G DPAK (Pb−Free) 2,500 / Tape & Reel SSRD8620CTT4G DPAK (Pb−Free) 2,500 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2012 January, 2012 − Rev. 7 1 Publication Order Number: MSRD620CT/D MSRD620CTG, MSRD620CTT4G, SSRD8620CTT4G MAXIMUM RATINGS Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Symbol Value Unit VRRM VRWM VR 200 V Average Rectified Forward Current (At Rated VR, TC = 137C) Per Leg Per Package IO A 3.0 6.0 Peak Repetitive Forward Current (At Rated VR, Square Wave, 20 kHz, TC = 138C) Per Leg IFRM Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions, Halfwave, Single Phase, 60 Hz) Per Package IFSM A 6.0 Storage / Operating Case Temperature A 50 Tstg, Tc −55 to +175 C Operating Junction Temperature TJ −55 to +175 C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. THERMAL CHARACTERISTICS Rating Symbol Thermal Resistance − Junction−to−Case Per Leg RqJC Thermal Resistance − Junction−to−Ambient Per Leg RqJA Value Unit C/W 9.0 C/W 80 ELECTRICAL CHARACTERISTICS Rating Symbol VF Maximum Instantaneous Forward Voltage (Note 1) (See Figure 2) Per Leg (IF = 3.0 A) (IF = 6.0 A) IR Maximum Instantaneous Reverse Current (See Figure 4) Per Leg (VR = 200 V) (VR = 100 V) Maximum Reverse Recovery Time (Note 2) Per Leg (VR = 30 V, IF = 1.0 A, di/dt = 50 A/ms) (VR = 30 V, IF = 3.0 A, di/dt = 50 A/ms) trr Maximum Peak Reverse Recovery Current Per Leg (VR = 30 V, IF = 1.0 A, di/dt = 50 A/ms) (VR = 30 V, IF = 3.0 A, di/dt = 50 A/ms) IRM Value Unit TJ = 25C TJ = 150C 1.15 1.35 1.05 1.30 TJ = 25C TJ = 150C 5.0 2.0 200 100 V mA ns 45 55 A 2.0 3.0 1. Pulse Test: Pulse Width 250 ms, Duty Cycle 2%. 2. trr measured projecting from 25% of IRM to ground. http://onsemi.com 2 IF, INSTANTANEOUS FORWARD CURRENT (AMPS) IF, INSTANTANEOUS FORWARD CURRENT (AMPS) MSRD620CTG, MSRD620CTT4G, SSRD8620CTT4G 100 10 TJ = 175C 150C 1.0 100C 25C 0.1 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 TJ = 175C 150C 1.0 25C 0.1 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage, Per Leg Figure 2. Maximum Forward Voltage, Per Leg 1E-3 IR , MAXIMUM REVERSE CURRENT (AMPS) TJ = 175C IR , REVERSE CURRENT (AMPS) 10 VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) 100E-6 10E-6 150C 1E-6 25C 100E-9 10E-9 1E-9 0 20 40 60 80 100 120 140 160 10E-6 25C 1E-6 100E-9 10E-9 0 20 40 60 80 100 120 140 160 180 200 VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS) Figure 4. Maximum Reverse Current, Per Leg RATED VOLTAGE APPLIED FREQUENCY = 20 kHz RqJC = 9C/W TJ = 175C dc 4.0 SQUARE WAVE SINE WAVE 2.5 2.0 1.5 1.0 0.5 0 100 150C Figure 3. Typical Reverse Current, Per Leg 4.5 3.0 100E-6 180 200 5.0 3.5 TJ = 175C IF(AV) , AVERAGE FORWARD CURRENT (AMPS) IF(AV) , AVERAGE FORWARD CURRENT (AMPS) 100 110 120 130 140 150 160 170 180 2.5 2.0 RATED VOLTAGE APPLIED FREQUENCY = 20 kHz RqJA = 80C/W TJ = 175C SQUARE WAVE dc 1.5 SINE WAVE 1.0 0.5 0 25 TC, CASE TEMPERATURE (C) 45 65 85 105 125 145 165 185 TA, AMBIENT TEMPERATURE (C) Figure 5. Current Derating, Case (Per Leg) Figure 6. Current Derating, Ambient (Per Leg) http://onsemi.com 3 MSRD620CTG, MSRD620CTT4G, SSRD8620CTT4G 100 C, CAPACITANCE (pF) TJ = 25C 10 1.0 0 20 40 60 80 100 120 160 140 180 200 VR, REVERSE VOLTAGE (VOLTS) R(t) EFFECTIVE TRANSIENT THERMAL RESISTANCE (NORMALIZE Figure 7. Typical Capacitance (Per Leg) 1.0E+00 1.0E-01 1.0E-02 1.0E-03 1.0E-04 0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 1000 10000 t, TIME (s) Figure 8. Transient Thermal Response (RqJA) R(t) EFFECTIVE TRANSIENT THERMAL RESISTANCE (NORMALIZED) 1.0E+00 1.0E-01 1.0E-02 0.00001 0.0001 0.001 0.01 0.1 t, TIME (s) Figure 9. Transient Thermal Response (RqJC) http://onsemi.com 4 1.0 10 100 MSRD620CTG, MSRD620CTT4G, SSRD8620CTT4G PACKAGE DIMENSIONS DPAK (SINGLE GAUGE) CASE 369C−01 ISSUE D A E b3 c2 B Z D 1 L4 A 4 L3 b2 e 2 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. THERMAL PAD CONTOUR OPTIONAL WITHIN DIMENSIONS b3, L3 and Z. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.006 INCHES PER SIDE. 5. DIMENSIONS D AND E ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY. 6. DATUMS A AND B ARE DETERMINED AT DATUM PLANE H. C H DETAIL A 3 c b 0.005 (0.13) M H C L2 GAUGE PLANE C L SEATING PLANE A1 L1 DETAIL A ROTATED 905 CW DIM A A1 b b2 b3 c c2 D E e H L L1 L2 L3 L4 Z INCHES MIN MAX 0.086 0.094 0.000 0.005 0.025 0.035 0.030 0.045 0.180 0.215 0.018 0.024 0.018 0.024 0.235 0.245 0.250 0.265 0.090 BSC 0.370 0.410 0.055 0.070 0.108 REF 0.020 BSC 0.035 0.050 −−− 0.040 0.155 −−− MILLIMETERS MIN MAX 2.18 2.38 0.00 0.13 0.63 0.89 0.76 1.14 4.57 5.46 0.46 0.61 0.46 0.61 5.97 6.22 6.35 6.73 2.29 BSC 9.40 10.41 1.40 1.78 2.74 REF 0.51 BSC 0.89 1.27 −−− 1.01 3.93 −−− SOLDERING FOOTPRINT* 6.20 0.244 2.58 0.102 5.80 0.228 3.00 0.118 1.60 0.063 6.17 0.243 SCALE 3:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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