NUF2450 2 Line EMI Filter with ESD Protection This device is a 2 line EMI filter array for audio applications. Greater than −30 dB attenuation is obtained at frequencies from 800 MHz to 5.0 GHz. The NUF2450MU has a cut−off frequency of 20 MHz and minimal line resistance, making it ideal for applications requiring low bandpass attenuation. This UDFN package is specifically designed to enhance EMI filtering for low−profile or slim design electronics especially where space and height is a premium. It also offers ESD protection−clamping transients from static discharges. ESD protection is provided across all capacitors. Features • L 1 Cd 8 Cd L 4 • EMI Filtering and ESD Protection • Integration of 10 Discrete Components • Compliance with IEC61000−4−2 (Level 4) • • • http://onsemi.com Cd 5 Cd (Top View) 20 kV (Contact) UDFN Package, 1.2 x 1.8 mm Moisture Sensitivity Level 1 ESD Ratings: Machine Model = C Human Body Model = 3B This is a Pb−Free Device* 8 MARKING DIAGRAM 1 UDFN8 CASE 517AD 24 MG G 1 Benefits • Reduces EMI/RFI Emissions on Audio Lines • Low Profile Package; Typical Height of 0.5 mm • Design−Friendly and Easy−to−Use Pin Configurations, • • • • Particularly for Portable Electronics Integrated Solution Offers Cost and Space Savings in UDFN Package Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass Filter Response Integrated Solution Improves System Reliability Excellent ESD Performance with Large GND Pad 24 = Specific Device Code M = Month Code G = Pb−Free Package (Note: Microdot may be in either location) PIN CONNECTIONS 1 4 GND Applications • Headsets, MP3 Players, and PDAs • Portable DVDs • Hands−Free Interface 8 October, 2011 − Rev. 0 5 ORDERING INFORMATION *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2011 (Bottom View) 1 Device Package Shipping† NUF2450MUT2G UDFN8 (Pb−Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Publication Order Number: NUF2450/D NUF2450 MAXIMUM RATINGS Parameter Symbol ESD Discharge IEC61000−4−2 Value VPP Contact Discharge Machine Model Human Body Model Unit kV 20 1.6 16 Operating Temperature Range TOP −40 to 85 °C Storage Temperature Range TSTG −55 to 150 °C TL 260 °C Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 s) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted) Parameter Symbol Maximum Reverse Working Voltage VRWM Breakdown Voltage Test Conditions Min Typ Max Unit − − 5.0 V VBR IR = 1.0 mA 6.0 7.0 8.0 V Leakage Current IR VRWM = 3.3 V − − 100 nA Inductance L − 2.3 − nH Series Resistance 0.9 1.3 1.7 Capacitance (Note 1) Cline RS VR = 0 V, f = 1.0 MHz 190 240 290 pF Cut−Off Frequency (Note 2) f3dB Above this frequency, Appreciable Attenuation Occurs − 20 − MHz 1. Measured at 25°C. 2. 50 source and 50 load termination. 0 0 −5 −10 −10 −20 −20 S41 (dB) S21 (dB) −15 −25 −30 −35 −30 −40 −50 −40 −60 −45 −50 1.00E+06 1.00E+07 1.00E+08 1.00E+09 1.00E+10 −70 1.E+06 1.E+07 1.E+08 1.E+09 FREQUENCY (Hz) FREQUENCY (Hz) Figure 1. Typical Insertion Loss Characteristics (S21 Measurement) Figure 2. Analog Crosstalk Curve (S41 Measurement) http://onsemi.com 2 1.E+10 NUF2450 PACKAGE DIMENSIONS UDFN8, 1.8x1.2, 0.4P CASE 517AD ISSUE C A B D 2X 0.10 C PIN ONE REFERENCE 2X ÉÉÉ ÉÉÉ ÇÇ ÉÉ ÉÉ MOLD CMPD EXPOSED Cu A3 A1 E NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. DETAIL B ALTERNATE CONSTRUCTIONS 0.10 C DIM A A1 A3 b D E e D2 E2 J K L L1 TOP VIEW A DETAIL B 0.05 C 8X 0.05 MIN (A3) (0.10) 0.05 C NOTE 4 SIDE VIEW L C L L1 D2 1 DETAIL A SEATING PLANE J DETAIL A 8X A1 E2 SOLDERING FOOTPRINT* DETAIL A OPTIONAL CONSTRUCTION 8X K 8 e e/2 1.10 7X 8X b 0.25 8X 0.45 PACKAGE OUTLINE 0.10 C A B 0.05 C MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 1.80 BSC 1.20 BSC 0.40 BSC 0.90 1.10 0.20 0.30 0.19 REF 0.20 −−− 0.20 0.30 −−− 0.10 NOTE 3 BOTTOM VIEW 1.50 0.35 1 0.35 0.40 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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