NL7WB66 Ultra-Small SPST Analog Switch The NL7WB66 is a very low RON dual SPST analog switch. RON is 5.0 (Typ) at 5.0 V. The device is offered in the very popular low cost US8 package. It is designed as a general purpose dual switch and can be used to switch either analog signals such as audio and video or digital signal such as TTL, CMOS, LVDS, ECL, or complex digital signals such as QPSK. www.onsemi.com MARKING DIAGRAM Features • • • • • • • • • • • 8 Excellent Performance RDSON = 5.0 at 5.0 V High Speed Operation: tPD = 0.25 ns (Max) at 5.0 V 1.65 to 5.5 V Operating Range Reduced Threshold Voltages for LVTTL on Control Pin ♦ Eliminates the Need for Translators for Many Applications ♦ TTL Compatibility when VCC is 5.0 V ♦ Can Operate with 1.8 V Inputs, if VCC is 3.0 ♦ Also Meets Full CMOS Specifications Ultra−Low Charge Injection = 7.5 pC at 5.0 V Low Stand−by Power ICC = 1.0 nA (Max) at TA = 25°C Control Pins IN1, IN2, are Overvoltage Tolerant Pin for Pin Replacement TC7WB66, NC7WB66, 74LVC2G66 ESD Protection: Machine Model >200 V, Human Body Model >2000 V Latchup Max Rating: 200 mA These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant Typical Applications • • • • • Cell Phones PDAs Digital Still Cameras Video Digital Video NO1 1 8 VCC 2 7 OE1 OE2 3 6 COM2 4 1 AJ M G G 1 AJ M G = Device Code = Date Code* = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. PIN ASSIGNMENT Pin Function OVT 1 NO1 − 2 COM1 − 3 OE2 Yes 4 GND − 5 NO2 − 6 COM2 − 7 OE1 Yes 8 VCC − FUNCTION TABLE COM1 GND US8 US SUFFIX CASE 493 8 5 On/Off Enable Input State of Analog Switch L H Off On ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. NO2 Figure 1. Pin Assignment Diagram © Semiconductor Components Industries, LLC, 2015 July, 2015 − Rev. 6 1 Publication Order Number: NL7WB66/D NL7WB66 MAXIMUM RATINGS Symbol Value Unit DC Supply Voltage *0.5 to )7.0 V VI DC Input Voltage *0.5 to )7.0 V VO DC Output Voltage *0.5 to )7.0 V VI < GND *50 mA VO < GND *50 mA VCC Rating IIK DC Input Diode Current IOK DC Output Diode Current IO DC Output Sink Current $50 mA ICC DC Supply Current per Supply Pin $100 mA IGND DC Ground Current per Ground Pin $100 mA TSTG Storage Temperature Range *65 to )150 °C 260 °C )150 °C Thermal Resistance 250 °C/W Power Dissipation in Still Air at 85°C 250 mW Level 1 − UL 94 V−0 @ 0.125 in − > 2000 > 200 N/A V TL Lead Temperature, 1 mm from Case for 10 Seconds TJ Junction Temperature under Bias JA PD MSL Moisture Sensitivity FR Flammability Rating VESD Oxygen Index: 28 to 34 ESD Withstand Voltage Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. RECOMMENDED OPERATING CONDITIONS Symbol Characteristics Min Max Unit VCC Positive DC Supply Voltage 1.65 5.5 V VIN Digital Input Voltage (Enable) GND 5.5 V VIO Static or Dynamic Voltage Across an Off Switch GND VCC V VIS Analog Input Voltage GND VCC V TA Operating Temperature Range, All Package Types −55 +125 °C tr, tf Input Rise or Fall Time (Enable Input) 0 0 100 20 ns/V NO COM VCC = 3.3 V + 0.3 V VCC = 5.0 V + 0.5 V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. DEVICE JUNCTION TEMPERATURE VS. TIME TO 0.1% BOND FAILURES Junction Temperature 5C Time, Hours Time, Years 80 90 100 110 1,032,200 419,300 178,700 79,600 117.8 47.9 20.4 9.4 120 37,000 4.2 130 17,800 2.0 140 8,900 1.0 www.onsemi.com 2 TJ = 80°C TJ = 90°C TJ = 100°C TJ = 110°C TJ = 120°C FAILURE RATE OF PLASTIC = CERAMIC UNTIL INTERMETALLICS OCCUR TJ = 130°C NORMALIZED FAILURE RATE NL7WB66 1 1 10 100 1000 TIME, YEARS Figure 2. Failure Rate vs. Time Junction Temperature DC CHARACTERISTICS − Digital Section (Voltages Referenced to GND) Guaranteed Max Limit Symbol Parameter Condition VCC 255C −40 to 855C −55 to <1255C Unit VIH High−level Input Voltage, Control Input 1.65 to 1.95 2.3 to 2.7 3.0 to 3.6 4.5 to 5.5 VCC x 0.65 VCC x 0.7 VCC x 0.7 VCC x 0.7 VCC x 0.65 VCC x 0.7 VCC x 0.7 VCC x 0.7 VCC x 0.65 VCC x 0.7 VCC x 0.7 VCC x 0.7 V VIL Low−level Input Voltage, Control Input 1.65 to 1.95 2.3 to 2.7 3.0 to 3.6 4.5 to 5.5 VCC x 0.35 VCC x 0.3 VCC x 0.3 VCC x 0.3 VCC x 0.35 VCC x 0.3 VCC x 0.3 VCC x 0.3 VCC x 0.35 VCC x 0.3 VCC x 0.3 VCC x 0.3 V IIN Maximum Input Leakage Current, Enable Inputs VIN = 5.5 V or GND 0 V to 5.5 V +0.1 +1.0 +1.0 A ICC Maximum Quiescent Supply Current (per package) Enable and VIS = VCC or GND 5.5 1.0 1.0 2.0 A Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 3 NL7WB66 DC ELECTRICAL CHARACTERISTICS − Analog Section Guaranteed Max Limit Symbol Parameter Condition VCC 255C −40 to 855C −55 to <1255C Unit On−State Switch Resistance VIS = VCC VIS = GND VIS = VCC VIS = GND VIS = VCC VIS = GND VIS = VCC VIS = 2.4 VIS = GND IS = 4 mA IS = 4 mA IS = 8 mA IS = 8 mA IS = 24 mA IS = 24 mA IS = 32 mA IS = 15 mA IS = 32 mA 1.65 1.65 2.3 2.3 3.0 3.0 4.5 4.5 4.5 30 15 20 10 15 7.0 10 8.0 5.0 30 15 20 10 15 7.0 10 8.0 5.0 30 15 20 10 15 7.0 10 8.0 5.0 RON(p) Peak On−State Resistance VIS = VCC to GND, IS = 4 mA VIN = VIH IS = 8 mA IS = 24 mA IS = 32 mA 1.65 2.3 3.0 4.5 120 30 20 15 120 30 20 15 120 30 20 15 RON Difference of On−State Resistance between Switches VIS = VCC to GND, IS = 4 mA VIN = VIH IS = 8 mA IS = 24 mA IS = 32 mA 1.65 2.3 3.0 4.5 1.2 1.3 1.5 2.0 1.2 1.3 1.5 2.0 1.2 1.3 1.5 2.0 VIS = VCC to GND IS = 4 mA IS = 8 mA IS = 24 mA IS = 32 mA 1.65 2.3 3.0 4.5 240 60 14 5.0 240 60 14 5.0 240 60 14 5.0 RON RFLAT INO(OFF) Off Leakage Current VIN = VIL VNO = 1.0 V, VCOM = 4.5 V or VCOM = 1.0 V and VNO 4.5 V 5.5 1.0 10 100 nA ICOM(OFF) Off Leakage Current VIN = VIL VNO = 4.5 V or 1.0 V VCOM = 1.0 V or 4.5 V 5.5 1.0 10 100 nA AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns) Guaranteed Max Limit VCC = 1.8 V $0.15 V VCC = 2.5 V $0.2 V VCC = 3.3 V $0.3 V VCC = 5.0 V $0.5 V Min Max Min Max Min Max Min Max Unit tON Output Enable Time 2.3 10 1.6 5.6 1.5 4.4 1.3 3.9 ns tOFF Output Disable Time 2.5 10.5 1.2 6.9 2.0 7.2 1.1 6.3 ns tPD Propagation Delay Time − 0.55 − 0.5 − 0.35 − 0.25 ns Parameter Symbol CIN CNO1 or CNO2 CCOM(OFF) CCOM(ON) Test Conditions Maximum Input Capacitance, Select Input Analog I/O (Switch Off) Common I/O (Switch Off) Feed−through (Switch Off) www.onsemi.com 4 Typical @ 255C, VCC = 5.0 V Unit 3.0 10 10 10 pF NL7WB66 ADDITIONAL APPLICATIONS CHARACTERISTICS (Voltage Reference to GND Unless Noted) Condition VCC (V) Typical 255C Unit BW Maximum On−Channel −3.0 dB Bandwidth or Minimum Frequency Response Parameter VIS = 0 dBm VIS centered between VCC and GND 2.0 3.0 4.5 102 180 186 MHz VONL Maximum Feed−Through On Loss VIS = 0 dBm @ 10 kHz VIS centered between VCC and GND 2.0 3.0 4.5 −2.2 −0.8 −0.4 dB VISO Off−Channel Isolation f = 100 kHz VIS = 1.0 V RMS VIS centered between VCC and GND 2.0 3.0 4.5 −73 −74 −75 dB VIS = VCC to GND, FIS = 20 kHz tr = tf = 3.0 nS RIS = 0 , CL = 100 pF 3.0 5.5 4.8 7.5 3.0 5.5 0.19 0.06 Symbol Q THD Charge Injection Enable Input to Common I/O Total Harmonic Distortion TDH + Noise FIS = 10 Hz to 100 kHz, RL = Rgen = 600 , CL = 50 pF VIS = 3.0 VPP Sine Wave VIS = 5.0 VPP Sine Wave pC % DEVICE ORDERING INFORMATION Device Order Number NL7WB66USG Package Shipping† US8 (Pb−Free) 3000 Units / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 5 NL7WB66 TIMING INFORMATION VCC DUT Input NO VCC 50% 50% 0V COM VOUT 0.1 F 300 VOH 35 pF 90% 90% Output VOL Input tON Figure 3. tON/tOFF VCC VCC Input DUT 300 NO tOFF COM 50% 50% 0V VOUT VOH 35 pF Output 10% 10% VOL Input Figure 4. tON/tOFF tOFF tON DUT Reference Transmitted COM NO 50 Generator 50 Channel switch control/s test socket is normalized. Off isolation is measured across an off channel. On loss is the bandwidth of an On switch. VISO, Bandwidth and VONL are independent of the input signal direction. VOUT VISO = Off Channel Isolation = 20 Log VIN for VIN at 100 kHz VOUT VONL = On Channel Loss = 20 Log for VIN at 100 kHz to 50 MHz VIN ǒ ǒ Ǔ Ǔ Bandwidth (BW) = the frequency 3 dB below VONL Figure 5. Off Channel Isolation/On Channel Loss (BW)/Crosstalk (On Channel to Off Channel)/VONL DUT NO VCC VIN COM GND CL Output Off VIN Figure 6. Charge Injection: (Q) www.onsemi.com 6 On Off VOUT NL7WB66 PACKAGE DIMENSIONS US8 US SUFFIX CASE 493−02 ISSUE D NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSION OR GATE BURR. MOLD FLASH. PROTRUSION AND GATE BURR SHALL NOT EXCEED 0.14MM (0.0055”) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH AND PROTRUSION SHALL NOT EXCEED 0.14MM (0.0055”) PER SIDE. 5. LEAD FINISH IS SOLDER PLATING WITH THICKNESS OF 0.0076−0.0203MM (0.003−0.008”). 6. ALL TOLERANCE UNLESS OTHERWISE SPECIFIED ±0.0508MM (0.0002”). X Y A 8 J 5 DETAIL E B L 1 4 R S G P U C SEATING PLANE T D 0.10 (0.004) H 0.10 (0.004) T K M N R 0.10 TYP T X Y V M F DIM A B C D F G H J K L M N P R S U V MILLIMETERS MIN MAX 1.90 2.10 2.20 2.40 0.60 0.90 0.17 0.25 0.20 0.35 0.50 BSC 0.40 REF 0.10 0.18 0.00 0.10 3.00 3.20 0_ 6_ 0_ 10 _ 0.23 0.34 0.23 0.33 0.37 0.47 0.60 0.80 0.12 BSC INCHES MIN MAX 0.075 0.083 0.087 0.094 0.024 0.035 0.007 0.010 0.008 0.014 0.020 BSC 0.016 REF 0.004 0.007 0.000 0.004 0.118 0.128 0_ 6_ 0_ 10 _ 0.010 0.013 0.009 0.013 0.015 0.019 0.024 0.031 0.005 BSC DETAIL E RECOMMENDED SOLDERING FOOTPRINT* 8X 0.30 8X 0.68 3.40 1 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. 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