74FST3125

FST3125
4-Bit Bus Switch
The ON Semiconductor FST3125 is a quad, high performance
switch. The device is CMOS TTL compatible when operating between
4 and 5.5 Volts. The device exhibits extremely low RON and adds
nearly zero propagation delay. The device adds no noise or ground
bounce to the system.
The device consists of four independent 1−bit switches with
separate Output/Enable (OE) pins. Port A is connected to Port B when
OE is low. If OE is high, the switch is high Z.
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MARKING
DIAGRAMS
Features
•
•
•
•
•
•
•
•
14
14
RON t 4 W Typical
Less Than 0.25 ns−Max Delay Through Switch
Nearly Zero Standby Current
No Circuit Bounce
Control Inputs are TTL/CMOS Compatible
Pin−For−Pin Compatible With QS3125, FST3125, CBT3125
All Popular Packages: TSSOP−14, SOIC−14
These are Pb−Free Devices
FST3125G
AWLYWW
1
SOIC−14
D SUFFIX
CASE 751A
1
14
14
FST
3125
ALYWG
G
1
TSSOP−14
DT SUFFIX
CASE 948G
OE1
1A
1B
OE2
2A
2B
GND
1
2
3
4
5
6
7
14
13
12
11
10
9
8
VCC
OE4
4A
4B
OE3
3A
3B
1
A
= Assembly Location
WL, L = Wafer Lot
Y
= Year
WW, W = Work Week
G or G = Pb−Free Package
(Note: Microdot may be in either location)
Figure 1. Pin Assignment for
SOIC and TSSOP
PIN NAMES
Pin
OE1, OE2, OE3, OE4
Description
Bus Switch Enables
1A, 2A, 3A, 4A
Bus A
1B, 2B, 3B, 4B
Bus B
NC
Not Connected
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2013
June, 2013 − Rev. 0
1
Publication Order Number:
FST3125/D
FST3125
OE1
1A
OE2
2A
OE3
3A
OE4
4A
1
2
3
1B
4
5
6
2B
10
9
8
3B
13
12
11
4B
Figure 2. Logic Diagram
TRUTH TABLE
Inputs
Outputs
OE
A, B
L
A=B
H
Z
ORDERING INFORMATION
Package
Shipping†
FST3125DR2G
SOIC−14
(Pb−Free)
2500 Units / Tape & Reel
FST3125DTR2G
TSSOP−14
(Pb−Free)
2500 Units / Tape & Reel
Device Order Number
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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2
FST3125
MAXIMUM RATINGS
Symbol
Value
Unit
DC Supply Voltage
*0.5 to )7.0
V
VI
DC Input Voltage
*0.5 to )7.0
V
VO
DC Output Voltage
*0.5 to )7.0
V
VI t GND
*50
mA
VO t GND
*50
mA
128
mA
VCC
Parameter
IIK
DC Input Diode Current
IOK
DC Output Diode Current
IO
DC Output Sink Current
ICC
DC Supply Current per Supply Pin
$100
mA
IGND
DC Ground Current per Ground Pin
$100
mA
TSTG
Storage Temperature Range
*65 to )150
_C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
TJ
Junction Temperature Under Bias
qJA
Thermal Resistance (Note 1)
MSL
Moisture Sensitivity
FR
Flammability Rating
VESD
ILatchup
SOIC
TSSOP
_C
_C
125
170
_C/W
Level 1
Oxygen Index: 28 to 34
ESD Withstand Voltage
Latchup Performance
260
)150
UL 94 V−0 @ 0.125 in
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model
u4000
u400
u2000
V
Above VCC and Below GND at 85_C (Note 4)
$100
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Parameter
Supply Voltage
VI
Input Voltage
VO
Output Voltage
TA
Operating Free−Air Temperature
Dt/DV
Input Transition Rise or Fall Rate
Min
Max
Unit
4.0
5.5
V
(Note )
0
5.5
V
(HIGH or LOW State)
0
5.5
V
−55
+125
_C
0
0
5
DC
ns/V
Operating, Data Retention Only
Switch Control Input
Switch I/O
5. Unused control inputs may not be left open. All control inputs must be tied to a high− or low−logic input voltage level.
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3
FST3125
DC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
VIK
Clamp Diode Resistance
VIH
High−Level Input Voltage
VIL
Low−Level Input Voltage
Conditions
IIN = *18mA
VCC
TA = −55_C to +125_C
(V)
Min
Typ*
4.5
4.0 to 5.5
Max
Unit
*1.2
V
2.0
V
4.0 to 5.5
0.8
V
Input Leakage Current
0 v VIN v 5.5 V
5.5
$1.0
mA
IOZ
OFF−STATE Leakage Current
0 v A, B v VCC
5.5
$1.0
mA
RON
Switch On Resistance (Note 6)
VIN = 0 V, IIN = 64 mA
4.5
4
7
W
VIN = 0 V, IIN = 30 mA
4.5
4
7
VIN = 2.4 V, IIN = 15 mA
4.5
8
15
11
20
II
VIN = 2.4 V, IIN = 15 mA
4.0
ICC
Quiescent Supply Current
VIN = VCC or GND, IOUT = 0
5.5
3
mA
DICC
Increase In ICC per Input
One input at 3.4 V, Other inputs at VCC or GND
5.5
2.5
mA
*Typical values are at VCC = 5.0 V and TA = 25_C.
6. Measured by the voltage drop between A and B pins at the indicated current through the switch.
AC ELECTRICAL CHARACTERISTICS
Limits
TA = −55_C to +125_C
VCC = 4.5 to 5.5 V
Symbol
Parameter
Conditions
Figures
Min
Max
VCC = 4.0 V
Min
Max
Unit
0.25
0.25
ns
tPHL,
tPLH
Prop Delay Bus to Bus
(Note 7)
VI = OPEN
3 and 4
tPZH,
tPZL
Output Enable Time
VI = 7 V for tPZL
VI = OPEN for tPZH
3 and 5
1.0
5.0
5.5
ns
tPHZ,
tPLZ
Output Disable Time
VI = 7 V for tPLZ
VI = OPEN for tPHZ
3 and 5
1.5
5.3
5.6
ns
7. This parameter is guaranteed by design but is not tested. The bus switch contributes no propagation delay other than the RC delay of the
typical On resistance of the switch and the 50 pF load capacitance, when driven by an ideal voltage source (zero output impedance).
CAPACITANCE (Note 8)
Symbol
Parameter
Conditions
Typ
Max
Unit
CIN
Control Pin Input Capacitance
VCC = 5.0 V
3
pF
CI/O
Input/Output Capacitance
VCC, OE = 5.0 V
5
pF
8. TA = )25_C, f = 1 MHz, Capacitance is characterized but not tested.
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4
FST3125
AC Loading and Waveforms
VI
500 W
FROM
OUTPUT
UNDER
TEST
CL *
500 W
NOTES:
1. Input driven by 50 W source terminated in 50 W.
2. CL includes load and stray capacitance.
*CL = 50 pF
Figure 3. AC Test Circuit
tf = 2.5 nS
90 %
SWITCH
INPUT
tf = 2.5 nS
90 %
1.5 V
1.5 V
10 %
3.0 V
Vmi
10 %
tPLH
GND
tPLH
VOH
1.5 V
OUTPUT
1.5 V
VOL
Figure 4. Propagation Delays
tf = 2.5 nS
tf = 2.5 nS
ENABLE
INPUT
90 %
90 %
1.5 V
1.5 V
10 %
10 %
GND
tPZL
tPZL
OUTPUT
3.0 V
1.5 V
tPZH
VOL + 0.3 V
VOL
tPHZL
VOH
1.5 V
OUTPUT
Figure 5. Enable/Disable Delays
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5
VOH − 0.3 V
FST3125
PACKAGE DIMENSIONS
SOIC−14
D SUFFIX
CASE 751A−03
ISSUE K
D
A
B
14
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
A3
E
H
L
1
0.25
M
DETAIL A
7
B
13X
M
b
0.25
C A
M
S
B
S
DETAIL A
h
A
X 45 _
M
A1
e
DIM
A
A1
A3
b
D
E
e
H
h
L
M
C
SEATING
PLANE
SOLDERING FOOTPRINT*
6.50
14X
1.18
1
1.27
PITCH
14X
0.58
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
6
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
0.19
0.25
0.35
0.49
8.55
8.75
3.80
4.00
1.27 BSC
5.80
6.20
0.25
0.50
0.40
1.25
0_
7_
INCHES
MIN
MAX
0.054 0.068
0.004 0.010
0.008 0.010
0.014 0.019
0.337 0.344
0.150 0.157
0.050 BSC
0.228 0.244
0.010 0.019
0.016 0.049
0_
7_
FST3125
PACKAGE DIMENSIONS
TSSOP−14
DT SUFFIX
CASE 948G
ISSUE B
14X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
S
S
N
2X
14
L/2
M
B
−U−
L
PIN 1
IDENT.
N
F
7
1
0.15 (0.006) T U
0.25 (0.010)
8
S
DETAIL E
K
A
−V−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
ÇÇÇ
K1
J J1
SECTION N−N
−W−
C
0.10 (0.004)
−T− SEATING
PLANE
D
H
G
DETAIL E
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
INCHES
MIN
MAX
MIN MAX
4.90
5.10 0.193 0.200
4.30
4.50 0.169 0.177
−−−
1.20
−−− 0.047
0.05
0.15 0.002 0.006
0.50
0.75 0.020 0.030
0.65 BSC
0.026 BSC
0.50
0.60 0.020 0.024
0.09
0.20 0.004 0.008
0.09
0.16 0.004 0.006
0.19
0.30 0.007 0.012
0.19
0.25 0.007 0.010
6.40 BSC
0.252 BSC
0_
8_
0_
8_
SOLDERING FOOTPRINT
7.06
1
0.65
PITCH
14X
0.36
14X
1.26
DIMENSIONS: MILLIMETERS
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For additional information, please contact your local
Sales Representative
FST3125/D