CSPEMI201AG 2 Channel Headset Speaker EMI Filter with ESD Protection Product Description Features • Two Channels of EMI Filtering • Pi−Style EMI Filters in a Capacitor−Resistor−Capacitor (C−R−C) • • • • • • • Network Greater than 40 dB Attenuation at 1 GHz ±8 kV ESD Protection on each Channel (IEC 61000−4−2 Level 4, Contact Discharge) ±15 kV ESD Protection in each Channel (HBM) Supports AC Signals − Ideal for Audio Applications Extremely Low Lead Inductance for Optimum Filter and ESD Performance 5−Bump, 0.930 x 1.410 mm Footprint Chip Scale Package (CSP) These Devices are Pb−Free and are RoHS Compliant Applications • • • • • • • EMI Filtering and ESD Protection for Headset Speaker Ports Wireless Handsets Handheld PCs / PDAs MP3 Players Digital Camcorders Notebooks Desktop PCs © Semiconductor Components Industries, LLC, 2011 May, 2011 − Rev. 4 1 http://onsemi.com WLCSP5 AG SUFFIX CASE 567AZ C1 100 pF 100 pF 10 W A3 C3 100 pF 100 pF SPKR_OUT1 10 W A1 SPKR_OUT2 SPKR_IN2 SPKR_IN1 ELECTRICAL SCHEMATIC GND The CSPEMI201AG is a dual low−pass filter array integrating two pi−style filters (C−R−C) that reduce EMI/RFI emissions while at the same time providing ESD protection. This part is custom−designed to interface with a speaker port on a cellular telephone or similar device. Each high quality filter provides more than 35 dB attenuation in the 800−2700 MHz range. These pi−style filters support bidirectional filtering, controlling EMI both to and from a speaker element. They also support bipolar signals with a cutoff frequency of 31 MHz, enabling audio signals to pass through without distortion. In addition, the CSPEMI201AG provides a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The CSPEMI201AG can safely dissipate ESD strikes of ±8 kV, the maximum requirement of the IEC 61000−4−2 international standard. Using the MIL−STD−883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than ±15 kV. The CSPEMI201AG is particularly well−suited for portable electronics (e.g. cellular telephones, PDAs, notebook computers) because of its small package and low weight. The CSPEMI201AG is available in a space−saving, low−profile Chip Scale Package with RoHS compliant lead−free finishing. B2 MARKING DIAGRAM + AB AB = CSPEMI201AG ORDERING INFORMATION Device Package Shipping† CSPEMI201AG CSP−5 (Pb−Free) 3500/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Publication Order Number: CSPEMI201AG/D CSPEMI201AG PACKAGE / PINOUT DIAGRAMS Table 1. PIN DESCRIPTIONS 5−bump CSP Package Top View (Bumps Down View) Pin Name Description A1 SPKR_IN1 Speaker Input 1 (from audio circuitry) A3 SPKR_IN2 Speaker Input 2 (from audio circuitry) B2 GND Orientation Marking Device Ground A C1 SPKR_OUT1 Speaker Output 1 (to speaker) B C3 SPKR_OUT1 Speaker Output 2 (to speaker) + Bottom View (Pins Up View) 1 2 3 Pin “A1” Marking C1 C3 B2 A1 C A1 A3 CSPEMI201A CSP Package SPECIFICATIONS Table 2. ABSOLUTE MAXIMUM RATINGS Parameter Rating Units −65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 200 mW Storage Temperature Range Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 3. STANDARD OPERATING CONDITIONS Parameter Operating Temperature Range Rating Units −40 to +85 °C Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol Parameter Conditions Min Typ Max Units R Resistance 9 10 11 W C Capacitance 80 100 120 pF 1.0 mA ILEAK Diode Leakage Current VIN = 5.0 V VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10 mA VESD In−system ESD Withstand Voltage a) Human Body Model, MIL−STD−883, Method 3015 b) Contact Discharge per IEC 61000−4−2 Level 4 (Note 2) Clamping Voltage during ESD Discharge MIL−STD−883 (Method 3015), 8 kV Positive Transients Negative Transients (Notes 2 and 3) Cut−off frequency ZSOURCE = 50 W, ZLOAD = 50 W R = 10 W, C = 100 pF VCL fC 5 −15 7 −10 15 −5 V kV ±15 ±8 V +15 −19 31 MHz 1. TA = 25°C unless otherwise specified. 2. ESD applied to input and output pins with respect to GND, one at a time. 3. Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. http://onsemi.com 2 CSPEMI201AG PERFORMANCE INFORMATION Typical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment) Figure 1. Insertion Loss vs. Frequency (A1−C1 to GND B2) Figure 2. Insertion Loss vs. Frequency (A3−C3 to GND B2) http://onsemi.com 3 CSPEMI201AG APPLICATION INFORMATION Parameter Value Pad Size on PCB 0.240 mm Pad Shape Round Pad Definition Non−Solder Mask defined pads Solder Mask Opening 0.290 mm Round Solder Stencil Thickness 0.125 mm − 0.150 mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300 mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance − Edge To Corner Ball ±50 mm Solder Ball Side Coplanarity ±20 mm Maximum Dwell Time Above Liquidous 60 seconds Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste 260°C Non−Solder Mask Defined Pad 0.240 mm DIA. Solder Stencil Opening 0.300 mm DIA. Solder Mask Opening 0.290 mm DIA. Figure 3. Recommended Non−Solder Mask Defined Pad Illustration Temperature (5C) 250 200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 4. Lead−free (SnAgCu) Solder Ball Reflow Profile http://onsemi.com 4 CSPEMI201AG PACKAGE DIMENSIONS WLCSP5, 0.94x1.41 CASE 567AZ−01 ISSUE O D 2X A ÈÈ PIN A1 REFERENCE B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. E DIM A A1 A2 b D E eD eE 0.05 C 2X 0.05 C TOP VIEW A2 ÉÉÉ OptiGuard Option 0.05 C A RECOMMENDED SOLDERING FOOTPRINT* 0.05 C NOTE 3 A1 SIDE VIEW C SEATING PLANE A1 eD/2 5X 0.05 C A B 0.03 C PACKAGE OUTLINE 0.87 eD b MILLIMETERS MIN MAX 0.72 0.56 0.21 0.27 0.40 REF 0.29 0.35 0.94 BSC 1.41 BSC 0.50 BSC 0.435 BSC eE C 0.44 0.25 0.50 B A 5X 0.25 DIMENSIONS: MILLIMETERS 1 2 3 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. BOTTOM VIEW ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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