NL17SG04 D

NL17SG04
Single Inverter
The NL17SG04 MiniGatet is an advanced high−speed CMOS
Inverter in ultra−small footprint.
The NL17SG04 input structures provides protection when voltages
up to 4.6 V are applied.
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Features
•
•
•
•
•
•
Wide Operating VCC Range: 0.9 V to 3.6 V
MARKING
DIAGRAMS
High Speed: tPD = 2.3 ns (Typ) at VCC = 3.0 V, CL = 15 pF
Low Power Dissipation: ICC = 0.5 mA (Max) at TA = 25°C
4.6 V Overvoltage Tolerant (OVT) Input Pins
SOT−953
CASE 527AE
Ultra−Small Packages
VM
1
These are Pb−Free and Halide−Free Devices
UDFN6
1.0 x 1.0
CASE 517BX
IN A
5
1
GND
2
NC
3
4
NC
VCC
1
IN A
2
OUT Y GND
3
VCC
UDFN6
1.45 x 1.0
CASE 517AQ
4 OUT Y
SC−88A
DF SUFFIX
CASE 419A
AP M G
G
Figure 2. SC−88A
(Top View)
M
G
1
6
VCC
IN A
2
5
NC
GND
3
4
OUT Y
1
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may vary
depending upon manufacturing location.
NC
PIN ASSIGNMENT
Figure 3. UDFN
(Top View)
IN A
4 M
M
Figure 1. SOT−953
(Top Thru View)
5
5 M
OUT Y
SOT−953
SC−88A
UDFN6
1
IN A
NC
NC
2
GND
IN A
IN A
3
NC
GND
GND
4
OUT Y
OUT Y
OUT Y
5
VCC
VCC
NC
6
VCC
Figure 4. Logic Symbol
FUNCTION TABLE
A Input
Y Output
L
H
H
L
ORDERING INFORMATION
See detailed ordering and shipping information on page 5 of
this data sheet.
© Semiconductor Components Industries, LLC, 2016
June, 2016 − Rev. 6
1
Publication Order Number:
NL17SG04/D
NL17SG04
MAXIMUM RATINGS
Symbol
Parameter
VCC
DC Supply Voltage
VIN
DC Input Voltage
VOUT
DC Output Voltage
IIK
DC Input Diode Current
Value
Unit
−0.5 to +5.5
V
−0.5 to +4.6
V
−0.5 to VCC +0.5
−0.5 to +4.6
V
VIN < GND
−20
mA
VOUT < GND
Output at High or Low State
Power−Down Mode (VCC = 0 V)
IOK
DC Output Diode Current
−20
mA
IOUT
DC Output Source/Sink Current
±20
mA
ICC
DC Supply Current per Supply Pin
±20
mA
IGND
DC Ground Current per Ground Pin
±20
mA
TSTG
Storage Temperature Range
−65 to +150
°C
260
°C
+150
°C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
TJ
Junction Temperature Under Bias
MSL
Moisture Sensitivity
FR
Flammability Rating
VESD
ILATCHUP
Level 1
Oxygen Index: 28 to 34
ESD Withstand Voltage
Latchup Performance
UL 94 V−0 @ 0.125 in
Human Body Model (Note 2)
Machine Model (Note 3)
>2000
>100
V
Above VCC and Below GND at 125°C (Note 4)
±100
mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Min
Max
Unit
VCC
Positive DC Supply Voltage
0.9
3.6
V
VIN
Digital Input Voltage
0.0
3.6
V
0.0
0.0
VCC
3.6
V
−55
+125
°C
0
10
ns/V
VOUT
TA
Dt / DV
Characteristics
Output Voltage
Output at High or Low State
Power−Down Mode (VCC = 0 V)
Operating Temperature Range
VCC = 3.3 V ± 0.3 V
Input Transition Rise or Fail Rate
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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2
NL17SG04
DC ELECTRICAL CHARACTERISTICS
TA = 255C
Symbol
Parameter
VIH
High-Level Input
Voltage
VIL
VOH
VOL
Conditions
Low−Level Input
Voltage
High-Level
Output Voltage
Low-Level
Output Voltage
VIN =
VIH or
VIL
VIN =
VIH or
VIL
Min
VCC (V)
Max
TA =
-555C to +1255C
Min
0.9
VCC
VCC
1.1 to 1.3
0.7xVCC
0.7xVCC
1.4 to 1.6
0.65xVCC
0.65xVCC
1.65 to 1.95
0.65xVCC
0.65xVCC
2.3 to 2.7
1.7
1.7
3.0 to 3.6
2.0
2.0
Max
Unit
V
0.9
GND
GND
1.1 to 1.3
0.3xVCC
0.3xVCC
1.4 to 1.6
0.35xVCC
0.35xVCC
1.65 to 1.95
0.35xVCC
0.35xVCC
2.3 to 2.7
0.7
0.7
3.0 to 3.6
0.8
0.8
IOH = −20 mA
0.9
0.75
0.75
IOH = -0.3 mA
1.1 to 1.3
0.75xVCC
0.75xVCC
IOH = -1.7 mA
1.4 to 1.6
0.75xVCC
0.75xVCC
IOH = -3.0 mA
1.65 to 1.95
Vcc-0.45
VCC−0.4
5
IOH = -4.0 mA
2.3 to 2.7
2.0
2.0
IOH = -8.0 mA
3.0 to 3.6
2.48
2.48
IOL = 20 mA
0.9
0.1
0.1
IOL = 0.3 mA
1.1 to 1.3
0.25xVCC
0.25xVCC
IOL = 1.7 mA
1.4 to 1.6
0.25xVCC
0.25xVCC
IOL = 3.0 mA
1.65 to 1.95
0.45
0.45
IOL = 4.0 mA
2.3 to 2.7
0.4
0.4
IOL = 8.0 mA
3.0 to 3.6
0.4
0.4
V
V
V
IIN
Input Leakage
Current
0 ≤ VIN ≤ 3.6 V
0 to 3.6
$0.1
$1.0
mA
ICC
Quiescent
Supply Current
VIN = VCC or GND
3.6
0.5
10.0
mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
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3
NL17SG04
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
AC ELECTRICAL CHARACTERISTICS Input tr = tf = 3.0 ns
Symbol
tPLH,
tPHL
Parameter
Propagation Delay,
A to Y
Test Condition
CL = 10 pF,
RL = 1 MW
CL = 15 pF,
RL = 1 MW
CL = 30 pF,
RL = 1 MW
CIN
Input Capacitance
CPD
Power Dissipation
Capacitance (Note 5)
Min
Typ
Max
Min
Max
Unit
0.9
-
10.0
13.3
-
17.0
ns
1.1 to 1.3
-
8.7
11.2
-
14.0
1.4 to 1.6
-
4.9
8.5
-
10.0
1.65 to 1.95
-
3.8
6.2
-
6.7
2.3 to 2.7
-
2.6
3.9
-
4.4
3.0 to 3.6
-
2.1
3.1
-
3.7
0.9
-
11.55
13.7
-
19.7
1.1 to 1.3
-
7.2
10.8
-
15.6
ns
1.4 to 1.6
-
5.4
9.3
-
11.2
1.65 to 1.95
-
4.2
6.9
-
7.1
2.3 to 2.7
-
2.8
4.4
-
5.0
3.0 to 3.6
-
2.3
3.4
-
3.9
0.9
-
16.85
18.9
-
22.3
1.1 to 1.3
-
10.2
13.4
-
17.5
1.4 to 1.6
-
7.4
13.1
-
15.9
1.65 to 1.95
-
5.6
9.2
-
9.6
2.3 to 2.7
-
3.7
5.7
-
6.1
3.0 to 3.6
-
2.9
4.4
-
4.8
3
-
-
-
pF
4
-
-
-
pF
0 to 3.6
f = 10 MHz
TA =
-555C to +1255C
TA = 255 C
VCC (V)
0.9 to 3.6
-
ns
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
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4
NL17SG04
VCC
Input A
50%
50%
GND
tPLH
tPHL
VOH
Output Y
50% VCC
VOL
Figure 5. Switching Waveforms
OUTPUT
INPUT
CL *
*Includes all probe and jig capacitance.
A 1−MHz square input wave is recommended
for propagation delay tests.
Figure 6. Test Circuit
ORDERING INFORMATION
Package
Shipping†
NL17SG04P5T5G
SOT−953
(Pb−Free)
8000 / Tape & Reel
NL17SG04DFT2G
SC−88A
(Pb−Free)
3000 / Tape & Reel
NL17SG04AMUTCG
UDFN6 1.45x1 mm
(Pb−Free)
3000 / Tape & Reel
NL17SG04CMUTCG
UDFN6 1x1 mm
(Pb−Free)
3000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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5
NL17SG04
PACKAGE DIMENSIONS
SOT−953
CASE 527AE
ISSUE E
X
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF THE BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
A
Y
5
4
PIN ONE
INDICATOR
HE
E
1
2 3
DIM
A
b
C
D
E
e
HE
L
L2
L3
C
TOP VIEW
SIDE VIEW
e
L
5X
5X
L3
MILLIMETERS
MIN
NOM
MAX
0.34
0.37
0.40
0.10
0.15
0.20
0.07
0.12
0.17
0.95
1.00
1.05
0.75
0.80
0.85
0.35 BSC
0.95
1.00
1.05
0.175 REF
0.05
0.10
0.15
−−−
−−−
0.15
SOLDERING FOOTPRINT*
5X
0.35
5X
0.20
5X
L2
5X
BOTTOM VIEW
b
PACKAGE
OUTLINE
0.08 X Y
1.20
1
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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6
NL17SG04
PACKAGE DIMENSIONS
UDFN6 1.0x1.0, 0.35P
CASE 517BX
ISSUE O
PIN ONE
REFERENCE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
A B
D
ÉÉÉ
ÉÉÉ
E
0.10 C
2X
2X
0.10 C
DIM
A
A1
A3
b
D
E
e
L
L1
TOP VIEW
A3
0.05 C
A
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.12
0.22
1.00 BSC
1.00 BSC
0.35 BSC
0.25
0.35
0.30
0.40
0.05 C
SIDE VIEW
A1
C
RECOMMENDED
SOLDERING FOOTPRINT*
SEATING
PLANE
5X
e
5X
0.48
L
6X
0.22
3
1
L1
1.18
6
4
BOTTOM VIEW
6X
b
0.10
M
C A B
0.05
M
C
0.53
1
PKG
OUTLINE
NOTE 3
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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7
NL17SG04
PACKAGE DIMENSIONS
UDFN6 1.45x1.0, 0.5P
CASE 517AQ
ISSUE O
A
B
D
L
L
L1
PIN ONE
REFERENCE
0.10 C
ÉÉÉ
ÉÉÉ
DETAIL A
E
OPTIONAL
CONSTRUCTIONS
DETAIL B
MOLD CMPD
DETAIL B
0.05 C
6X
DIM
A
A1
A2
b
D
E
e
L
L1
ÉÉ
ÉÉ
EXPOSED Cu
TOP VIEW
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
OPTIONAL
CONSTRUCTIONS
A
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.07 REF
0.20
0.30
1.45 BSC
1.00 BSC
0.50 BSC
0.30
0.40
−−−
0.15
MOUNTING FOOTPRINT
0.05 C
A1
A2
SIDE VIEW
e
6X
C
6X
SEATING
PLANE
L
1.24
3
1
DETAIL A
6X
0.53
6
0.30
PACKAGE
OUTLINE
4
BOTTOM VIEW
6X
0.50
PITCH
DIMENSIONS: MILLIMETERS
b
0.10 C A B
0.05 C
1
NOTE 3
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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8
NL17SG04
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE L
A
G
5
4
−B−
S
1
2
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
3
D 5 PL
0.2 (0.008)
B
M
DIM
A
B
C
D
G
H
J
K
N
S
M
N
J
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
--0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
--0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
C
K
H
SOLDER FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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NL17SG04/D