2 Channel Headset Speaker EMI Filter with ESD Protection CSPEMI201AG Features Product Description • • The CSPEMI201AG is a dual low-pass filter array integrating two pi-style filters (C-R-C) that reduce EMI/RFI emissions while at the same time providing ESD protection. This part is custom-designed to interface with a speaker port on a cellular telephone or similar device. Each high quality filter provides more than 35dB attenuation in the 800-2700 MHz range. These pi-style filters support bidirectional filtering, controlling EMI both to and from a speaker element. They also support bipolar signals with a cutoff frequency of 31MHz, enabling audio signals to pass through without distortion. • • • • • • • Two channels of EMI filtering Pi-style EMI filters in a capacitor-resistorcapacitor (C-R-C) network Greater than 40dB attenuation at 1GHz +8kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) +15kV ESD protection in each channel (HBM) Supports AC signals—ideal for audio applications Extremely low lead inductance for optimum filter and ESD performance 5-bump, 0.930mm X 1.410mm footprint Chip Scale Package (CSP) RoHS compliant (lead-free) finishing Applications • • • • • • • EMI filtering and ESD protection for headset speaker ports Wireless Handsets Handheld PCs / PDAs MP3 Players Digital Camcorders Notebooks Desktop PCs In addition, the CSPEMI201AG provides a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The CSPEMI201AG can safely dissipate ESD strikes of +8kV, the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than +15kV. The CSPEMI201AG is particularly well-suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package and low weight. The CSPEMI201AG is available in a space-saving, low-profile Chip Scale Package with RoHS compliant lead-free finishing. ©2010 SCILLC. All rights reserved. April 2010 Rev. 3 Publication Order Number: CSPEMI201AG/D CSPEMI201AG Electrical Schematic Rev. 3 | Page 2 of 9 | www.onsemi.com CSPEMI201AG PIN DESCRIPTIONS PIN NAME DESCRIPTION A1 SPKR_IN1 Speaker Input 1 (from audio circuitry) A3 SPKR_IN2 Speaker Input 2 (from audio circuitry) B2 GND C1 SPKR_OUT1 Speaker Output 1 (to speaker) C3 SPKR_OUT2 Speaker Output 2 (to speaker) Device Ground Ordering Information PART NUMBERING INFORMATION Pins Package Ordering Part Number1 Part Marking 5 CSP CSPEMI201AGG AB Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Rev. 3 | Page 3 of 9 | www.onsemi.com CSPEMI201AG Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS -65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 200 mW RATING UNITS -40 to +85 °C Storage Temperature Range STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range Rev. 3 | Page 4 of 9 | www.onsemi.com CSPEMI201AG ELECTRICAL OPERATING CHARACTERISTICS1 SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS R Resistance 9 10 11 Ω C Capacitance 80 100 120 pF 1.0 μA 15 -5 V V ILEAK Diode Leakage Current VIN=5.0V VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10mA In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Note 2 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Notes 2 and 3 Cut-off frequency ZSOURCE = 50Ω, ZLOAD = 50Ω R = 10Ω, C = 100pF VESD VCL fC 5 -15 7 -10 ±15 kV ±8 kV +15 -19 V V 31 MHz Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Rev. 3 | Page 5 of 9 | www.onsemi.com CSPEMI201AG Performance Information Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 1. Insertion Loss VS. Frequency (A1-C1 to GND B2) Figure 2. Insertion Loss VS. Frequency (A3-C3 to GND B2) Rev. 3 | Page 6 of 9 | www.onsemi.com CSPEMI201AG Application Information PARAMETER VALUE Pad Size on PCB 0.240mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.290mm Round Solder Stencil Thickness 0.125mm - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50μm Solder Ball Side Coplanarity +20μm Maximum Dwell Time Above Liquidous 60 seconds Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste Non-Solder Mask Defined Pad 0.240mm DIA. Solder Stencil Opening 0.300mm DIA. Solder Mask Opening 0.290mm DIA. Figure 8. Recommended Non-Solder Mask Defined Pad Illustration Figure 9. Lead-free (SnAgCu) Solder Ball Reflow Profile Rev. 3 | Page 7 of 9 | www.onsemi.com 260°C CSPEMI201AG Mechanical Details CSP Mechanical Specifications The CSPEMI201AG is available in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CSP, see the California Micro Devices CSP Package Information document. PACKAGE DIMENSIONS Package Custom CSP Bumps 5 Millimeters Inches Dim Min Nom Max Min Nom Max BOTTOM VIEW A1 A1 0.885 0.930 0.975 0.0348 0.0366 0.0384 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.165 0.215 0.265 0.0065 0.0085 0.0104 C2 0.220 0.270 0.320 0.0087 0.0106 0.0126 D1 0.562 0.606 0.650 0.0221 0.0239 0.0256 D2 0.356 0.381 0.406 0.0140 0.0150 0.0160 C A2 1.365 1.410 1.455 0.0537 0.0555 0.0573 B4 B3 A2 SIDE VIEW C1 B2 B1 B A 1 2 3 C2 # per tape and reel D1 0.30 DIA. 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) D2 SOLDER BUMPS DIMENSIONS IN MILLIMETERS Package Dimensions for CSPEMI201AG Chip Scale Package 3500 pieces Controlling dimension: millimeters Rev. 3 | Page 8 of 9 | www.onsemi.com CSPEMI201AG CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) TAPE WIDTH B0 X A0 X K0 W CSPEMI201AGG 1.41 X 0.93 X 0.606 1.52 X 1.07 X 0.72 + 8mm + REEL DIAMETER QTY PER REEL P0 P1 178mm (7") 3500 4mm 4mm + Figure 5. Tape and Reel Mechanical Data ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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