ONSEMI MBRD1035CTLT4

MBRD1035CTL
SWITCHMODE
Schottky Power Rectifier
DPAK Power Surface Mount Package
The MBRD1035CTL employs the Schottky Barrier principle in a
large area metal−to−silicon power diode. State of the art geometry
features epitaxial construction with oxide passivation and metal
overlay contact. Ideally suited for low voltage, high frequency
switching power supplies, free wheeling diode and polarity protection
diodes.
Features
• Highly Stable Oxide Passivated Junction
• Guardring for Stress Protection
• Matched Dual Die Construction −
•
•
•
•
•
SCHOTTKY BARRIER
RECTIFIER
10 AMPERES
35 VOLTS
1
4
May be Paralleled for High Current Output
High dv/dt Capability
Short Heat Sink Tap Manufactured − Not Sheared
Very Low Forward Voltage Drop
Epoxy Meets UL 94 V−0 @ 0.125 in
Pb−Free Packages are Available
3
4
1 2
Mechanical Characteristics:
• Case: Epoxy, Molded
• Weight: 0.4 Gram (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
•
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Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
3
DPAK
CASE 369C
MARKING DIAGRAM
YWW
B10
35CLG
Y
WW
B1035CL
G
= Year
= Work Week
= Device Code
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2010
July, 2010 − Rev. 7
1
Publication Order Number:
MBRD1035CTL/D
MBRD1035CTL
MAXIMUM RATINGS
Rating
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current
(At Rated VR, TC = 115°C)
Per Leg
Per Package
Peak Repetitive Forward Current
(At Rated VR, Square Wave, 20 kHz, TC = 115°C)
Per Leg
Non−Repetitive Peak Surge Current
Per Package
(Surge applied at rated load conditions, halfwave, single phase, 60 Hz)
Storage / Operating Case Temperature
Operating Junction Temperature (Note 1)
Voltage Rate of Change (Rated VR, TJ = 25°C)
Symbol
Value
Unit
VRRM
VRWM
VR
35
V
IO
5.0
10
A
IFRM
10
A
IFSM
50
A
Tstg, Tc
−55 to +150
°C
TJ
−55 to +150
°C
dv/dt
10,000
V/ms
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/RqJA.
THERMAL CHARACTERISTICS
Thermal Resistance, Junction−to−Case
Per Leg
RqJC
3.0
°C/W
Thermal Resistance, Junction−to−Ambient (Note 2)
Per Leg
RqJA
137
°C/W
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 3)
(See Figure 2)
IF = 5 Amps, TJ = 25°C
IF = 5 Amps, TJ = 100°C
IF = 10 Amps, TJ = 25°C
IF = 10 Amps, TJ = 100°C
Maximum Instantaneous Reverse Current (Note 3)
(See Figure 4)
(VR = 35 V, TJ = 25°C)
(VR = 35 V, TJ = 100°C)
(VR = 17.5 V, TJ = 25°C)
(VR = 17.5 V, TJ = 100°C)
Per Leg
Per Leg
VF
V
0.47
0.41
0.56
0.55
IR
mA
2.0
30
0.20
5.0
2. Rating applies when using minimum pad size, FR4 PC Board
3. Pulse Test: Pulse Width ≤ 250 ms, Duty Cycle ≤ 2.0%
ORDERING INFORMATION
Package
Shipping†
DPAK
75 Units / Rail
MBRD1035CTLG
DPAK
(Pb−Free)
75 Units / Rail
MBRD1035CTLT4
DPAK
2500 Units / Tape & Reel
DPAK
(Pb−Free)
2500 Units / Tape & Reel
Device
MBRD1035CTL
MBRD1035CTLT4G
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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2
MBRD1035CTL
I F, INSTANTANEOUS FORWARD CURRENT (AMPS)
I F, INSTANTANEOUS FORWARD CURRENT (AMPS)
TYPICAL CHARACTERISTICS
100
TJ = 125°C
10
TJ = 100°C
TJ = 25°C
TJ = - 40°C
1.0
0.1
0.10
0.30
0.50
0.70
0.90
1.10
100
TJ = 125°C
10
TJ = 25°C
1.0
TJ = 100°C
0.1
0.10
Figure 1. Typical Forward Voltage Per Leg
I R , MAXIMUM REVERSE CURRENT (AMPS)
I R , REVERSE CURRENT (AMPS)
0.50
0.70
1.10
0.90
Figure 2. Maximum Forward Voltage Per Leg
1E+0
100E-3
1E+0
100E-3
TJ = 125°C
10E-3
1E-3
TJ = 100°C
100E-6
TJ = 25°C
0
10
20
VR, REVERSE VOLTAGE (VOLTS)
TJ = 125°C
10E-3
TJ = 100°C
1E-3
100E-6
10E-6
1E-6
0.30
VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
30
35
Figure 3. Typical Reverse Current Per Leg
TJ = 25°C
10E-6
1E-6
0
10
20
VR, REVERSE VOLTAGE (VOLTS)
30
Figure 4. Maximum Reverse Current Per Leg
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3
35
PFO , AVERAGE POWER DISSIPATION (WATTS)
I O , AVERAGE FORWARD CURRENT (AMPS)
MBRD1035CTL
8.0
dc
7.0
SQUARE WAVE
(50% DUTY CYCLE)
6.0
5.0
Ipk/Io = p
4.0
Ipk/Io = 5
3.0
Ipk/Io = 10
2.0
Ipk/Io = 20
1.0
freq = 20 kHz
0
20
40
60
80
100
120
dc
Ipk/Io = p
2.5
Ipk/Io = 5
2.0
Ipk/Io = 10
1.5
Ipk/Io = 20
1.0
0.5
0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
TL, LEAD TEMPERATURE (°C)
IO, AVERAGE FORWARD CURRENT (AMPS)
Figure 5. Current Derating Per Leg
Figure 6. Forward Power Dissipation Per Leg
TJ = 25°C
C, CAPACITANCE (pF)
3.0
0
1000
100
10
0
SQUARE WAVE
(50% DUTY CYCLE)
3.5
140
TJ , DERATED OPERATING TEMPERATURE ( ° C)
0
4.0
5
10
15
20
125
RqJA = 2.43°C/W
115
RqJA = 25°C/W
105
RqJA = 48°C/W
95
RqJA = 67.5°C/W
85
RqJA = 84°C/W
75
65
0
25
8.0
5
10
15
20
25
30
35
VR, DC REVERSE VOLTAGE (VOLTS)
VR, REVERSE VOLTAGE (VOLTS)
Figure 7. Capacitance Per Leg
Figure 8. Typical Operating Temperature
Derating Per Leg *
* Reverse power dissipation and the possibility of thermal runaway must be considered when operating this device under any
reverse voltage conditions. Calculations of TJ therefore must include forward and reverse power effects. The allowable operating
TJ may be calculated from the equation:
TJ = TJmax − r(t)(Pf + Pr) where
r(t) = thermal impedance under given conditions,
Pf = forward power dissipation, and
Pr = reverse power dissipation
This graph displays the derated allowable TJ due to reverse bias under DC conditions only and is calculated as TJ = TJmax − r(t)Pr,
where r(t) = Rthja. For other power applications further calculations must be performed.
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4
r (t) , TRANSIENT THERMAL RESISTANCE (NORMALIZED)
MBRD1035CTL
1.0
50%(DUTY CYCLE)
20%
10%
0.1 5.0%
2.0%
1.0%
SINGLE PULSE
0.01
0.00001
Rtjl(t) = Rtjl • r(t)
0.0001
0.001
0.01
0.1
10
1.0
100
1000
t, TIME (s)
r (t), TRANSIENT THERMAL RESISTANCE (NORMALIZED)
Figure 9. Thermal Response Junction to Case (Per Leg)
1.0E+00
50% (DUTY CYCLE)
20%
1.0E-01
1.0E-02
10%
5.0%
2.0%
1.0%
1.0E-03
SINGLE PULSE
1.0E-04
0.00001
0.0001
Rtjl(t) = Rtjl • r(t)
0.001
0.01
0.1
1.0
10
t, TIME (s)
Figure 10. Thermal Response Junction to Ambient (Per Leg)
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5
100
1000
10000
MBRD1035CTL
PACKAGE DIMENSIONS
DPAK (SINGLE GAUGE)
CASE 369C−01
ISSUE D
A
E
b3
c2
B
Z
D
1
L4
A
4
L3
b2
e
2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN
DIMENSIONS b3, L3 and Z.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
5. DIMENSIONS D AND E ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
C
H
DETAIL A
3
c
b
0.005 (0.13)
M
H
C
L2
GAUGE
PLANE
C
L
SEATING
PLANE
A1
L1
DETAIL A
ROTATED 905 CW
DIM
A
A1
b
b2
b3
c
c2
D
E
e
H
L
L1
L2
L3
L4
Z
INCHES
MIN
MAX
0.086 0.094
0.000 0.005
0.025 0.035
0.030 0.045
0.180 0.215
0.018 0.024
0.018 0.024
0.235 0.245
0.250 0.265
0.090 BSC
0.370 0.410
0.055 0.070
0.108 REF
0.020 BSC
0.035 0.050
−−− 0.040
0.155
−−−
MILLIMETERS
MIN
MAX
2.18
2.38
0.00
0.13
0.63
0.89
0.76
1.14
4.57
5.46
0.46
0.61
0.46
0.61
5.97
6.22
6.35
6.73
2.29 BSC
9.40 10.41
1.40
1.78
2.74 REF
0.51 BSC
0.89
1.27
−−−
1.01
3.93
−−−
SOLDERING FOOTPRINT*
6.20
0.244
2.58
0.102
5.80
0.228
3.00
0.118
1.60
0.063
6.17
0.243
SCALE 3:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent
rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.
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6
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For additional information, please contact your local
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MBRD1035CTLD