MC74AC245 D

MC74AC245, MC74ACT245
Octal Bidirectional
Transceiver with 3-State
Inputs/Outputs
The MC74AC245/74ACT245 contains eight non−inverting
bidirectional buffers with 3−state outputs and is intended for
bus−oriented applications. Current sinking capability is 24 mA at both
the A and B ports. The Transmit/Receive (T/R) input determines the
direction of data flow through the bidirectional transceiver. Transmit
(active−HIGH) enables data from A ports to B ports; Receive
(active−LOW) enables data from B ports to A ports. The Output
Enable input, when HIGH, disables both A and B ports by placing
them in a High Z condition.
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SOIC−20W
DW SUFFIX
CASE 751D
1
Features
•
•
•
•
•
Noninverting Buffers
Bidirectional Data Path
A and B Outputs Source/Sink 24 mA
′ACT245 has TTL Compatible Inputs
These are Pb−Free Devices
TSSOP−20
DT SUFFIX
CASE 948E
1
ORDERING INFORMATION
PIN ASSIGNMENT
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
PIN
FUNCTION
OE
Output Enable Input
T/R
Transmit/Receive Input
DEVICE MARKING INFORMATION
A0−A7
Side A 3−State Inputs or 3−State Outputs
B0−B7
Side B 3−State Inputs or 3−State Outputs
See general marking information in the device marking
section on page 7 of this data sheet.
TRUTH TABLES
Inputs
OE
T/R
L
L
H
L
H
X
Outputs
Bus B Data to Bus A
Bus A Data to Bus B
High Z State
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
VCC
OE
B0
B1
B2
B3
B4
B5
B6
B7
20
19
18
17
16
15
14
13
12
11
1
2
3
4
5
6
7
8
9
10
T/R
A0
A1
A2
A3
A4
A5
A6
A7
GND
Figure 1.
© Semiconductor Components Industries, LLC, 2015
February, 2015 − Rev. 8
1
Publication Order Number:
MC74AC245/D
MC74AC245, MC74ACT245
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
−0.5 to +7.0
V
VCC
DC Supply Voltage (Referenced to GND)
VIN
DC Input Voltage (Referenced to GND)
−0.5 to VCC +0.5
V
DC Output Voltage (Referenced to GND) (Note 1)
−0.5 to VCC +0.5
V
VOUT
IIK
DC Input Diode Current
±20
mA
IOK
DC Output Diode Current
±50
mA
IOUT
DC Output Sink/Source Current
±50
mA
ICC
DC Supply Current, per Output Pin
±50
mA
IGND
DC Ground Current, per Output Pin
±100
mA
TSTG
Storage Temperature Range
*65 to )150
_C
TL
Lead temperature, 1 mm from Case for 10 Seconds
260
_C
TJ
Junction Temperature Under Bias
140
_C
qJA
Thermal Resistance (Note 2)
65.8
110.7
_C/W
MSL
Moisture Sensitivity
FR
Flammability Rating
VESD
ILatchup
SOIC
TSSOP
Level 1
Oxygen Index: 30% − 35%
ESD Withstand Voltage
Latchup Performance
UL 94 V−0 @ 0.125 in
Human Body Model (Note 3)
Machine Model (Note 4)
Charged Device Model (Note 5)
Above VCC and Below GND at 85_C (Note 6)
> 2000
> 200
> 1000
V
±100
mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. IOUT absolute maximum rating must be observed.
2. The package thermal impedance is calculated in accordance with JESD 51−7.
3. Tested to EIA/JESD22−A114−A.
4. Tested to EIA/JESD22−A115−A.
5. Tested to JESD22−C101−A.
6. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
VIN, VOUT
tr, tf
Parameter
Supply Voltage
Min
Typ
Max
′AC
2.0
5.0
6.0
′ACT
4.5
5.0
5.5
0
−
VCC
VCC @ 3.0 V
−
150
−
VCC @ 4.5 V
−
40
−
VCC @ 5.5 V
−
25
−
VCC @ 4.5 V
−
10
−
VCC @ 5.5 V
−
8.0
−
−40
25
85
°C
DC Input Voltage, Output Voltage (Ref. to GND)
Input Rise and Fall Time (Note 7)
′AC Devices except Schmitt Inputs
Unit
V
V
ns/V
tr, tf
Input Rise and Fall Time (Note 8)
′ACT Devices except Schmitt Inputs
TA
Operating Ambient Temperature Range
IOH
Output Current − High
−
−
−24
mA
IOL
Output Current − Low
−
−
24
mA
ns/V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
7. VIN from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times.
8. VIN from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.
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2
MC74AC245, MC74ACT245
DC CHARACTERISTICS
Symbol
Parameter
74AC
74AC
TA = +25°C
−40°C to
+85°C
TA =
VCC
(V)
Typ
VIH
VIL
VOH
VOL
IIN
IOZT
IOLD
IOHD
ICC
Unit
Conditions
Guaranteed Limits
Minimum High Level
Input Voltage
3.0
4.5
5.5
1.5
2.25
2.75
2.1
3.15
3.85
2.1
3.15
3.85
V
VOUT = 0.1 V
or VCC − 0.1 V
Maximum Low Level
Input Voltage
3.0
4.5
5.5
1.5
2.25
2.75
0.9
1.35
1.65
0.9
1.35
1.65
V
VOUT = 0.1 V
or VCC − 0.1 V
Minimum High Level
Output Voltage
3.0
4.5
5.5
2.99
4.49
5.49
2.9
4.4
5.4
2.9
4.4
5.4
V
3.0
4.5
5.5
−
−
−
2.56
3.86
4.86
2.46
3.76
4.76
3.0
4.5
5.5
0.002
0.001
0.001
0.1
0.1
0.1
0.1
0.1
0.1
3.0
4.5
5.5
−
−
−
0.36
0.36
0.36
0.44
0.44
0.44
Maximum Input
Leakage Current
5.5
−
±0.1
Maximum
3-State
Current
5.5
−
5.5
Maximum Low Level
Output Voltage
†Minimum Dynamic
Output Current
Maximum Quiescent
Supply Current
IOUT = −50 mA
V
*VIN = VIL or VIH
−12 mA
IOH
−24 mA
−24 mA
IOUT = 50 mA
V
V
*VIN = VIL or VIH
12 mA
IOL
24 mA
24 mA
±1.0
mA
VI = VCC, GND
±0.6
±6.0
mA
VI (OE) = VIL, VIH
VI = VCC, GND
VO = VCC, GND
−
−
75
mA
VOLD = 1.65 V Max
5.5
−
−
−75
mA
VOHD = 3.85 V Min
5.5
−
8.0
80.0
mA
VIN = VCC or GND
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC.
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3
MC74AC245, MC74ACT245
AC CHARACTERISTICS (For Figures and Waveforms − See AND8277/D at www.onsemi.com)
74AC
Parameter
Symbol
VCC*
TA = +25°C
(V)
CL = 50 pF
74AC
TA = −40°C
to +85°C
Unit
CL = 50 pF
Min
Typ
Max
Min
Max
Fig.
No.
tPLH
Propagation Delay
An to Bn or Bn to An
3.3
5.0
1.5
1.5
5.0
3.5
8.5
6.5
1.0
1.0
9.0
7.0
ns
3−5
tPHL
Propagation Delay
An to Bn or Bn to An
3.3
5.0
1.5
1.5
5.0
3.5
8.5
6.0
1.0
1.0
9.0
7.0
ns
3−5
tPZH
Output Enable Time
3.3
5.0
2.5
1.5
7.0
5.0
11.5
8.5
2.0
1.0
12.5
9.0
ns
3−7
tPZL
Output Enable Time
3.3
5.0
2.5
1.5
7.5
5.5
12.0
9.0
2.0
1.0
13.5
9.5
ns
3−8
tPHZ
Output Disable Time
3.3
5.0
2.0
1.5
6.5
5.5
12.0
9.0
1.0
1.0
12.5
10.0
ns
3−7
tPLZ
Output Disable Time
3.3
5.0
2.0
1.5
7.0
5.5
11.5
9.0
1.5
1.0
13.0
10.0
ns
3−8
*Voltage Range 3.3 V is 3.3 V ±0.3 V.
Voltage Range 5.0 V is 5.0 V ±0.5 V.
DC CHARACTERISTICS
Symbol
Parameter
74ACT
74ACT
TA = +25°C
−40°C to
+85°C
TA =
VCC
(V)
Unit
Conditions
Typ
Guaranteed Limits
VIH
Minimum High Level
Input Voltage
4.5
5.5
1.5
1.5
2.0
2.0
2.0
2.0
V
VOUT = 0.1 V
or VCC − 0.1 V
VIL
Maximum Low Level
Input Voltage
4.5
5.5
1.5
1.5
0.8
0.8
0.8
0.8
V
VOUT = 0.1 V
or VCC − 0.1 V
VOH
Minimum High Level
Output Voltage
4.5
5.5
4.49
5.49
4.4
5.4
4.4
5.4
V
4.5
5.5
−
−
3.86
4.86
3.76
4.76
4.5
5.5
0.001
0.001
0.1
0.1
0.1
0.1
4.5
5.5
−
−
0.36
0.36
0.44
0.44
V
*VIN = VIL or VIH
24 mA
IOL
24 mA
Maximum Input
Leakage Current
5.5
−
±0.1
±1.0
mA
VI = VCC, GND
Additional Max. ICC/Input
5.5
0.6
−
1.5
mA
VI = VCC − 2.1 V
Maximum
3−State
Current
5.5
−
±0.6
±6.0
mA
VI (OE) = VIL, VIH
VI = VCC, GND
VO = VCC, GND
5.5
−
−
75
mA
VOLD = 1.65 V Max
5.5
−
−
−75
mA
VOHD = 3.85 V Min
5.5
−
8.0
80.0
mA
VIN = VCC or GND
VOL
IIN
DICCT
IOZT
IOLD
IOHD
ICC
Maximum Low Level
Output Voltage
†Minimum Dynamic
Output Current
Maximum Quiescent
Supply Current
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
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4
V
V
IOUT = −50 mA
*VIN = VIL or VIH
IOH −24 mA
−24 mA
IOUT = 50 mA
MC74AC245, MC74ACT245
AC CHARACTERISTICS (For Figures and Waveforms − See AND8277/D at www.onsemi.com)
74ACT
Parameter
Symbol
74ACT
VCC*
TA = +25°C
(V)
CL = 50 pF
TA = −40°C
to +85°C
Unit
CL = 50 pF
Fig.
No.
Min
Typ
Max
Min
Max
8.0
ns
3−5
tPLH
Propagation Delay, An to Bn or Bn to An
5.0
1.5
4.0
7.5
1.5
tPHL
Propagation Delay, An to Bn or Bn to An
5.0
1.5
4.0
8.0
1.0
9.0
ns
3−5
tPZH
Output Enable Time
5.0
1.5
5.0
10
1.5
11.0
ns
3−7
tPZL
Output Enable Time
5.0
1.5
5.5
10
1.5
12.0
ns
3−8
tPHZ
Output Disable Time
5.0
1.5
5.5
10
1.0
11.0
ns
3−7
tPLZ
Output Disable Time
5.0
2.0
5.0
10
1.5
11.0
ns
3−8
*Voltage Range 5.0 V is 5.0 V ±0.5 V.
CAPACITANCE
Symbol
Value
Parameter
Typ
Unit
Test Conditions
CIN
Input Capacitance
4.5
pF
VCC = 5.0 V
CI/O
Input/Output Capacitance
15
pF
VCC = 5.0 V
CPD
Power Dissipation Capacitance
45
pF
VCC = 5.0 V
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5
MC74AC245, MC74ACT245
ORDERING INFORMATION
Package
Shipping†
MC74AC245DWG
SOIC−20
(Pb−Free)
38 Units / Rail
MC74AC245DWR2G
SOIC−20
(Pb−Free)
1000 / Tape & Reel
MC74ACT245DWG
SOIC−20
(Pb−Free)
38 Units / Rail
MC74ACT245DWR2G
SOIC−20
(Pb−Free)
1000 / Tape & Reel
MC74AC245DTG
TSSOP−20
(Pb−Free)
75 Units / Rail
MC74AC245DTR2G
TSSOP−20
(Pb−Free)
2500 / Tape & Reel
MC74ACT245DTG
TSSOP−20
(Pb−Free)
75 Units / Rail
MC74ACT245DTR2G
TSSOP−20
(Pb−Free)
2500 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MARKING DIAGRAMS
SOIC−20W
TSSOP−20
20
20
AC
245
ALYWG
G
AC245
AWLYYWWG
1
1
20
20
ACT
245
ALYWG
G
ACT245
AWLYYWWG
1
1
A
= Assembly Location
WL, L
= Wafer Lot
YY, Y
= Year
WW, W = Work Week
G or G
= Pb−Free Package
(Note: Microdot may be in either location)
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6
MC74AC245, MC74ACT245
PACKAGE DIMENSIONS
TSSOP−20
DT SUFFIX
CASE 948E−02
ISSUE C
20X
0.15 (0.006) T U
2X
K REF
0.10 (0.004)
S
L/2
20
M
T U
S
V
ÍÍÍÍ
ÍÍÍÍ
ÍÍÍÍ
K
K1
S
J J1
11
B
L
SECTION N−N
−U−
PIN 1
IDENT
0.25 (0.010)
N
1
10
M
0.15 (0.006) T U
S
A
−V−
N
F
DETAIL E
C
G
D
0.100 (0.004)
−T− SEATING
H
DETAIL E
SOLDERING FOOTPRINT*
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
MILLIMETERS
INCHES
DIM MIN
MAX
MIN
MAX
A
6.40
6.60 0.252
0.260
B
4.30
4.50 0.169
0.177
C
--1.20
--0.047
D
0.05
0.15 0.002
0.006
F
0.50
0.75 0.020
0.030
G
0.65 BSC
0.026 BSC
−W−
H
0.27
0.37
0.011
0.015
J
0.09
0.20 0.004
0.008
J1
0.09
0.16 0.004
0.006
K
0.19
0.30 0.007
0.012
K1
0.19
0.25 0.007
0.010
L
6.40 BSC
0.252 BSC
M
0_
8_
0_
8_
7.06
1
0.65
PITCH
16X
0.36
16X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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7
MC74AC245, MC74ACT245
PACKAGE DIMENSIONS
SOIC−20W
DW SUFFIX
CASE 751D−05
ISSUE G
20
11
X 45 _
h
H
M
E
0.25
10X
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
q
A
B
M
D
1
10
20X
B
B
0.25
M
T A
S
B
S
L
A
18X
e
A1
DIM
A
A1
B
C
D
E
e
H
h
L
q
MILLIMETERS
MIN
MAX
2.35
2.65
0.10
0.25
0.35
0.49
0.23
0.32
12.65
12.95
7.40
7.60
1.27 BSC
10.05
10.55
0.25
0.75
0.50
0.90
0_
7_
SEATING
PLANE
C
T
ON Semiconductor and the
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For additional information, please contact your local
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MC74AC245/D