MC74VHC139 D

MC74VHC139
Dual 2-to-4 Decoder/
Demultiplexer
The MC74VHC139 is an advanced high speed CMOS 2−to−4
decoder/ demultiplexer fabricated with silicon gate CMOS
technology. It achieves high speed operation similar to equivalent
Bipolar Schottky TTL while maintaining CMOS low power
dissipation.
When the device is enabled (E = low), it can be used for gating or as
a data input for demultiplexing operations. When the enable input is
held high, all four outputs are fixed high, independent of other inputs.
The internal circuit is composed of three stages, including a buffer
output which provides high noise immunity and stable output. The
inputs tolerate voltages up to 7 V, allowing the interface of 5 V
systems to 3 V systems.
•
•
•
•
•
•
•
•
•
•
•
•
High Speed: tPD = 5.0 ns (Typ) at VCC = 5 V
Low Power Dissipation: ICC = 4 mA (Max) at TA = 25°C
High Noise Immunity: VNIH = VNIL = 28% VCC
Power Down Protection Provided on Inputs
Balanced Propagation Delays
Designed for 2 V to 5.5 V Operating Range
Low Noise: VOLP = 0.8 V (Max)
Pin and Function Compatible with Other Standard Logic Families
Latchup Performance Exceeds 300 mA
ESD Performance: Human Body Model > 2000 V;
Machine Model > 200 V
Chip Complexity: 100 FETs or 25 Equivalent Gates
These Devices are Pb−Free and are RoHS Compliant
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MARKING DIAGRAMS
16
9
VHC139
AWLYYWW
SOIC−16
D SUFFIX
CASE 751B
1
8
16
VHC
139
ALYW
TSSOP−16
DT SUFFIX
CASE 948F
A
WL, L
YY, Y
WW, W
9
1
8
= Assembly Location
= Wafer Lot
= Year
= Work Week
PIN ASSIGNMENT
Ea
1
16
VCC
A0a
2
15
Eb
A1a
3
14
A0b
Y0a
4
13
A1b
Y1a
5
12
Y0b
Y2a
6
11
Y1b
Y3a
7
10
Y2b
GND
8
9
Y3b
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
© Semiconductor Components Industries, LLC, 2011
May, 2011 − Rev. 4
1
Publication Order Number:
MC74VHC139/D
MC74VHC139
ADDRESS
INPUTS
A0a
A1a
2
4
3
5
6
7
Ea
ADDRESS
INPUTS
A0b
A1b
Y1a
Y2a
Inputs
ACTIVE-LOW
OUTPUTS
Y3a
1
14
13
12
11
10
9
Eb
Table 1. FUNCTION TABLE
Y0a
Y0b
Y1b
Y2b
Outputs
E
A1
A0
Y0
Y1
Y2
Y3
H
X
X
H
H
H
H
L
L
L
L
H
H
H
L
L
H
H
L
H
H
L
H
L
H
H
L
H
L
H
H
H
H
H
L
ACTIVE-LOW
OUTPUTS
Y3b
15
Figure 1. Logic Diagram
En
Y0
Y1
A0
Y2
Y3
A1
Figure 2. Expanded Logic Diagram
(1/2 of Device)
INPUT
A1a
3
A0a
2
Ea
1
X/Y
1
0
2
1
EN
2
3
4 Y0a
5 Y1a
A1a
3
A0a
2
6 Y2a
7 Y3a
Ea
1
0
1
DMUX
0
0
G
3
1
4 Y0a
5 Y1a
2
6 Y2a
7 Y3a
3
12 Y0b
12 Y0b
A1b 13
A0b 14
Eb 15
10 Y2b
A1b 13
A0b 14
10 Y2b
9 Y3b
Eb 15
9 Y3b
11 Y1b
Figure 3. Input Equivalent Circuit
Figure 4. IEC Logic Diagram
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2
11 Y1b
MC74VHC139
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MAXIMUM RATINGS
Symbol
Value
Unit
VCC
DC Supply Voltage
Parameter
–0.5 to +7.0
V
Vin
DC Input Voltage
–0.5 to +7.0
V
Vout
DC Output Voltage
–0.5 to VCC + 0.5
V
IIK
Input Diode Current
−20
mA
IOK
Output Diode Current
±20
mA
Iout
DC Output Current, per Pin
±25
mA
ICC
DC Supply Current, VCC and GND Pins
±75
mA
PD
Power Dissipation in Still Air,
500
450
mW
Tstg
Storage Temperature
–65 to +150
°C
SOIC Packages†
TSSOP Package†
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high−impedance circuit. For proper operation, Vin and
Vout should be constrained to the
range GND v (Vin or Vout) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or V CC ).
Unused outputs must be left open.
Maximum ratings are those values beyond which device damage can occur. Maximum ratings
applied to the device are individual stress limit values (not normal operating conditions) and are
not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
†Derating − SOIC Packages: – 7 mW/°C from 65° to 125°C
TSSOP Package: − 6.1 mW/°C from 65° to 125°C
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RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC
DC Supply Voltage
2.0
5.5
V
Vin
DC Input Voltage
0
5.5
V
Vout
DC Output Voltage
0
VCC
V
TA
Operating Temperature
−55
+125
°C
tr, tf
Input Rise and Fall Time
(Figure 3)
0
0
100
20
ns/V
VCC = 3.3 V ±0.3V
VCC =5.0 V ±0.5V
The qJA of the package is equal to 1/Derating. Higher junction temperatures may affect the
expected lifetime of the device per the table and figure below.
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
TJ = 80 ° C
117.8
TJ = 90 ° C
1,032,200
TJ = 100 ° C
80
TJ = 110° C
Time, Years
TJ = 120° C
Time, Hours
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
TJ = 130 ° C
Junction
Temperature (°C)
NORMALIZED FAILURE RATE
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
1
1
10
100
TIME, YEARS
Figure 5. Failure Rate vs. Time
Junction Temperature
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3
1000
MC74VHC139
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ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
DC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
Test Conditions
Min
1.5
2.1
3.15
3.85
VIH
Minimum
High−Level Input
Voltage
2.0
3.0
4.5
5.5
VIL
Maximum
Low−Level Input
Voltage
2.0
3.0
4.5
5.5
VOH
Minimum
High−Level Output
Voltage
VIN = VIH or VIL
VOL
Maximum
Low−Level Output
Voltage
VIN = VIH or VIL
TA = 25°C
VCC
(V)
Typ
TA = ≤ 85°C
Max
Min
2.0
3.0
4.5
1.9
2.9
4.4
VIN = VIH or VIL
IOH = −4 mA
IOH = −8 mA
3.0
4.5
2.58
3.94
VIN = VIH or VIL
IOL = 50 mA
2.0
3.0
4.5
VIN = VIH or VIL
IOL = 4 mA
IOL = 8 mA
Min
1.5
2.1
3.15
3.85
0.5
0.9
1.35
1.65
VIN = VIH or VIL
IOH = − 50 mA
TA = ≤ 125°C
Max
2.0
3.0
4.5
0.0
0.0
0.0
Max
Unit
1.5
2.1
3.15
3.85
0.5
0.9
1.35
1.65
V
0.5
0.9
1.35
1.65
1.9
2.9
4.4
1.9
2.9
4.4
2.48
3.80
2.34
3.66
V
V
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
3.0
4.5
0.36
0.36
0.44
0.44
0.52
0.52
V
IIN
Maximum Input
Leakage Current
VIN = 5.5 V or GND
0 to
5.5
± 0.1
± 1.0
± 1.0
mA
ICC
Maximum
Quiescent Supply
Current
VIN = VCC or GND
5.5
4.0
40.0
40.0
mA
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0ns)
TA = 25°C
Symbol
tPLH,
tPHL
tPLH,
tPHL
CIN
TA = − 55 to 125°C
Typ
Max
Min
Max
Min
Max
Unit
VCC = 3.3 ± 0.3 VCL = 15 pF
CL = 50 pF
7.2
9.7
11.0
14.5
1.0
1.0
13.0
16.5
1.0
1.0
13.0
16.5
ns
VCC = 5.0 ± 0.5 VCL = 15 pF
CL = 50 pF
5.0
6.5
7.2
9.2
1.0
1.0
8.5
10.5
1.0
1.0
8.5
10.5
VCC = 3.3 ± 0.3 VCL = 15 pF
CL = 50 pF
6.4
8.9
9.2
12.7
1.0
1.0
11.0
14.5
1.0
1.0
11.0
14.5
VCC = 5.0 ± 0.5 VCL = 15 pF
CL = 50 pF
4.4
5.9
6.3
8.3
1.0
1.0
7.5
9.5
1.0
1.0
7.5
9.5
4
10
Parameter
Test Conditions
Maximum
Propagation Delay,
A to Y
Maximum
Propagation Delay,
E to Y
Min
TA = − 40 to 85°C
Maximum Input
Capacitance
10
10
ns
pF
Typical @ 25°C, VCC = 5.0 V
CPD
26
Power Dissipation Capacitance (1)
pF
1. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC/2 (per decoder). CPD is used to determine the
no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC.
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4
MC74VHC139
SWITCHING WAVEFORMS
A
VCC
50%
GND
tPHL
tPLH
Y
50% VCC
Figure 6.
TEST POINT
OUTPUT
E
VCC
50%
GND
tPHL
Y
DEVICE
UNDER
TEST
CL*
tPLH
50% VCC
*Includes all probe and jig capacitance
Figure 7.
Figure 8. Test Circuit
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5
MC74VHC139
ORDERING INFORMATION
Package
Shipping†
MC74VHC139DR2G
SOIC−16
(Pb−Free)
2500 / Tape & Reel
MC74VHC139DTR2G
TSSOP−16
(Pb−Free)
2500 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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6
MC74VHC139
PACKAGE DIMENSIONS
SOIC−16
CASE 751B−05
ISSUE K
−A−
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
9
−B−
1
P
8 PL
0.25 (0.010)
8
M
B
S
G
R
K
F
X 45 _
C
−T−
SEATING
PLANE
J
M
D
16 PL
0.25 (0.010)
M
T B
S
A
S
SOLDERING FOOTPRINT
8X
6.40
16X
1
1.12
16
16X
0.58
1.27
PITCH
8
9
DIMENSIONS: MILLIMETERS
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7
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
MC74VHC139
PACKAGE DIMENSIONS
TSSOP−16
CASE 948F−01
ISSUE B
16X K REF
0.10 (0.004)
0.15 (0.006) T U
T U
M
S
V
S
K
S
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
K1
2X
L/2
16
9
J1
B
−U−
L
SECTION N−N
J
PIN 1
IDENT.
N
8
1
0.25 (0.010)
M
0.15 (0.006) T U
S
A
−V−
N
F
DETAIL E
C
0.10 (0.004)
−T− SEATING
PLANE
D
H
G
DETAIL E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
MILLIMETERS
INCHES
DIM MIN
MAX
MIN
MAX
A
4.90
5.10 0.193 0.200
B
4.30
4.50 0.169 0.177
C
−−−
1.20
−−− 0.047
D
0.05
0.15 0.002 0.006
F
0.50
0.75 0.020 0.030
G
0.65 BSC
0.026 BSC
H
0.18
0.28 0.007
0.011
−W−
J
0.09
0.20 0.004 0.008
J1
0.09
0.16 0.004 0.006
K
0.19
0.30 0.007 0.012
K1
0.19
0.25 0.007 0.010
L
6.40 BSC
0.252 BSC
M
0_
8_
0_
8_
SOLDERING FOOTPRINT
7.06
1
0.65
PITCH
16X
0.36
16X
1.26
DIMENSIONS: MILLIMETERS
ON Semiconductor and
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MC74VHC139/D