NL17SG07 Buffer with Open Drain Output The NL17SG07 MiniGatet is an advanced high−speed CMOS Buffer with Open Drain Output in ultra−small footprint. The NL17SG07 input structures provides protection when voltages up to 5.5 V are applied with VCC greater than or equal to 0.9 volts, otherwise the protection is up to 4.6 volts regardless of the supply voltage. http://onsemi.com MARKING DIAGRAMS Features Wide Operating VCC Range: 0.9 V to 3.6 V SOT−953 CASE 527AE High Speed: tPD = 2.5 ns (Typ) at VCC = 3.0 V, CL = 15 pF Low Power Dissipation: ICC = 0.5 mA (Max) at TA = 25°C 6M 1 UDFN6 1.0 x 1.0 CASE 517BX 5.5 V Overvoltage Tolerant (OVT) Input Pins (VCC ≥ 0.9 V) Ultra−Small Packages J M These are Pb−Free and Halide−Free Devices UDFN6 1.45 x 1.0 CASE 517AQ IN A 1 2 NC 3 4 NC VCC OUT Y 1 IN A 2 GND 3 5 SC−88A DF SUFFIX CASE 419A 4 Figure 2. SC−88A (Top View) NC 1 6 VCC IN A 2 5 NC GND 4 3 OUT Y 1 = Date Code* = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation and/or position may vary depending upon manufacturing location. PIN ASSIGNMENT Figure 3. UDFN (Top View) IN A AQ M G G OUT Y M G Figure 1. SOT−953 (Top View) M VCC M GND 5 V • • • • • • PIN SOT−953 SC−88A UDFN6 1 IN A NC NC 2 GND IN A IN A 3 NC GND GND 4 OUT Y OUT Y OUT Y 5 VCC VCC NC 6 − − VCC OUT Y FUNCTION TABLE Figure 4. Logic Symbol Input A Output Y L H L Z ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. © Semiconductor Components Industries, LLC, 2014 August, 2014 − Rev. 5 1 Publication Order Number: NL17SG07/D NL17SG07 MAXIMUM RATINGS Symbol Parameter VCC DC Supply Voltage VIN DC Input Voltage VOUT Value Unit −0.5 to +5.5 V −0.5 to +5.5 −0.5 to +4.6 V −0.5 to VCC + 0.5 V VIN < GND −20 mA VOUT < GND VCC ≥ 0.9 V VCC < 0.9 V DC Output Voltage IIK DC Input Diode Current IOK DC Output Diode Current −20 mA IOUT DC Output Source/Sink Current ±20 mA ICC DC Supply Current per Supply Pin ±20 mA IGND DC Ground Current per Ground Pin ±20 mA TSTG Storage Temperature Range −65 to +150 °C 260 °C +150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds TJ Junction Temperature Under Bias MSL Moisture Sensitivity FR Flammability Rating VESD ILATCHUP Level 1 Oxygen Index: 28 to 34 ESD Withstand Voltage UL 94 V−0 @ 0.125 in Human Body Model (Note 2) Machine Model (Note 3) Latch−up Performance above VCC and below GND at 125°C (Note 4) >2000 >100 V ±75 mA Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. 4. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Min Max Unit VCC Positive DC Supply Voltage 0.9 3.6 V VIN Digital Input Voltage 0.0 3.6 V 0.0 0.0 0.0 VCC 3.6 3.6 V −55 +125 °C 0 10 ns/V VOUT TA Dt / DV Characteristics Output Voltage Output at High or Low State Tri−State Mode (Note 5) Power−Down Mode (VCC = 0 V) Operating Temperature Range VCC = 3.3 V ± 0.3 V Input Transition Rise or Fail Rate Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 5. Applicable to devices with outputs that may be tri−stated. http://onsemi.com 2 NL17SG07 DC ELECTRICAL CHARACTERISTICS Symbol VIH VIL VOL Parameter Condition High−Level Input Voltage Low−Level Input Voltage Low−Level Output Voltage VIN = VIH or VIL −555C 3 TA 3 1255C TA = 255C VCC (V) Min 0.9 VCC VCC 1.1 to 1.3 0.70 x VCC 0.70 x VCC 1.4 to 1.6 0.65 x VCC 0.65 x VCC 1.65 to 1.95 0.65 x VCC 0.65 x VCC 2.3 to 2.7 1.7 1.7 3.0 to 3.6 2.0 Typ Max Min Max Unit V 2.0 0.9 GND GND 1.1 to 1.3 0.30 x VCC 0.30 x VCC 1.4 to 1.6 0.35 x VCC 0.35 x VCC 1.65 to 1.95 0.35 x VCC 0.35 x VCC 2.3 to 2.7 0.7 0.7 3.0 to 3.6 0.8 0.8 IOL = 20 mA 0.9 0.1 0.1 IOL = 0.3 mA 1.1 to 1.3 0.25 x VCC 0.25 x VCC IOL = 1.7 mA 1.4 to 1.6 0.25 x VCC 0.25 x VCC IOL = 3.0 mA 1.65 to 1.95 0.45 0.45 IOL = 4.0 mA 2.3 to 2.7 0.4 0.4 IOL = 8.0 mA 3.0 to 3.6 0.4 0.4 V V IIN Input Leakage Current 0 ≤ VIN ≤ 3.6 V 0 to 3.6 ±0.1 ±1.0 mA ICC Quiescent Supply Current VIN = VCC or GND 3.6 0.5 10 mA Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. http://onsemi.com 3 NL17SG07 ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns) TA = −555C to +1255C TA = 255C Symbol Parameter Test Condition VCC (V) Min Typ Max Min Max Unit tPZL Propagation Delay, Enable Time, A to Y CL = 10 pF, R1 = RL = 5 kW 0.9 − 12 − − − ns 1.1 to 1.3 − 5.5 6.8 − 8.8 CL = 15 pF, R1 = RL = 5 kW CL = 30 pF, R1 = RL = 5 kW tPLZ Propagation Delay, Disable Time, A to Y CL = 10 pF, R1 = RL = 5 kW CL = 15 pF, R1 = RL = 5 kW CL = 30 pF, R1 = RL = 5 kW 1.4 to 1.6 − 4.0 5.7 − 7.3 1.65 to 1.95 − 3.3 3.9 − 5.9 2.3 to 2.7 − 2.7 3.3 − 4.5 3.0 to 3.6 − 2.4 2.9 − 3.7 0.9 − 12.5 − − − 1.1 to 1.3 − 5.8 7.0 − 9.0 1.4 to 1.6 − 4.1 6.0 − 7.4 1.65 to 1.95 − 3.4 4.0 − 6.2 2.3 to 2.7 − 2.8 3.4 − 4.6 3.0 to 3.6 − 2.5 3.0 − 3.7 0.9 − 13.2 − − − 1.1 to 1.3 − 6.2 7.4 − 9.4 1.4 to 1.6 − 4.5 6.2 − 7.6 1.65 to 1.95 − 3.5 4.2 − 6.4 2.3 to 2.7 − 3.0 3.6 − 4.7 3.0 to 3.6 − 2.6 3.1 − 3.9 0.9 − 8.0 − − − 1.1 to 1.3 − 6.5 10.9 − 11.5 1.4 to 1.6 − 5.2 7.2 − 8.3 1.65 to 1.95 − 4.9 7.0 − 7.8 2.3 to 2.7 − 3.8 6.5 − 7.3 3.0 to 3.6 − 3.5 6.2 − 6.8 0.9 − 11.1 − − − 1.1 to 1.3 − 9.0 13.4 − 14 1.4 to 1.6 − 7.9 10 − 10.8 1.65 to 1.95 − 7.6 9.5 − 10.5 2.3 to 2.7 − 6.3 7.8 − 10 3.0 to 3.6 − 6.0 7.2 − 9.3 0.9 − 16.2 − − − 1.1 to 1.3 − 14 18.4 − 20 1.4 to 1.6 − 13 15 − 16 1.65 to 1.95 − 12.5 14.5 − 15.8 2.3 to 2.7 − 11.2 13.5 − 15.4 3.0 to 3.6 − 11 13.2 − 14.3 ns ns ns ns ns CIN Input Capacitance 0 to 3.6 − 3 − − − pF CPD Power Dissipation Capacitance (Note 6) 0.9 to 3.6 − 4 − − − pF 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. http://onsemi.com 4 NL17SG07 VCC A 50% GND tPZL Y tPLZ HIGH IMPEDANCE 50% VCC 10% VCC Figure 5. Switching Waveform VCC R1 PULSE GENERATOR DUT RT CL Test Switch tPZL tPLZ VCC x 2 VCC x 2 VCC 2 GND RL Figure 6. Test Circuit ORDERING INFORMATION Package Shipping† NL17SG07P5T5G SOT−953 (Pb−Free) 8000 / Tape & Reel NL17SG07DFT2G SC−88A (Pb−Free) 3000 / Tape & Reel NL17SG07AMUTCG* UDFN6 1.45x1 mm (Pb−Free) 3000 / Tape & Reel NL17SG07CMUTCG* UDFN6 1x1 mm (Pb−Free) 3000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *In Development http://onsemi.com 5 NL17SG07 PACKAGE DIMENSIONS SOT−953 CASE 527AE ISSUE E X D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF THE BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. A Y 5 4 PIN ONE INDICATOR HE E 1 2 3 DIM A b C D E e HE L L2 L3 C TOP VIEW SIDE VIEW e L 5X 5X L3 MILLIMETERS MIN NOM MAX 0.34 0.37 0.40 0.10 0.15 0.20 0.07 0.12 0.17 0.95 1.00 1.05 0.75 0.80 0.85 0.35 BSC 0.95 1.00 1.05 0.175 REF 0.05 0.10 0.15 −−− −−− 0.15 SOLDERING FOOTPRINT* 5X 0.35 5X 0.20 5X L2 5X BOTTOM VIEW b PACKAGE OUTLINE 0.08 X Y 1.20 1 0.35 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 6 NL17SG07 PACKAGE DIMENSIONS UDFN6 1.0x1.0, 0.35P CASE 517BX ISSUE O PIN ONE REFERENCE NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D ÉÉÉ ÉÉÉ E 0.10 C 2X 2X 0.10 C DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.12 0.22 1.00 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 0.05 C SIDE VIEW A1 C RECOMMENDED SOLDERING FOOTPRINT* SEATING PLANE 5X e 5X 0.48 L 6X 0.22 3 1 L1 1.18 6 4 BOTTOM VIEW 6X b 0.10 M C A B 0.05 M C 0.53 1 PKG OUTLINE NOTE 3 0.35 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 NL17SG07 PACKAGE DIMENSIONS UDFN6 1.45x1.0, 0.5P CASE 517AQ ISSUE O A B D L L L1 PIN ONE REFERENCE 0.10 C ÉÉÉ ÉÉÉ DETAIL A E OPTIONAL CONSTRUCTIONS DETAIL B MOLD CMPD DETAIL B 0.05 C 6X DIM A A1 A2 b D E e L L1 ÉÉ ÉÉ EXPOSED Cu TOP VIEW 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. OPTIONAL CONSTRUCTIONS A MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.07 REF 0.20 0.30 1.45 BSC 1.00 BSC 0.50 BSC 0.30 0.40 −−− 0.15 MOUNTING FOOTPRINT 0.05 C A1 A2 SIDE VIEW e 6X C 6X SEATING PLANE L 1.24 3 1 DETAIL A 6X 0.53 6 0.30 PACKAGE OUTLINE 4 BOTTOM VIEW 6X 0.50 PITCH DIMENSIONS: MILLIMETERS b 0.10 C A B 0.05 C 1 NOTE 3 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 8 NL17SG07 PACKAGE DIMENSIONS SC−88A (SC−70−5/SOT−353) CASE 419A−02 ISSUE L A G 5 4 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. −B− S 1 2 DIM A B C D G H J K N S 3 D 5 PL 0.2 (0.008) B M M N INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 J C K H SOLDER FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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