NL7WB66 D

NL7WB66
Ultra-Small SPST Analog
Switch
The NL7WB66 is a very low RON dual SPST analog switch. RON is
5.0 (Typ) at 5.0 V. The device is offered in the very popular low cost
US8 package. It is designed as a general purpose dual switch and can
be used to switch either analog signals such as audio and video or
digital signal such as TTL, CMOS, LVDS, ECL, or complex digital
signals such as QPSK.
www.onsemi.com
MARKING
DIAGRAM
Features
•
•
•
•
•
•
•
•
•
•
•
8
Excellent Performance RDSON = 5.0 at 5.0 V
High Speed Operation: tPD = 0.25 ns (Max) at 5.0 V
1.65 to 5.5 V Operating Range
Reduced Threshold Voltages for LVTTL on Control Pin
♦ Eliminates the Need for Translators for Many Applications
♦ TTL Compatibility when VCC is 5.0 V
♦ Can Operate with 1.8 V Inputs, if VCC is 3.0
♦ Also Meets Full CMOS Specifications
Ultra−Low Charge Injection = 7.5 pC at 5.0 V
Low Stand−by Power ICC = 1.0 nA (Max) at TA = 25°C
Control Pins IN1, IN2, are Overvoltage Tolerant
Pin for Pin Replacement TC7WB66, NC7WB66, 74LVC2G66
ESD Protection:
Machine Model >200 V,
Human Body Model >2000 V
Latchup Max Rating: 200 mA
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications
•
•
•
•
•
Cell Phones
PDAs
Digital Still Cameras
Video
Digital Video
NO1
1
8
VCC
2
7
OE1
OE2
3
6
COM2
4
1
AJ M G
G
1
AJ
M
G
= Device Code
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending upon manufacturing location.
PIN ASSIGNMENT
Pin
Function
OVT
1
NO1
−
2
COM1
−
3
OE2
Yes
4
GND
−
5
NO2
−
6
COM2
−
7
OE1
Yes
8
VCC
−
FUNCTION TABLE
COM1
GND
US8
US SUFFIX
CASE 493
8
5
On/Off
Enable Input
State of
Analog Switch
L
H
Off
On
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
NO2
Figure 1. Pin Assignment Diagram
© Semiconductor Components Industries, LLC, 2015
July, 2015 − Rev. 6
1
Publication Order Number:
NL7WB66/D
NL7WB66
MAXIMUM RATINGS
Symbol
Value
Unit
DC Supply Voltage
*0.5 to )7.0
V
VI
DC Input Voltage
*0.5 to )7.0
V
VO
DC Output Voltage
*0.5 to )7.0
V
VI < GND
*50
mA
VO < GND
*50
mA
VCC
Rating
IIK
DC Input Diode Current
IOK
DC Output Diode Current
IO
DC Output Sink Current
$50
mA
ICC
DC Supply Current per Supply Pin
$100
mA
IGND
DC Ground Current per Ground Pin
$100
mA
TSTG
Storage Temperature Range
*65 to )150
°C
260
°C
)150
°C
Thermal Resistance
250
°C/W
Power Dissipation in Still Air at 85°C
250
mW
Level 1
−
UL 94 V−0 @ 0.125 in
−
> 2000
> 200
N/A
V
TL
Lead Temperature, 1 mm from Case for 10 Seconds
TJ
Junction Temperature under Bias
JA
PD
MSL
Moisture Sensitivity
FR
Flammability Rating
VESD
Oxygen Index: 28 to 34
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
Min
Max
Unit
VCC
Positive DC Supply Voltage
1.65
5.5
V
VIN
Digital Input Voltage (Enable)
GND
5.5
V
VIO
Static or Dynamic Voltage Across an Off Switch
GND
VCC
V
VIS
Analog Input Voltage
GND
VCC
V
TA
Operating Temperature Range, All Package Types
−55
+125
°C
tr, tf
Input Rise or Fall Time
(Enable Input)
0
0
100
20
ns/V
NO
COM
VCC = 3.3 V + 0.3 V
VCC = 5.0 V + 0.5 V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
DEVICE JUNCTION TEMPERATURE VS. TIME TO
0.1% BOND FAILURES
Junction
Temperature 5C
Time, Hours
Time, Years
80
90
100
110
1,032,200
419,300
178,700
79,600
117.8
47.9
20.4
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
www.onsemi.com
2
TJ = 80°C
TJ = 90°C
TJ = 100°C
TJ = 110°C
TJ = 120°C
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
TJ = 130°C
NORMALIZED FAILURE RATE
NL7WB66
1
1
10
100
1000
TIME, YEARS
Figure 2. Failure Rate vs. Time Junction Temperature
DC CHARACTERISTICS − Digital Section (Voltages Referenced to GND)
Guaranteed Max Limit
Symbol
Parameter
Condition
VCC
255C
−40 to
855C
−55 to
<1255C
Unit
VIH
High−level Input Voltage,
Control Input
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
4.5 to 5.5
VCC x 0.65
VCC x 0.7
VCC x 0.7
VCC x 0.7
VCC x 0.65
VCC x 0.7
VCC x 0.7
VCC x 0.7
VCC x 0.65
VCC x 0.7
VCC x 0.7
VCC x 0.7
V
VIL
Low−level Input Voltage,
Control Input
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
4.5 to 5.5
VCC x 0.35
VCC x 0.3
VCC x 0.3
VCC x 0.3
VCC x 0.35
VCC x 0.3
VCC x 0.3
VCC x 0.3
VCC x 0.35
VCC x 0.3
VCC x 0.3
VCC x 0.3
V
IIN
Maximum Input Leakage
Current, Enable Inputs
VIN = 5.5 V or GND
0 V to 5.5 V
+0.1
+1.0
+1.0
A
ICC
Maximum Quiescent
Supply Current
(per package)
Enable and VIS = VCC
or GND
5.5
1.0
1.0
2.0
A
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
www.onsemi.com
3
NL7WB66
DC ELECTRICAL CHARACTERISTICS − Analog Section
Guaranteed Max Limit
Symbol
Parameter
Condition
VCC
255C
−40 to 855C
−55 to <1255C
Unit
On−State Switch
Resistance
VIS = VCC
VIS = GND
VIS = VCC
VIS = GND
VIS = VCC
VIS = GND
VIS = VCC
VIS = 2.4
VIS = GND
IS = 4 mA
IS = 4 mA
IS = 8 mA
IS = 8 mA
IS = 24 mA
IS = 24 mA
IS = 32 mA
IS = 15 mA
IS = 32 mA
1.65
1.65
2.3
2.3
3.0
3.0
4.5
4.5
4.5
30
15
20
10
15
7.0
10
8.0
5.0
30
15
20
10
15
7.0
10
8.0
5.0
30
15
20
10
15
7.0
10
8.0
5.0
RON(p)
Peak On−State Resistance
VIS = VCC to GND, IS = 4 mA
VIN = VIH
IS = 8 mA
IS = 24 mA
IS = 32 mA
1.65
2.3
3.0
4.5
120
30
20
15
120
30
20
15
120
30
20
15
RON
Difference of On−State
Resistance between
Switches
VIS = VCC to GND, IS = 4 mA
VIN = VIH
IS = 8 mA
IS = 24 mA
IS = 32 mA
1.65
2.3
3.0
4.5
1.2
1.3
1.5
2.0
1.2
1.3
1.5
2.0
1.2
1.3
1.5
2.0
VIS = VCC to GND IS = 4 mA
IS = 8 mA
IS = 24 mA
IS = 32 mA
1.65
2.3
3.0
4.5
240
60
14
5.0
240
60
14
5.0
240
60
14
5.0
RON
RFLAT
INO(OFF)
Off Leakage Current
VIN = VIL
VNO = 1.0 V, VCOM = 4.5 V or
VCOM = 1.0 V and VNO 4.5 V
5.5
1.0
10
100
nA
ICOM(OFF)
Off Leakage Current
VIN = VIL
VNO = 4.5 V or 1.0 V
VCOM = 1.0 V or 4.5 V
5.5
1.0
10
100
nA
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns)
Guaranteed Max Limit
VCC = 1.8 V
$0.15 V
VCC = 2.5 V
$0.2 V
VCC = 3.3 V
$0.3 V
VCC = 5.0 V
$0.5 V
Min
Max
Min
Max
Min
Max
Min
Max
Unit
tON
Output Enable Time
2.3
10
1.6
5.6
1.5
4.4
1.3
3.9
ns
tOFF
Output Disable Time
2.5
10.5
1.2
6.9
2.0
7.2
1.1
6.3
ns
tPD
Propagation Delay Time
−
0.55
−
0.5
−
0.35
−
0.25
ns
Parameter
Symbol
CIN
CNO1 or CNO2
CCOM(OFF)
CCOM(ON)
Test Conditions
Maximum Input Capacitance, Select Input
Analog I/O (Switch Off)
Common I/O (Switch Off)
Feed−through (Switch Off)
www.onsemi.com
4
Typical @ 255C, VCC = 5.0 V
Unit
3.0
10
10
10
pF
NL7WB66
ADDITIONAL APPLICATIONS CHARACTERISTICS (Voltage Reference to GND Unless Noted)
Condition
VCC (V)
Typical 255C
Unit
BW
Maximum On−Channel −3.0 dB
Bandwidth or Minimum Frequency
Response
Parameter
VIS = 0 dBm
VIS centered between VCC and GND
2.0
3.0
4.5
102
180
186
MHz
VONL
Maximum Feed−Through On Loss
VIS = 0 dBm @ 10 kHz
VIS centered between VCC and GND
2.0
3.0
4.5
−2.2
−0.8
−0.4
dB
VISO
Off−Channel Isolation
f = 100 kHz
VIS = 1.0 V RMS
VIS centered between VCC and GND
2.0
3.0
4.5
−73
−74
−75
dB
VIS = VCC to GND, FIS = 20 kHz
tr = tf = 3.0 nS
RIS = 0 , CL = 100 pF
3.0
5.5
4.8
7.5
3.0
5.5
0.19
0.06
Symbol
Q
THD
Charge Injection
Enable Input to Common I/O
Total Harmonic Distortion
TDH + Noise
FIS = 10 Hz to 100 kHz,
RL = Rgen = 600 , CL = 50 pF
VIS = 3.0 VPP Sine Wave
VIS = 5.0 VPP Sine Wave
pC
%
DEVICE ORDERING INFORMATION
Device Order Number
NL7WB66USG
Package
Shipping†
US8
(Pb−Free)
3000 Units / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
www.onsemi.com
5
NL7WB66
TIMING INFORMATION
VCC
DUT
Input
NO
VCC
50%
50%
0V
COM
VOUT
0.1 F
300 VOH
35 pF
90%
90%
Output
VOL
Input
tON
Figure 3. tON/tOFF
VCC
VCC
Input
DUT
300 NO
tOFF
COM
50%
50%
0V
VOUT
VOH
35 pF
Output
10%
10%
VOL
Input
Figure 4. tON/tOFF
tOFF
tON
DUT
Reference
Transmitted
COM
NO
50 Generator
50 Channel switch control/s test socket is normalized. Off isolation is measured
across an off channel. On loss is the bandwidth of an On switch. VISO,
Bandwidth and VONL are independent of the input signal direction.
VOUT
VISO = Off Channel Isolation = 20 Log
VIN for VIN at 100 kHz
VOUT
VONL = On Channel Loss = 20 Log
for VIN at 100 kHz to 50 MHz
VIN
ǒ
ǒ
Ǔ
Ǔ
Bandwidth (BW) = the frequency 3 dB below VONL
Figure 5. Off Channel Isolation/On Channel Loss (BW)/Crosstalk
(On Channel to Off Channel)/VONL
DUT
NO
VCC
VIN
COM
GND
CL
Output
Off
VIN
Figure 6. Charge Injection: (Q)
www.onsemi.com
6
On
Off
VOUT
NL7WB66
PACKAGE DIMENSIONS
US8
US SUFFIX
CASE 493−02
ISSUE D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURR. MOLD
FLASH. PROTRUSION AND GATE BURR SHALL
NOT EXCEED 0.14MM (0.0055”) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH
AND PROTRUSION SHALL NOT EXCEED 0.14MM
(0.0055”) PER SIDE.
5. LEAD FINISH IS SOLDER PLATING WITH
THICKNESS OF 0.0076−0.0203MM (0.003−0.008”).
6. ALL TOLERANCE UNLESS OTHERWISE
SPECIFIED ±0.0508MM (0.0002”).
X Y
A
8
J
5
DETAIL E
B
L
1
4
R
S
G
P
U
C
SEATING
PLANE
T
D
0.10 (0.004)
H
0.10 (0.004) T
K
M
N
R 0.10 TYP
T X Y
V
M
F
DIM
A
B
C
D
F
G
H
J
K
L
M
N
P
R
S
U
V
MILLIMETERS
MIN
MAX
1.90
2.10
2.20
2.40
0.60
0.90
0.17
0.25
0.20
0.35
0.50 BSC
0.40 REF
0.10
0.18
0.00
0.10
3.00
3.20
0_
6_
0_
10 _
0.23
0.34
0.23
0.33
0.37
0.47
0.60
0.80
0.12 BSC
INCHES
MIN
MAX
0.075
0.083
0.087
0.094
0.024
0.035
0.007
0.010
0.008
0.014
0.020 BSC
0.016 REF
0.004
0.007
0.000
0.004
0.118
0.128
0_
6_
0_
10 _
0.010
0.013
0.009
0.013
0.015
0.019
0.024
0.031
0.005 BSC
DETAIL E
RECOMMENDED
SOLDERING FOOTPRINT*
8X
0.30
8X
0.68
3.40
1
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable
copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
www.onsemi.com
7
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NL7WB66/D