MC74LCX139 D

MC74LCX139
Dual Low-Voltage CMOS
2-to-4 Decoder/Demultiplexer
With 5 V−Tolerant Inputs
The MC74LCX139 is a high performance, 2−to−4 decoder/
demultiplexer operating from a 2.3 to 3.6 V supply. High impedance
TTL compatible inputs significantly reduce current loading to input
drivers while TTL compatible outputs offer improved switching noise
performance. A VI specification of 5.5 V allows MC74LCX139 inputs
to be safely driven from 5 V devices. The MC74LCX139 is suitable
for memory address decoding and other TTL level bus oriented
applications.
The MC74LCX139 high−speed 2−to−4 decoder/demultiplexer
accepts two binary weighted inputs (A0, A1) and, when enabled,
provides four mutually exclusive active−LOW outputs. The LCX139
features an active low Enable input. All outputs will be HIGH unless
En is LOW. The LCX139 can be used as an 8−output demultiplexer by
using one of the active−LOW Enable inputs as the data input and the
other Enable input as a strobe. The Enable inputs which are not used
must be permanently tied to ground.
Current drive capability is 24 mA at the outputs.
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MARKING
DIAGRAMS
16
SOIC−16
D SUFFIX
CASE 751B
16
1
1
16
16
1
LCX
139
ALYWG
G
TSSOP−16
DT SUFFIX
CASE 948F
1
Features






LCX139G
AWLYWW
Designed for 2.3 to 3.6 V VCC Operation
5 V Tolerant Inputs − Interface Capability With 5 V TTL Logic
LVTTL Compatible
LVCMOS Compatible
A
WL, L
Y
WW, W
G or G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
24 mA Balanced Output Sink and Source Capability
Near Zero Static Supply Current (10 mA) Substantially Reduces
System Power Requirements
Latchup Performance Exceeds 500 mA

 ESD Performance:
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
Human Body Model >2000 V
Machine Model >200 V
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant



 Semiconductor Components Industries, LLC, 2012
October, 2012 − Rev. 7
1
Publication Order Number:
MC74LCX139/D
MC74LCX139
Ea
1
16
VCC
A0a
2
15
Eb
A1a
3
14
A1a
A0a
A0b
Ea
3
2
1
Y0a
4
13
A1b
Y1a
5
12
Y0b
Y2a
6
11
Y1b
A1b 13
A0b 14
Y3a
7
10
Y2b
Eb 15
GND
8
9
Y3b
X/Y
1
4 Y0a
5 Y1a
0
2
1
EN
2
6 Y2a
7 Y3a
12 Y0b
3
11 Y1b
10 Y2b
9 Y3b
Figure 1. Pin Assignment
A0a
Ea
3
2
1
DMUX
0
0
G
3
1
1
0
2
3
A1b 13
A0b 14
4 Y0a
5 Y1a
6 Y2a
7 Y3a
12 Y0b
11 Y1b
10 Y2b
9 Y3b
Eb 15
Figure 2. IEC Logic Diagram
PIN NAMES
Pins
Function
A0n−A1n
Address Inputs
En
Enable Inputs
Y0n−Y3n
Outputs
ADDRESS
INPUTS
A0a
A1a
Ea
TRUTH TABLE
Inputs
A1a
Outputs
E
A1
A0
Y0
Y1
Y2
Y3
H
X
X
H
H
H
H
L
L
L
L
H
H
H
L
L
H
H
L
H
H
L
H
L
H
H
L
H
L
H
H
H
H
H
L
ADDRESS
INPUTS
A0b
A1b
2
3
4
Y0a
5 Y1a
6
Y2a
7
Y3a
1
14
12
13
11
10
9
Eb
H = High Voltage Level;
L = Low Voltage Level;
Z = High Impedance State
Y0b
Y1b
Y2b
Y3b
15
Figure 3. Logic Diagram
En
Y0
Y1
A0
Y2
Y3
A1
Figure 4. Expanded Logic Diagram
(1/2 of Device)
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2
ACTIVE−LOW
OUTPUTS
ACTIVE−LOW
OUTPUTS
MC74LCX139
MAXIMUM RATINGS
Symbol
VCC
Parameter
Value
DC Supply Voltage
VI
DC Input Voltage
VO
DC Output Voltage
IIK
IOK
Condition
Units
−0.5 to +7.0
V
−0.5  VI  +7.0
V
−0.5  VO  VCC + 0.5
Output in HIGH or LOW State. (Note 1)
V
DC Input Diode Current
−50
VI < GND
mA
DC Output Diode Current
−50
VO < GND
mA
+50
VO > VCC
mA
IO
DC Output Source/Sink Current
50
mA
ICC
DC Supply Current Per Supply Pin
100
mA
IGND
DC Ground Current Per Ground Pin
100
mA
TSTG
Storage Temperature Range
−65 to +150
C
MSL
Moisture Sensitivity
Level 1
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. IO absolute maximum rating must be observed.
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Parameter
Supply Voltage
Operating
Data Retention Only
Min
Typ
Max
2.0
1.5
2.3 to 3.3
3.6
3.6
Units
V
VI
Input Voltage
0
5.5
V
VO
Output Voltage (HIGH or LOW State)
0
VCC
V
IOH
HIGH Level Output Current
VCC = 3.0 V − 3.6 V
VCC = 2.7 V − 3.0 V
VCC = 2.3 V − 2.7 V
−24
−12
−8
IOL
LOW Level Output Current
VCC = 3.0 V − 3.6 V
VCC = 2.7 V − 3.0 V
VCC = 2.3 V − 2.7 V
+24
+12
+8
TA
Operating Free−Air Temperature
Dt/DV
Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V
mA
mA
−40
+85
C
0
10
ns/V
ORDERING INFORMATION
Package
Shipping†
MC74LCX139DR2G
SOIC−16
(Pb−Free)
2500 Tape & Reel
MC74LCX139DTG
TSSOP−16
(Pb−Free)
96 Units / Rail
MC74LCX139DTR2G
TSSOP−16
(Pb−Free)
2500 Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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3
MC74LCX139
DC ELECTRICAL CHARACTERISTICS
TA = −40C to +85C
Symbol
VIH
VIL
VOH
VOL
IOFF
Characteristic
HIGH Level Input Voltage (Note 2)
LOW Level Input Voltage (Note 2)
HIGH Level Output Voltage
LOW Level Output Voltage
Power Off Leakage Current
Condition
Min
2.3 V  VCC  2.7 V
1.7
2.7 V  VCC  3.6 V
2.0
Max
Units
V
2.3 V  VCC  2.7 V
0.7
2.7 V  VCC  3.6 V
0.8
2.3 V  VCC  3.6 V; IOL = 100 mA
VCC − 0.2
VCC = 2.3 V; IOH = −8 mA
1.7
VCC = 2.7 V; IOH = −12 mA
2.2
VCC = 3.0 V; IOH = −18 mA
2.4
VCC = 3.0 V; IOH = −24 mA
2.2
V
V
2.3 V  VCC  3.6 V; IOL = 100 mA
0.2
VCC = 2.3 V; IOL = 8 mA
0.7
VCC = 2.7 V; IOL = 12 mA
0.4
V
VCC = 3.0 V; IOL = 16 mA
0.4
VCC = 3.0 V; IOL = 24 mA
0.55
VCC = 0, VIN = 5.5 V or VOUT = 5.5 V
10
mA
IIN
Input Leakage Current
VCC = 3.6 V, VIN = 5.5 V or GND
5
mA
ICC
Quiescent Supply Current
VCC = 3.6 V, VIN = 5.5 V or GND
10
mA
2.3  VCC  3.6 V; VIH = VCC − 0.6 V
500
mA
DICC
Increase in ICC per Input
2. These values of VI are used to test DC electrical characteristics only.
AC CHARACTERISTICS (tR = tF = 2.5 ns; CL = 50 pF; RL = 500 W)
Limits
TA = −405C to +855C
Symbol
Parameter
VCC = 3.0 V to 3.6 V
VCC = 2.7 V
VCC = 2.3 V to 2.7 V
CL = 50 pF
CL = 50 pF
CL = 30pF
Min
Max
Min
Max
Min
Max
Units
tPLH
tPHL
Propagation Delay
A to Y
0.8
0.8
6.2
6.2
1.0
1.0
7.3
7.3
0.8
0.8
9.3
9.3
ns
tPLH
tPHL
Propagation Delay
E to Y
0.8
0.8
4.7
4.7
1.0
1.0
5.2
5.2
0.8
0.8
7.2
7.2
ns
tOSHL
tOSLH
Output−to−Output Skew (Note 3)
1.0
1.0
ns
3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter
guaranteed by design.
CAPACITIVE CHARACTERISTICS
Symbol
Condition
Typical
Units
Input Capacitance
VCC = 3.3 V, VI = 0 V or VCC
7
pF
COUT
Output Capacitance
VCC = 3.3 V, VI = 0 V or VCC
8
pF
CPD
Power Dissipation Capacitance
10MHz, VCC = 3.3 V, VI = 0 V or VCC
25
pF
CIN
Parameter
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4
MC74LCX139
A
VCC
50%
GND
tPHL
tPLH
50% VCC
Y
Figure 5. Waveform 1 Prop Delays
E
VCC
50%
GND
tPLH
tPHL
Y
50% VCC
Figure 6. Waveform 2 Output Enable
VCC
PULSE
GENERATOR
DUT
RT
CL
CL = 50 pF or equivalent (Includes jig and probe capacitance)
RL = R1 = 500 W or equivalent
RT = ZOUT of pulse generator (typically 50 W)
Figure 7. Test Circuit
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5
RL
MC74LCX139
PACKAGE DIMENSIONS
TSSOP−16
DT SUFFIX
CASE 948F
ISSUE B
16X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
S
V
S
K
S
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
K1
2X
L/2
16
9
J1
B
−U−
L
SECTION N−N
J
PIN 1
IDENT.
N
8
1
0.25 (0.010)
M
0.15 (0.006) T U
S
A
−V−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
N
F
DETAIL E
−W−
C
0.10 (0.004)
−T− SEATING
PLANE
D
H
G
DETAIL E
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
16X
0.36
16X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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6
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
−−−
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.18
0.28
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.193 0.200
0.169 0.177
−−− 0.047
0.002 0.006
0.020 0.030
0.026 BSC
0.007
0.011
0.004 0.008
0.004 0.006
0.007 0.012
0.007 0.010
0.252 BSC
0_
8_
MC74LCX139
PACKAGE DIMENSIONS
SOIC−16
D SUFFIX
CASE 751B−05
ISSUE K
−A−
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
9
−B−
1
P
8 PL
0.25 (0.010)
8
M
B
S
G
R
K
DIM
A
B
C
D
F
G
J
K
M
P
R
F
X 45 _
C
−T−
SEATING
PLANE
J
M
D
16 PL
0.25 (0.010)
M
T B
S
A
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
S
SOLDERING FOOTPRINT*
8X
6.40
16X
1
1.12
16
16X
0.58
1.27
PITCH
8
9
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
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MC74LCX139/D