NLAS3899B Dual DPDT Low RON, Low Capacitance Switch The NLAS3899B is a dual DPDT analog switch designed for low power audio and dual SIM card applications. The low RON of 3.0 (typical) is ideal for routing audio signals to or from a moderately high impedance load. In addition, the low CON of 20 pF (typical) gives the NLAS3899B a high bandwidth of 280 MHz, perfect for dual SIM card applications. http://onsemi.com MARKING DIAGRAMS Features • • • • • • • ÇÇ ÇÇ 16 • Single Supply Operation 1 1.65 to 4.3 V VCC Function Directly from Li−Ion Battery Low ON Resistance (3.0 Typical Across VCC) Low CON (20 pF Typical) Bandwidth 280 MHz Maximum Breakdown Voltage: 5.5 V Low Static Power Interfaces with 1.8 V Chipset These are Pb−Free Devices AAMG G WQFN16 CASE 488AP 1 ÇÇÇ ÇÇÇ 16 1 QFN16 CASE 485AE 1 NLAS 3899 ALYW Typical Applications • • • • XX A M L Y W G Cell Phone Speaker/Microphone Switching Ringtone−Chip/Amplifier Switching Dual SIM Card Data Switching Four Unbalanced (Single−Ended) Switches Important Information • ESD Protection: • • • = Specific Device Code = Assembly Location = Date Code/Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) Human Body Model (HBM) 1000 V − All Pins Human Body Model (HBM) 5000 V − I/O to GND Continuous Current Rating Through each Switch ±300 mA Conforms to: JEDEC MO−220, Issue H, Variation VEED−6 Package: ♦ 1.8 x 2.6 x 0.75 mm WQFN16 Pb−Free ♦ 3.0 x 3.0 x 0.9 mm QFN16 Pb−Free COMA NOA Vcc NCD 16 15 14 13 NCA 1 12 COMD A−B IN 2 11 NOD NOB 3 10 C−D IN COMB 4 9 NCC 5 6 7 8 NCB GND NOCCOMC ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 8 of this data sheet. © Semiconductor Components Industries, LLC, 2008 July, 2008 − Rev. 0 1 Publication Order Number: NLAS3899B/D NLAS3899B COM NC NO IN Figure 1. Input Equivalent Circuit PIN DESCRIPTION QFN PIN # Symbol Name and Function 1, 3, 5, 7, 9, 11, 13, 15 NO A−D, NC A−D Independent Channels 2, 10 A−B IN, C−D IN 4, 8, 12, 16 COM A−D Controls 6 GND Ground (V) 14 VCC Positive Supply Voltage Common Channels TRUTH TABLE IN NO NC H ON OFF* L OFF* ON *High impedance. OPERATING CONDITIONS MAXIMUM RATINGS Symbol Pins Parameter Value Unit VCC VCC −0.5 to +5.5 V VIS NOx, NCx, or COMx Analog Signal Voltage −0.5 to VCC + 0.5 V VIN A−B IN, C−D IN Control Input Voltage −0.5 to 5.5 V IIS_CON NOx, NCx, or COMx Analog Signal Continuous Current ±300 Closed Switch mA IIS_PK NOx, NCx, or COMx Analog Signal Peak Current ±500 10% Duty Cycle mA IIN A−B IN, C−D IN Control Input Current ±20 mA −65 to 150 °C TSTG Positive DC Supply Voltage Condition Storage Temperature Range Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. http://onsemi.com 2 NLAS3899B RECOMMENDED OPERATING CONDITIONS Symbol Pins VCC VCC VIS NOx, NCx, or COMx VIN A−B IN, C−D IN Parameter Value Positive DC Supply Voltage Condition Unit 1.65 to 4.3 V Analog Signal Voltage GND to VCC V Control Input Voltage GND to 4.3 V TA Operating Temperature Range −40 to +85 °C tr, tf Input Rise or Fall Time 20 VCC = 1.6 V − 2.7 V 10 VCC = 3.0 V − 4.5 V ns/V Minimum and maximum values are guaranteed through test or design across the Recommended Operating Conditions, where applicable. Typical values are listed for guidance only and are based on the particular conditions listed for each section, where applicable. These conditions are valid for all values found in the characteristics tables unless otherwise specified in the test conditions. ESD PROTECTION Pins Description Minimum Voltage All Pins Human Body Model 1 kV I/O to GND Human Body Model 5 kV http://onsemi.com 3 NLAS3899B DC Electrical Characteristics Typical: T = 25°C; VCC = 3.0 V CONTROL INPUT (Typical: T = 25°C; VCC = 3.0 V) Parameter Test Conditions Min 1.3 1.6 Symbol Pins VIH A−B IN, C−D IN Control Input High 3.0 4.3 VIL A−B IN, C−D IN Control Input Low 3.0 4.3 IIN A−B IN, C−D IN Control Input Leakage 0 v VIN v VCC −405C to +855C VCC (V) 4.3 Typ Max Unit V ±0.1 0.5 0.6 V ±1.0 A SUPPLY CURRENT AND LEAKAGE (Typical: T = 25°C; VCC = 3.0 V) VCC (V) −405C to +855C Symbol Pins Parameter Typ Max Unit INO/NC (OFF) NCx, NOx OFF State Leakage VIN = VIL or VIH VNC/NO = 0.3 V VCOM = 4.0 V 4.3 ±10 ±300 nA ICOM (ON) COMx ON State Leakage VIN = VIL or VIH VNO = 0.3 V or 4.0 V with VNC floating or VNC = 0.3 V or 4.0 V with VNO floating VCOM = 0.3 V or 4.0 V 4.3 ±10 ±300 nA ICC VCC Quiescent Supply VIN and VIS = VCC or GND ID = 0 A 1.65 − 4.3 ±1.0 ±2.0 A IOFF A−B IN, C−D IN Power Off Leakage 0 ±0.5 ±2.0 A Test Conditions VIN = 4.3 V or GND Min ON RESISTANCE (Typical: T = 25°C; VCC = 3.0 V) Parameter VCC (V) −405C to +855C Typ Max Unit 2.5 3.0 3.6 4.3 3.0 2.6 2.5 2.2 4.0 3.0 3.0 2.5 ION = −100 mA VIS = 0 to VCC 3.0 4.3 0.8 1.1 ION = −100 mA VIS = 0 to VCC 3.0 4.3 0.8 0.7 Symbol Pins Test Conditions RON NOx, NCx COMx ON Resistance ION = −100 mA VIS = 0 to VCC RFLAT NOx, NCx COMx RON Flatness RON NOx, NCx COMx RON Matching http://onsemi.com 4 Min NLAS3899B AC ELECTRICAL CHARACTERISTICS TIMING/FREQUENCY (Typical: T = 25°C; VCC = 3.0 V, RL = 50 , CL = 35 pF, f = 1 MHz) Symbol Pins tON IN to NCx or NOx Turn On Time tOFF IN to NCx or NOx Turn Off Time tBBM IN to NCx or NOx Break Before Make BW Parameter −3dB Bandwidth Test Conditions VCC (V) Typ Max Unit 2.3 − 4.3 30 40 ns 2.3 − 4.53 20 30 ns 3.0 CL = 5 pF −405C to +855C Min 2 1.65 − 4.3 15 ns 280 MHz ISOLATION AND THD (Typical: T = 25°C; VCC = 3.0 V, RL = 50 , CL = 5 pF, f = 1 MHz) Symbol Pins Q Parameter Test Conditions VCC (V) −405C to +855C Min Typ Max Unit Charge Injection VIN = VCC to GND RIS = 0 , CL = 1.0 nF Q = CL − ΔVOUT 1.65 − 4.3 111 pC THD Total Harmonic Distortion FIS = 20 Hz to 20 kHz RL = Rgen = 600 , CL = 1.0 pF VIS = 1.0 VPP 3.0 0.007 % VONL Maximum Feedthrough On Loss VIN = 0 dBm @ 100 kHz to 50 MHz VIN centered between VCC & GND 1.65 − 4.3 −0.06 dB Off Isolation VIN = 0 VNO or VNC (pk−pk) = 1.0 V 1.65 − 4.3 −67 dB Non−Adjacent Chan- VNO or VNC (pk−pk) = 1.0 V nel 1.65 − 4.3 −100 dB OIRR NOx Xtalk COMx to COMy CAPACITANCE (Typical: T = 25°C; VCC = 3.0 V, RL = 50 , CL = 5 pF, f = 1 MHz) Symbol Pins CIN A−B IN, C−D IN Control Input Parameter CON NCx to COMx Through Switch COFF NCx NOx Unselected Port Test Conditions VCC (V) −405C to +855C Min Typ Max Unit 0V 5.0 pF VIN = 0V 3.0 V 20 pF VIS = 3.0V, VIN = 3.0V 3.0 V 10 pF http://onsemi.com 5 NLAS3899B 0.014 0.00035 0.012 4.3 V @ 25°C 4.3 V @ 25°C 0.00030 0.010 0.00025 3.6 V @ 25°C 3.6 V @ 25°C ICC (A) ICC (A) 0.008 0.006 0.00020 0.004 3.0 V @ 25°C 3.0 V @ 25°C 0.00015 0.002 0.00010 0 −0.002 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Vin (V) Vin (V) Figure 2. ICC vs. Vin Figure 3. (Expanded View) ICC vs. Vin VCC DUT VCC Input Output GND VOUT 0.1 F 50 tBMM 35 pF 90% 90% of VOH Output Switch Select Pin GND Figure 4. tBBM (Time Break−Before−Make) VCC DUT VCC 0.1 F Input Output VOUT Open 50 50% 50% 0V VOH 35 pF 90% 90% Output VOL Input tON Figure 5. tON/tOFF VCC VCC Input DUT Output 50% 50% 0V 50 VOUT Open tOFF VOH 35 pF Output Input Figure 6. tON/tOFF http://onsemi.com 6 10% 10% VOL tOFF tON NLAS3899B 50 DUT Reference Transmitted Input Output 50 Generator 50 Channel switch control/s test socket is normalized. Off isolation is measured across an off channel. On loss is the bandwidth of an On switch. VISO, Bandwidth and VONL are independent of the input signal direction. ǒVVOUT Ǔ for VIN at 100 kHz IN VOUT Ǔ for VIN at 100 kHz to 50 MHz VONL = On Channel Loss = 20 Log ǒ VIN VISO = Off Channel Isolation = 20 Log Bandwidth (BW) = the frequency 3 dB below VONL VCT = Use VISO setup and test to all other switch analog input/outputs terminated with 50 Figure 7. Off Channel Isolation/On Channel Loss (BW)/Crosstalk (On Channel to Off Channel)/VONL DUT VCC VIN Output Open GND CL Output Off VIN Figure 8. Charge Injection: (Q) http://onsemi.com 7 On Off VOUT NLAS3899B DEVICE ORDERING INFORMATION Package Type Tape & Reel Size† NLAS3899BMNTBG WQFN16 (Pb−Free) 3000 / Tape & Reel NLAS3899BMNTXG QFN16 (Pb−Free) 3000 / Tape & Reel Device Order Number †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 8 NLAS3899B PACKAGE DIMENSIONS WQFN16 (1.8x2.6x0.4P) CASE 488AP−01 ISSUE A D PIN 1 REFERENCE 2X 2X A ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. 5. EXPOSED PADS CONNECTED TO DIE FLAG. USED AS TEST CONTACTS. E DIM A A1 A3 b D E e L L1 0.15 C 0.15 C B A 0.10 C 0.08 C SEATING PLANE A1 MOUNTING FOOTPRINT C A3 5 8 0.562 0.0221 15 X L 0.400 0.0157 9 4 0.225 0.0089 1 e 1 12 2.900 0.1142 16 L1 MILLIMETERS MIN MAX 0.70 0.80 0.00 0.050 0.20 REF 0.15 0.25 1.80 BSC 2.60 BSC 0.40 BSC 0.30 0.50 0.40 0.60 16 X b 0.463 0.0182 0.10 C A B 0.05 C 1.200 0.0472 NOTE 3 2.100 0.0827 SCALE 20:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 9 NLAS3899B PACKAGE DIMENSIONS QFN16 3*3*0.85 MM, 0.5 P CASE 485AE−01 ISSUE O D PIN 1 LOCATION ÇÇÇ ÇÇÇ ÇÇÇ 0.15 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. 5. OUTLINE MEETS JEDEC DIMENSIONS PER MO−220, VARIATION VEED−6. A B E DIM A A1 A3 b D D2 E E2 e K L TOP VIEW 0.15 C (A3) 0.10 C A 16 X SEATING PLANE 0.08 C SIDE VIEW MILLIMETERS MIN NOM MAX 0.800 0.900 1.000 0.000 0.025 0.050 0.200 REF 0.180 0.250 0.300 3.00 BSC 1.250 1.40 1.550 3.00 BSC 1.250 1.40 1.550 0.500 BSC 0.200 −−− −−− 0.300 0.400 0.500 A1 C D2 16X L 5 NOTE 5 8 e 4 16X EXPOSED PAD 9 E2 K 12 1 16 16X 0.10 C A B 0.05 C 13 b BOTTOM VIEW NOTE 3 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 http://onsemi.com 10 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NLAS3899B/D