NLAS3799B D

NLAS3799B, NLAS3799BL
Dual DPDT Ultra-Low RON
Switch
The NLAS3799B is an ultra−low RON dual DPDT and a 0.5 RON
analog switch. This device is designed for low operating voltage, high
current switching of speaker output and earpiece for cellphone
applications. It can switch a balanced stereo output. The NLAS3799B
can handle a balanced microphone/speaker/ring−tone generator in a
monophone mode. The device contains a break−before−make (BBM)
feature.
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MARKING
DIAGRAMS
1
• Single Supply Operation
•
•
•
•
1.65 to 4.5 V VCC
Function Directly from LiON Battery
Maximum Breakdown Voltage: 5.5 V
Low Static Power
NLAS3799B Interfaces with 2.8 V Chipset
NLAS3799BL Interfaces with 1.8 V Chipset
These are Pb−Free Devices
ÇÇ
ÇÇ
16
1
1
Cell Phone Speaker/Microphone Switching
Ringtone−Chip/Amplifier Switching
Four Unbalanced (Single−Ended) Switches
Stereo Balanced (Push−Pull) Switching
XXMG
G
UQFN−16
CASE 488AU
XX
Important Information
• ESD Protection:
•
•
•
XXMG
G
WQFN−16
CASE 488AP
1
Typical Applications
•
•
•
•
ÇÇ
ÇÇ
16
Features
Human Body Model (HBM) > 8000 V
Machine Model (MM) > 400 V
Continuous Current Rating Through each Switch ±300 mA
Conforms to: JEDEC MO−220, Issue H, Variation VEED−6
Package:
♦ 1.8 x 2.6 x 0.75 mm WQFN−16 Pb−Free
♦ 1.8 x 2.6 x 0.55 mm UQFN−16 Pb−Free
= Specific Device Code
AK = NLAS3799BMNR2G
AL = NLAS3799BLMNR2G
AX = NLAS3799BMUR2G
M
= Date Code/Assembly Location
G
= Pb−Free Package
(Note: Microdot may be in either location)
COMA NOA Vcc NCD
16
15
14
13
NCA
1
12
COMD
A−B IN
2
11
NOD
NOB
3
10
C−D IN
COMB
4
9
NCC
5
6
7
8
NCB GND NOCCOMC
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 10 of this data sheet.
© Semiconductor Components Industries, LLC, 2008
July, 2008 − Rev. 3
1
Publication Order Number:
NLAS3799B/D
NLAS3799B, NLAS3799BL
COM
NC
NO
IN
Figure 1. Input Equivalent Circuit
PIN DESCRIPTION
QFN PIN #
Symbol
Name and Function
1, 3, 5, 7, 9, 11, 13, 15
NO A−D, NC A−D
Independent Channels
2, 10
A−B IN, C−D IN
4, 8, 12, 16
COM A−D
Controls
6
GND
Ground (V)
14
VCC
Positive Supply Voltage
Common Channels
TRUTH TABLE
IN
NO
NC
H
ON
OFF*
L
OFF*
ON
*High impedance.
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2
NLAS3799B, NLAS3799BL
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
−0.5 to +5.5
V
−0.5 v VIS v VCC + 0.5
V
−0.5 v VIN v +VCC
V
Continuous DC Current from COM to NC/NO
±300
mA
Ianl−pk1
Peak Current from COM to NC/NO, 10 Duty Cycle (Note 1)
±500
mA
Iclmp
Continuous DC Current into COM/NO/NC with Respect to VCC or GND
±100
mA
VCC
Positive DC Supply Voltage
VIS
Analog Input Voltage (VNO, VNC, or VCOM)
VIN
Digital Select Input Voltage
Ianl1
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Defined as 10% ON, 90% OFF Duty Cycle.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC
DC Supply Voltage
1.65
4.5
V
VIN
Digital Select Input Voltage
GND
VCC
V
VIS
Analog Input Voltage (NC, NO, COM)
GND
VCC
V
TA
Operating Temperature Range
−40
+85
°C
tr, tf
Input Rise or Fall Time, IN
20
10
ns/V
VCC = 1.6 V − 2.7 V
VCC = 3.0 V − 4.5 V
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3
NLAS3799B, NLAS3799BL
NLAS3799B DC CHARACTERISTICS − DIGITAL SECTION (Voltages Referenced to GND)
Guaranteed Limit
Symbol
Parameter
Condition
VCC
25°C
−40°C to
+85°C
Unit
VIH
Minimum High−Level Input Voltage, Select
Inputs
3.0
4.3
1.4
2.0
1.4
2.0
V
VIL
Maximum Low−Level Input Voltage, Select
Inputs
3.0
4.3
0.5
0.8
0.5
0.8
V
IIN
Maximum Input Leakage Current, Select
Inputs
VIN = VCC or GND
4.3
±0.1
±1.0
A
IOFF
Power Off Leakage Current
VIN = 4.5 V or GND
0
±0.5
±2.0
A
ICC
Maximum Quiescent Supply Current
(Note 2)
Select and VIS = VCC or GND
1.65 to 4.5
±1.0
±2.0
A
2. Guaranteed by design. Resistance measurements do not include test circuit or package resistance.
NLAS3799B DC ELECTRICAL CHARACTERISTICS − ANALOG SECTION
Guaranteed Maximum Limit
25°C
Symbol
Parameter
Condition
VCC
Min
−40°C to +85°C
Max
Min
Max
Unit
RON
NC/NO On−Resistance
(Note 3)
VIN = VIL or VIN = VIH
VIS = GND to VCC
IINI = 100 mA
3.0
4.3
0.5
0.4
0.6
0.5
RFLAT
NC/NO On−Resistance Flatness
(Notes 3 and 4)
ICOM = 100 mA
VIS = 0 to VCC
3.0
4.3
0.15
0.15
0.15
0.15
RON
On−Resistance Match Between Channels
(Notes 3 and 5)
VIS = 1.5 V;
ICOM = 100 mA
VIS = 2.2 V;
ICOM = 100 mA
3.0
0.05
0.05
4.3
0.05
0.05
INC(OFF)
INO(OFF)
NC or NO Off Leakage Current (Note 3)
VIN = VIL or VIH
VNO or VNC = 0.3 V
VCOM = 4.0 V
4.3
−10
10
−100
100
nA
ICOM(ON)
COM ON
Leakage Current
(Note 3)
VIN = VIL or VIH
VNO 0.3 V or 4.0 V with
VNC floating or
VNC 0.3 V or 4.0 V with
VNO floating
VCOM = 0.3 V or 4.0 V
4.3
−10
10
−100
100
nA
3. Guaranteed by design. Resistance measurements do not include test circuit or package resistance.
4. Flatness is defined as the difference between the maximum and minimum value of On−resistance as measured over the specified analog
signal ranges.
5. RON = RON(MAX) − RON(MIN) between NCn or NOn.
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4
NLAS3799B, NLAS3799BL
NLAS3799BL DC CHARACTERISTICS − DIGITAL SECTION (Voltages Referenced to GND)
Guaranteed Limit
Symbol
Parameter
Condition
VCC
25°C
−40 to +85°C
Unit
VIH
Minimum High−Level Input Voltage, Select
Inputs
3.0
4.3
1.3
1.6
1.3
1.6
V
VIL
Maximum Low−Level Input Voltage, Select
Inputs
3.0
4.3
0.5
0.6
0.5
0.6
V
IIN
Maximum Input Leakage Current, Select
Inputs
VIN = VCC or GND
4.3
±0.1
±1.0
A
IOFF
Power Off Leakage Current
VIN = 4.5 V or GND
0
±0.5
±2.0
A
ICC
Maximum Quiescent Supply Current
(Note 6)
Select and VIS = VCC or GND
1.65 to 4.3
±40
±45
A
6. Guaranteed by design. Resistance measurements do not include test circuit or package resistance.
NLAS3799BL DC ELECTRICAL CHARACTERISTICS − ANALOG SECTION
Guaranteed Maximum Limit
25°C
Max
Unit
RON
NC/NO On−Resistance
(Note 7)
VIN = VIL or VIN = VIH
VIS = GND to VCC
IINI = 100 mA
3.0
4.3
0.5
0.4
0.6
0.5
RFLAT
NC/NO On−Resistance Flatness
(Notes 7 and 8)
ICOM = 100 mA
VIS = 0 to VCC
3.0
4.3
0.15
0.15
0.15
0.15
RON
On−Resistance Match Between Channels
(Notes 7 and 9)
VIS = 1.5 V;
ICOM = 100 mA
VIS = 2.2 V;
ICOM = 100 mA
3.0
0.05
0.05
4.3
0.05
0.05
INC(OFF)
INO(OFF)
NC or NO Off Leakage Current (Note 7)
VIN = VIL or VIH
VNO or VNC = 0.3 V
VCOM = 4.0 V
4.3
−10
10
−100
100
nA
ICOM(ON)
COM ON
Leakage Current
(Note 7)
VIN = VIL or VIH
VNO 0.3 V or 4.0 V with
VNC floating or
VNC 0.3 V or 4.0 V with
VNO floating
VCOM = 0.3 V or 4.0 V
4.3
−10
10
−100
100
nA
Symbol
Parameter
Condition
VCC
Min
−40°C to +85°C
Max
Min
7. Guaranteed by design. Resistance measurements do not include test circuit or package resistance.
8. Flatness is defined as the difference between the maximum and minimum value of On−resistance as measured over the specified analog
signal ranges.
9. RON = RON(MAX) − RON(MIN) between NC1 and NC2 or between NO1 and NO2.
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5
NLAS3799B, NLAS3799BL
NLAS3799B/NLAS3799BL AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns)
Guaranteed Maximum Limit
Symbol
Parameter
Test Conditions
VCC
(V)
VIS
(V)
−40°C to
+85°C
25°C
Min
Typ*
Max
Min
Max
Unit
tON
Turn−On Time
RL = 50 , CL = 35 pF
(Figures 3 and 4)
2.3 − 4.3
1.5
50
60
ns
tOFF
Turn−Off Time
RL = 50 , CL = 35 pF
(Figures 3 and 4)
2.3 − 4.3
1.5
30
40
ns
tBBM
Minimum Break−Before−Make Time
VIS = 3.0
RL = 50 , CL = 35 pF
(Figure 2)
3.0
1.5
2
ns
15
Typical @ 25, VCC = 3.6 V
CIN
Control Pin Input Capacitance
3.0
pF
CSN
SN Port Capacitance
72
pF
CD
D Port Capacitance When Switch is Enabled
220
pF
*Typical Characteristics are at 25°C.
ADDITIONAL APPLICATION CHARACTERISTICS (Voltages Referenced to GND Unless Noted)
Symbol
Parameter
Condition
25°C
VCC
(V)
Typical
Unit
BW
Maximum On−Channel −3 dB
Bandwidth or Minimum
Frequency Response (Figure 9)
VIN centered between VCC and GND
(Figure 5)
1.65 − 4.5
19
MHz
VONL
Maximum Feed−through On Loss
VIN = 0 dBm @ 100 kHz to 50 MHz
VIN centered between VCC and GND (Figure 5)
1.65 − 4.5
−0.06
dB
VISO
Off−Channel Isolation
f = 100 kHz; VIS = 1 V RMS; CL = 5.0 pF
VIN centered between VCC and GND(Figure 5)
1.65 − 4.5
−69
dB
Q
Charge Injection Select Input to
Common I/O (Figure 8)
VIN = VCC to GND, RIS = 0 , CL = 1.0 nF
Q = CL x VOUT (Figure 6)
1.65 − 4.5
51
pC
THD
Total Harmonic Distortion
THD + Noise (Figure 7)
FIS = 20 Hz to 20 kHz, RL = Rgen = 600 , CL = 50 pF
VIS = 2 VPP
4.3
0.042
%
VCT
Channel−to−Channel Crosstalk
(Figure 10)
f = 100 kHz; VIS = 1.0 V RMS, CL = 5.0 pF, RL = 50 VIN centered between VCC and GND (Figure 5)
1.65 − 4.5
−90
dB
10. Off−Channel Isolation = 20log10 (VCOM/VNO), VCOM = output, VNO = input to off switch.
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6
NLAS3799B, NLAS3799BL
VCC
DUT
VCC
Input
Output
GND
VOUT
0.1 F
50 tBMM
35 pF
90%
90% of VOH
Output
Switch Select Pin
GND
Figure 2. tBBM (Time Break−Before−Make)
VCC
Input
DUT
VCC
0.1 F
50%
Output
VOUT
Open
50%
0V
50 VOH
90%
35 pF
90%
Output
VOL
Input
tON
tOFF
Figure 3. tON/tOFF
VCC
VCC
Input
DUT
Output
50%
50 VOUT
Open
50%
0V
VOH
35 pF
Output
10%
VOL
Input
tOFF
Figure 4. tON/tOFF
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7
10%
tON
NLAS3799B, NLAS3799BL
50 DUT
Reference
Transmitted
Input
Output
50 Generator
50 Channel switch control/s test socket is normalized. Off isolation is measured across an off channel. On loss is
the bandwidth of an On switch. VISO, Bandwidth and VONL are independent of the input signal direction.
ǒVVOUT
Ǔ for VIN at 100 kHz
IN
VOUT
Ǔ for VIN at 100 kHz to 50 MHz
VONL = On Channel Loss = 20 Log ǒ
VIN
VISO = Off Channel Isolation = 20 Log
Bandwidth (BW) = the frequency 3 dB below VONL
VCT = Use VISO setup and test to all other switch analog input/outputs terminated with 50 Figure 5. Off Channel Isolation/On Channel Loss (BW)/Crosstalk
(On Channel to Off Channel)/VONL
DUT
VCC
VIN
Output
Open
GND
CL
Output
Off
VIN
Figure 6. Charge Injection: (Q)
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8
On
Off
VOUT
NLAS3799B, NLAS3799BL
20
0.040
10
CHARGE INJECTION “Q” (pC)
0.045
0.035
THD (%)
0.030
0.025
0.020
0.015
0.010
0.005
0
10
100
1000
10000
0
−10
−20
−30
−40
−50
−60
100000
0
0.5
1
1.5
Figure 7. Total Harmonic Distortion vs.
Frequency
3.5
4
4.5
0
−10
−3
−20
MAGNITUDE (dB)
−6
BW (dB)
3
Figure 8. Charge Injection @ 0 V < VCC < 4.5 V
0
−9
−12
−15
−30
−40
−50
−60
−70
−80
−18
−90
−21
0.01
0.1
1
10
100
−100
0.01
1000
0.1
FREQUENCY (MHz)
1
10
100
FREQUENCY (MHz)
Figure 9. Bandwidth vs. Frequency
Figure 10. Cross−Talk vs. Frequency
0.6
0.7
0.6
85°C
0.5
0.5
25°C
0.4
0.4
−40°C
RON ()
RON ()
2.5
VIN (V)
FREQUENCY (Hz)
0.3
85°C
25°C
−40°C
0.3
0.2
0.2
0.1
0.1
0
2
0
0.5
1.0
1.5
2.0
2.5
0
3.0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
VIN (V)
VIN (V)
Figure 11. RON vs. VIN vs. Temperature
@ VCC = 3.0 V
Figure 12. RON vs. VIN vs. Temperature
@ VCC = 4.3 V
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9
NLAS3799B, NLAS3799BL
DEVICE ORDERING INFORMATION
Package Type
Tape & Reel Size†
NLAS3799BMNR2G
WQFN−16
(Pb−Free)
3000 / Tape & Reel
NLAS3799BLMNR2G
WQFN−16
(Pb−Free)
3000 / Tape & Reel
NLAS3799BMUR2G
UQFN−16
(Pb−Free)
3000 / Tape & Reel
Device Order Number
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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10
NLAS3799B, NLAS3799BL
PACKAGE DIMENSIONS
WQFN16, 1.8x2.6, 0.4P
CASE 488AP−01
ISSUE B
D
PIN 1 REFERENCE
2X
2X
L
A
ÉÉ
ÉÉ
ÉÉ
ÉÉ
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
E
ÉÉÉ
ÇÇ
ÉÉ
ÉÉÉ ÇÇ
EXPOSED Cu
0.15 C
B
MOUNTING FOOTPRINT*
C
A3
8
0.562
0.0221
0.400
0.0157
9
0.225
0.0089
1
e
1
MILLIMETERS
MIN
MAX
0.70
0.80
0.00
0.050
0.20 REF
0.15
0.25
1.80 BSC
2.60 BSC
0.40 BSC
0.30
0.50
0.00
0.15
0.40
0.60
SEATING
PLANE
15 X L
12
2.900
0.1142
16
L2
DIM
A
A1
A3
b
D
E
e
L
L1
L2
ALTERNATE
CONSTRUCTIONS
A1
4
A3
A1
0.08 C
DETAIL A
MOLD CMPD
DETAIL B
A
DETAIL B
5
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND 0.30 MM
FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED PAD
AS WELL AS THE TERMINALS.
5. EXPOSED PADS CONNECTED TO DIE FLAG.
USED AS TEST CONTACTS.
L1
0.15 C
0.10 C
L
16 X
b
0.463
0.0182
0.10 C A B
0.05 C
1.200
0.0472
NOTE 3
2.100
0.0827
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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11
NLAS3799B, NLAS3799BL
PACKAGE DIMENSIONS
UQFN16, 1.8x2.6, 0.4P
CASE 488AU−01
ISSUE A
D
ÉÉÉ
ÉÉÉ
ÉÉÉ
PIN 1 REFERENCE
2X
A
EDGE OF PACKAGE
L1
E
DETAIL A
Bottom View
(Optional)
0.10 C
EXPOSED Cu
2X
0.10 C
B
TOP VIEW
A
0.05 C
16X
0.05 C
15X
A1
A1
SIDE VIEW
5
C
ÉÉ
ÉÉ
DIM
A
A1
A3
b
D
E
e
L
L1
L3
MOLD CMPD
A3
DETAIL B
Side View
(Optional)
MILLIMETERS
MIN
MAX
0.45
0.60
0.00
0.05
0.127 REF
0.15
0.25
1.80 BSC
2.60 BSC
0.40 BSC
0.30
0.50
0.00
0.15
0.40
0.60
MOUNTING FOOTPRINT*
SEATING
PLANE
0.562
0.0221
8
L
4
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND 0.30 MM
FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED PAD
AS WELL AS THE TERMINALS.
0.400
0.0157
9
0.225
0.0089
1
e
1
2.900
0.1142
12
16
L3
16X
b
BOTTOM VIEW
0.463
0.0182
0.10 C A B
0.05 C
NOTE 3
1.200
0.0472
2.100
0.0827
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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PUBLICATION ORDERING INFORMATION
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12
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NLAS3799B/D