CSPESD304 4-Channel ESD Array in CSP Product Description The CSPESD304 is a quad ESD transient voltage suppression diode array. Each diode provides a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). These diodes safely dissipate ESD strikes of ±15 kV, exceeding the maximum requirement of the IEC 61000−4−2 international standard. Using the MIL−STD−883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than ±30 kV. The CSPESD304 is particularly well−suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package and low weight. The CSPESD304 is available in a space−saving, low−profile Chip Scale Package with lead−free finishing. http://onsemi.com WLCSP5 CASE 567AY ELECTRICAL SCHEMATIC Features • Four Channels of ESD Protection • ±15 kV ESD Protection on each Channel ESD_1 ESD_2 ESD_3 ESD_4 A1 A3 C1 C3 Optimum ESD Protection GND (IEC 61000−4−2 Level 4, Contact Discharge) • ±30 kV ESD Protection on each Channel (HBM) • Chip Scale Package Features Extremely Low Lead Inductance for B2 • 5−Bump, 0.960 mm x 1.330 mm Footprint Chip Scale Package • (CSP) These Devices are Pb−Free and are RoHS Compliant MARKING DIAGRAM Applications • ESD Protection for Sensitive Electronic Equipment • I/O Port and Keypad and Button Circuitry Protection for Portable E Devices E • Can be Used for EMI Filtering when Combined with External • • • • • • Series Resistance Wireless Handsets Handheld PCs / PDAs MP3 Players Digital Camcorders Notebooks Desktop PCs © Semiconductor Components Industries, LLC, 2011 May, 2011 − Rev. 3 = CSPESD304 ORDERING INFORMATION Device Package Shipping† CSPESD304 CSP−5 (Pb−Free) 3500/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 1 Publication Order Number: CSPESD304/D CSPESD304 PACKAGE / PINOUT DIAGRAMS Table 1. PIN DESCRIPTIONS 5−bump CSP Package Top View (Bumps Down View) Pin Name Description A1 ESD_1 ESD Channel 1 A3 ESD_2 ESD Channel 2 B2 GND Device Ground A C1 ESD_3 ESD Channel 3 B C3 ESD_4 ESD Channel 4 Orientation Marking (see Note) + Bottom View (Pins Up View) 1 2 3 C C1 Orientation Marking C3 B2 A1 A1 A3 CSPESD304 CSP Package Note: Lead−free devices are specified by using a “+” character for the top side orientation mark. SPECIFICATIONS Table 2. ABSOLUTE MAXIMUM RATINGS Parameter Rating Storage Temperature Range DC Package Power Rating Units −65 to +150 °C 200 mW Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 3. STANDARD OPERATING CONDITIONS Parameter Operating Temperature Range Rating Units −40 to +85 °C Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol VDIODE Parameter Conditions Diode Reverse Breakdown Voltage IDIODE = 10 mA ILEAK Diode Leakage Current VIN = 3.3 V, TA = 25°C VSIG Signal Voltage Positive Clamp Negative Clamp IDIODE = 10 mA VESD In−system ESD Withstand Voltage a) Human Body Model, MIL−STD−883, Method 3015 b) Contact Discharge per IEC 61000−4−2 Level 4 (Note 2) Clamping Voltage during ESD Discharge MIL−STD−883 (Method 3015), 8 kV Positive Transients Negative Transients (Note 2) Diode Capacitance At 2.5 VDC Reverse Bias, 1 MHz, 30 mVAC VCL CDIODE Min Typ Max 5.5 V 100 5.6 −0.4 Units 6.8 −0.8 9.0 −1.5 nA V kV ±30 ±15 V +15 −8 1. TA = −40 to +85°C unless otherwise specified. 2. ESD applied to input and output pins with respect to GND, one at a time. http://onsemi.com 2 22 27 32 pF CSPESD304 PERFORMANCE INFORMATION Diode Characteristics (nominal conditions unless specified otherwise) Figure 1. Typical Diode Capacitance vs. Input Voltage (normalized to 2.5 VDC) Figure 2. Frequency Response (single channel vs. GND, in 50 W system) http://onsemi.com 3 CSPESD304 APPLICATION INFORMATION Parameter Value Pad Size on PCB 0.240 mm Pad Shape Round Pad Definition Non−Solder Mask defined pads Solder Mask Opening 0.290 mm Round Solder Stencil Thickness 0.125 mm − 0.150 mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300 mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance − Edge To Corner Ball ±50 mm Solder Ball Side Coplanarity ±20 mm Maximum Dwell Time Above Liquidous 60 seconds Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste 260°C Non−Solder Mask Defined Pad 0.240 mm DIA. Solder Stencil Opening 0.300 mm DIA. Solder Mask Opening 0.290 mm DIA. Figure 3. Recommended Non−Solder Mask Defined Pad Illustration Temperature (5C) 250 200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 4. Lead−free (SnAgCu) Solder Ball Reflow Profile http://onsemi.com 4 CSPESD304 PACKAGE DIMENSIONS WLCSP5, 0.96x1.33 CASE 567AY−01 ISSUE O D 2X A ÈÈ PIN A1 REFERENCE NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. B E DIM A A1 A2 b D E eD eE 0.05 C 2X 0.05 C TOP VIEW A2 ÉÉÉ OptiGuard Option 0.05 C A RECOMMENDED SOLDERING FOOTPRINT* 0.05 C NOTE 3 A1 SIDE VIEW C SEATING PLANE A1 eD/2 5X 0.05 C A B 0.03 C PACKAGE OUTLINE 0.87 eD b MILLIMETERS MIN MAX 0.72 0.56 0.21 0.27 0.40 REF 0.29 0.35 0.96 BSC 1.33 BSC 0.50 BSC 0.435 BSC eE C 0.44 B 0.25 0.50 A 5X 0.25 DIMENSIONS: MILLIMETERS 1 2 3 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. BOTTOM VIEW ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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