MC74LVX138 D

MC74LVX138
3-to-8 Line Decoder
With 5V−Tolerant Inputs
The MC74LVX138 is an advanced high speed CMOS 3−to−8 line
decoder. The inputs tolerate voltages up to 7.0 V, allowing the
interface of 5.0 V systems to 3.0 V systems.
When the device is enabled, three Binary Select inputs (A0 − A2)
determine which one of the outputs (O0 − O7) will go Low. When
enable input E3 is held Low or either E2 or E1 is held High, decoding
function is inhibited and all outputs go high. E3, E2, and E1 inputs are
provided to ease cascade connection and for use as an address decoder
for memory systems.
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SOIC−16
D SUFFIX
CASE 751B
Features
•
•
•
•
•
•
•
•
•
TSSOP−16
DT SUFFIX
CASE 948F
PIN ASSIGNMENT
High Speed: tPD = 5.5 ns (Typ) at VCC = 3.3 V
Low Power Dissipation: ICC = 4 mA (Max) at TA = 25 °C
Power Down Protection Provided on Inputs
Balanced Propagation Delays
Low Noise: VOLP = 0.5 V (Max)
Pin and Function Compatible with Other Standard Logic Families
Latchup Performance Exceeds 300 mA
ESD Performance:
Human Body Model > 2000 V;
Machine Model > 200 V
These Devices are Pb−Free and are RoHS Compliant
VCC
O0
O1
O2
O3
O4
O5
O6
16
15
14
13
12
11
10
9
7
8
1
2
3
4
5
6
A0
A1
A2
E1
E2
E3
O7 GND
16−Lead (Top View)
PIN NAMES
Pins
Function
A0−A2
E1−E2
E3
O0−O7
Address Inputs
Enable Inputs
Enable Input
Outputs
MARKING DIAGRAMS
16
16
LVX
138
ALYWG
G
LVX138G
AWLYWW
1
1
SOIC−16
LVX138
A
WL, L
Y
WW, W
G or G
TSSOP−16
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
August, 2014 − Rev. 4
1
Publication Order Number:
MC74LVX138/D
MC74LVX138
15
14
1
A0
13
12
SELECT
INPUTS
2
A1
11
10
3
A2
9
7
4
E1
ENABLE
INPUTS
O0
O1
O2
O3
DATA
OUTPUTS
O4
O5
O6
O7
5
E2
6
E3
Figure 1. Logic Diagram
INPUTS
OUTPUTS
E1
E2
E3
A0
A1
A2
O0
O1
O2
O3
O4
O5
O6
O7
H
X
X
X
H
X
X
X
L
X
X
X
X
X
X
X
X
X
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
L
L
L
L
L
L
L
H
H
H
H
L
H
L
H
L
L
H
H
L
L
L
L
L
H
H
H
H
L
H
H
H
H
L
H
H
H
H
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
L
L
L
L
L
L
L
H
H
H
H
L
H
L
H
L
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
H
H
H
H
L
H
H
H
H
L
H
H
H
H
L
H = High Voltage Level; L = Low Voltage Level; X = High or Low Voltage Level and Transitions Are Acceptable; For ICC reasons, DO NOT FLOAT
Inputs
A0
A1
A2
`04
A3
A4
H
123
A0 A1 A2
E
O0 O1 O2 O3 O4 O5 O6 O7
123
A0 A1 A2
123
E
A0 A1 A2
O0 O1 O2 O3 O4 O5 O6 O7
E
O0 O1 O2 O3 O4 O5 O6 O7
O0
123
A0 A1 A2
E
O0 O1 O2 O3 O4 O5 O6 O7
O31
Figure 2. Expansion to 1−of−32 Decoding
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2
MC74LVX138
MAXIMUM RATINGS
Symbol
Value
Unit
VCC
DC Supply Voltage
Parameter
–0.5 to +7.0
V
Vin
DC Input Voltage
–0.5 to +7.0
V
Vout
DC Output Voltage
–0.5 to VCC +0.5
V
IIK
Input Diode Current
−20
mA
IOK
Output Diode Current
±20
mA
Iout
DC Output Current, per Pin
±25
mA
ICC
DC Supply Current, VCC and GND Pins
±75
mA
PD
Power Dissipation
180
mW
Tstg
Storage Temperature
–65 to +150
_C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
2.0
3.6
V
VCC
DC Supply Voltage
Vin
DC Input Voltage
0
5.5
V
Vout
DC Output Voltage
0
VCC
V
−40
+85
_C
0
100
ns/V
TA
Dt/DV
Operating Temperature, All Package Types
Input Rise and Fall Time
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
VCC
V
TA = 25°C
TA = −40 to 85°C
Min
Typ
Max
Min
Max
Unit
VIH
High−Level Input Voltage
2.0
3.0
3.6
1.5
2.0
2.4
−
−
−
−
−
−
1.5
2.0
2.4
−
−
−
V
VIL
Low−Level Input Voltage
2.0
3.0
3.6
−
−
−
−
−
−
0.5
0.8
0.8
−
−
−
0.5
0.8
0.8
V
VOH
High−Level Output Voltage
(Vin = VIH or VIL)
IOH = −50mA
IOH = −50mA
IOH = −4mA
2.0
3.0
3.0
1.9
2.9
2.58
2.0
3.0
−
−
−
−
1.9
2.9
2.48
−
−
−
V
VOL
Low−Level Output Voltage
(Vin = VIH or VIL)
IOL = 50mA
IOL = 50mA
IOL = 4mA
2.0
3.0
3.0
−
−
−
0.0
0.0
−
0.1
0.1
0.36
−
−
−
0.1
0.1
0.44
V
Iin
Input Leakage Current
Vin = 5.5V or GND
3.6
−
−
±0.1
−
±1.0
mA
ICC
Quiescent Supply Current
Vin = VCC or GND
3.6
−
−
4.0
−
40.0
mA
Symbol
Parameter
Test Conditions
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
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3
MC74LVX138
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0ns)
TA = 25°C
Symbol
tPLH,
tPHL
tPLH,
tPHL
tPLH,
tPHL
tOSHL
tOSLH
Parameter
Test Conditions
Propagation Delay
Input to Output
Propagation Delay
E3 to O
Propagation Delay
E1 or E2 to O
Output−to−Output Skew
(Note 1)
TA = −40 to 85°C
Min
Typ
Max
Min
Max
Unit
ns
VCC = 2.7V
CL = 15pF
CL = 50pF
−
−
7.1
9.6
13.8
17.3
1.0
1.0
16.5
20.0
VCC = 3.3 ± 0.3V
CL = 15pF
CL = 50pF
−
−
5.5
8.0
8.8
12.3
1.0
1.0
10.5
14.0
VCC = 2.7V
CL = 15pF
CL = 50pF
−
−
8.7
11.2
16.3
19.8
1.0
1.0
19.5
23.0
VCC = 3.3 ± 0.3V
CL = 15pF
CL = 50pF
−
−
6.8
9.3
10.6
14.1
1.0
1.0
12.5
16.0
VCC = 2.7V
CL = 15pF
CL = 50pF
−
−
8.8
11.3
16.0
19.5
1.0
1.0
18.5
22.0
VCC = 3.3 ± 0.3V
CL = 15pF
CL = 50pF
−
−
6.9
9.4
10.4
13.9
1.0
1.0
11.5
15.0
VCC = 2.7V
VCC = 3.3 ± 0.3V
CL = 50pF
CL = 50pF
−
−
−
−
2.5
2.5
−
−
2.5
2.5
ns
ns
ns
1. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter
guaranteed by design.
CAPACITIVE CHARACTERISTICS
TA = 25°C
Symbol
Parameter
TA = −40 to 85°C
Min
Typ
Max
Min
Max
Unit
Cin
Input Capacitance
−
4
10
−
10
pF
CPD
Power Dissipation Capacitance (Note 2)
−
34
−
−
−
pF
2. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC . CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
NOISE CHARACTERISTICS (Input tr = tf = 3.0ns, CL = 50pF, VCC = 3.3V, Measured in SOIC Package)
TA = 25°C
Symbol
Characteristic
Typ
Max
Unit
VOLP
Quiet Output Maximum Dynamic VOL
−
0.5
V
VOLV
Quiet Output Minimum Dynamic VOL
−
−0.5
V
VIHD
Minimum High Level Dynamic Input Voltage
−
2.0
V
VILD
Maximum Low Level Dynamic Input Voltage
−
0.8
V
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4
MC74LVX138
SWITCHING WAVEFORMS
VALID
A
VALID
VCC
50%
tPLH
tPHL
tPHL
O
50%
GND
GND
tPLH
VCC
E3
50% VCC
50% VCC
O
Figure 3. .
Figure 4. .
VCC
E2 or E1
50%
GND
tPHL
O
tPLH
50% VCC
Figure 5.
TEST CIRCUIT
TEST POINT
OUTPUT
DEVICE
UNDER
TEST
CL*
*Includes all probe and jig capacitance
Figure 6.
ORDERING INFORMATION
Package
Shipping†
MC74LVX138DR2G
SOIC−16
(Pb−Free)
2500 Tape & Reel
MC74LVX138DTR2G
TSSOP−16
(Pb−Free)
2500 Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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5
MC74LVX138
PACKAGE DIMENSIONS
TSSOP−16
CASE 948F
ISSUE B
16X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
S
V
S
S
K
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
K1
2X
L/2
16
9
J1
B
−U−
L
SECTION N−N
J
PIN 1
IDENT.
N
0.25 (0.010)
8
1
M
0.15 (0.006) T U
S
A
−V−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
N
F
DETAIL E
−W−
C
0.10 (0.004)
−T− SEATING
PLANE
H
D
DETAIL E
G
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
16X
0.36
16X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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6
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
−−−
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.18
0.28
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.193 0.200
0.169 0.177
−−− 0.047
0.002 0.006
0.020 0.030
0.026 BSC
0.007
0.011
0.004 0.008
0.004 0.006
0.007 0.012
0.007 0.010
0.252 BSC
0_
8_
MC74LVX138
PACKAGE DIMENSIONS
SOIC−16
CASE 751B−05
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
−A−
16
9
−B−
1
P
8 PL
0.25 (0.010)
8
M
B
S
DIM
A
B
C
D
F
G
J
K
M
P
R
G
R
K
F
X 45 _
C
−T−
SEATING
PLANE
J
M
D
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
16 PL
0.25 (0.010)
M
T B
S
A
S
SOLDERING FOOTPRINT*
8X
6.40
16X
1
1.12
16
16X
0.58
1.27
PITCH
8
9
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
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MC74LVX138/D