MC74AC244 D

MC74AC244, MC74ACT244
Octal Buffer/Line Driver
with 3-State Outputs
The MC74AC244/74ACT244 is an octal buffer and line driver
designed to be employed as a memory address driver, clock driver and
bus oriented transmitter/receiver which provides improved PC board
density.
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Features
• 3−State Outputs Drive Bus Lines or Buffer Memory Address
•
•
•
Registers
Outputs Source/Sink 24 mA
′ACT244 Has TTL Compatible Inputs
These are Pb−Free Devices
VCC
OE2
20
19
18
17
16
15
14
SOIC−20W
DW SUFFIX
CASE 751D
1
13
12
TSSOP−20
DT SUFFIX
CASE 948E
11
1
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
1
2
3
4
5
6
OE1
7
8
9
10
GND
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 5 of this data sheet.
Pinout: 20−Lead Packages Conductors (Top View)
TRUTH TABLE
Inputs
Outputs
OE1
D
(Pins 12, 14, 16, 18)
L
L
H
L
H
X
L
H
Z
NOTE:
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
Z = High Impedance
TRUTH TABLE
Inputs
Outputs
OE2
D
(Pins 3, 5, 7, 9)
L
L
H
L
H
X
L
H
Z
NOTE:
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
Z = High Impedance
© Semiconductor Components Industries, LLC, 2015
February, 2015 − Rev. 8
1
Publication Order Number:
MC74AC244/D
MC74AC244, MC74ACT244
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
−0.5 to +7.0
V
VCC
DC Supply Voltage (Referenced to GND)
VIN
DC Input Voltage (Referenced to GND)
−0.5 to VCC +0.5
V
DC Output Voltage (Referenced to GND) (Note 1)
−0.5 to VCC +0.5
V
VOUT
IIK
DC Input Diode Current
±20
mA
IOK
DC Output Diode Current
±50
mA
IOUT
DC Output Sink/Source Current
±50
mA
ICC
DC Supply Current, per Output Pin
±50
mA
IGND
DC Ground Current, per Output Pin
±100
mA
TSTG
Storage Temperature Range
*65 to )150
_C
TL
Lead temperature, 1 mm from Case for 10 Seconds
260
_C
TJ
Junction Temperature Under Bias
140
_C
qJA
Thermal Resistance (Note 2)
65.8
110.7
_C/W
MSL
Moisture Sensitivity
FR
Flammability Rating
VESD
ILatchup
SOIC
TSSOP
Level 1
Oxygen Index: 30% − 35%
ESD Withstand Voltage
Latchup Performance
UL 94 V−0 @ 0.125 in
Human Body Model (Note 3)
Machine Model (Note 4)
Charged Device Model (Note 5)
> 2000
> 200
> 1000
V
±100
mA
Above VCC and Below GND at 85_C (Note 6)
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. IOUT absolute maximum rating must be observed.
2. The package thermal impedance is calculated in accordance with JESD 51−7.
3. Tested to EIA/JESD22−A114−A.
4. Tested to EIA/JESD22−A115−A.
5. Tested to JESD22−C101−A.
6. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
VIN, VOUT
tr, tf
Parameter
Supply Voltage
Min
Typ
Max
′AC
2.0
5.0
6.0
′ACT
4.5
5.0
5.5
0
−
VCC
VCC @ 3.0 V
−
150
−
VCC @ 4.5 V
−
40
−
VCC @ 5.5 V
−
25
−
VCC @ 4.5 V
−
10
−
VCC @ 5.5 V
−
8.0
−
−40
25
85
°C
DC Input Voltage, Output Voltage (Ref. to GND)
Input Rise and Fall Time (Note 7)
′AC Devices except Schmitt Inputs
Unit
V
V
ns/V
tr, tf
Input Rise and Fall Time (Note 8)
′ACT Devices except Schmitt Inputs
TA
Operating Ambient Temperature Range
IOH
Output Current − High
−
−
−24
mA
IOL
Output Current − Low
−
−
24
mA
ns/V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
7. VIN from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times.
8. VIN from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.
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2
MC74AC244, MC74ACT244
DC CHARACTERISTICS
Symbol
VCC
(V)
Parameter
74AC
74AC
TA = +25°C
TA =
−40°C to +85°C
Typ
Unit
Conditions
Guaranteed Limits
VIH
Minimum High Level Input Voltage
3.0
4.5
5.5
1.5
2.25
2.75
2.1
3.15
3.85
2.1
3.15
3.85
V
VOUT = 0.1 V
or VCC − 0.1 V
VIL
Maximum Low Level Input Voltage
3.0
4.5
5.5
1.5
2.25
2.75
0.9
1.35
1.65
0.9
1.35
1.65
V
VOUT = 0.1 V
or VCC − 0.1 V
VOH
Minimum High Level Output Voltage
3.0
4.5
5.5
2.99
4.49
5.49
2.9
4.4
5.4
2.9
4.4
5.4
V
IOUT = −50 mA
3.0
4.5
5.5
−
−
−
2.56
3.86
4.86
2.46
3.76
4.76
V
*VIN = VIL or VIH
−12 mA
IOH
−24 mA
−24 mA
3.0
4.5
5.5
0.002
0.001
0.001
0.1
0.1
0.1
0.1
0.1
0.1
V
IOUT = 50 mA
3.0
4.5
5.5
−
−
−
0.36
0.36
0.36
0.44
0.44
0.44
V
*VIN = VIL or VIH
12 mA
IOL
24 mA
24 mA
VOL
Maximum Low Level Output Voltage
IIN
Maximum Input Leakage Current
5.5
−
±0.1
±1.0
mA
VI = VCC, GND
IOZ
Maximum 3−State Current
5.5
−
±0.5
±5.0
mA
VI (OE) = VIL, VIH
VI = VCC, GND
VO = VCC, GND
IOLD
†Minimum Dynamic Output Current
5.5
−
−
75
mA
VOLD = 1.65 V Max
5.5
−
−
−75
mA
VOHD = 3.85 V Min
5.5
−
8.0
80
mA
VIN = VCC or GND
IOHD
ICC
Maximum Quiescent Supply Current
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC.
AC CHARACTERISTICS (For Figures and Waveforms − See AND8277/D at www.onsemi.com)
Symbol
Parameter
VCC*
(V)
74AC
74AC
TA = +25°C
CL = 50 pF
TA = −40°C to +85°C
CL = 50 pF
Min
Typ
Max
Min
Max
Unit
Figure
No.
tPLH
Propagation Delay
Data to Output
3.3
5.0
2.0
1.5
6.5
5.0
9.0
7.0
1.5
1.0
10.0
7.5
ns
3−5
tPHL
Propagation Delay
Data to Output
3.3
5.0
2.0
1.5
6.5
5.0
9.0
7.0
2.0
1.0
10.0
7.5
ns
3−5
tPZH
Output Enable Time
3.3
5.0
2.0
1.5
6.0
5.0
10.5
7.0
1.5
1.5
11.0
8.0
ns
3−7
tPZL
Output Enable Time
3.3
5.0
2.5
1.5
7.5
5.5
10.0
8.0
2.0
1.5
11.0
8.5
ns
3−8
tPHZ
Output Disable Time
3.3
5.0
3.0
2.5
7.0
6.5
10.0
9.0
1.5
1.0
10.5
9.5
ns
3−7
tPLZ
Output Disable Time
3.3
5.0
2.5
2.0
7.5
6.5
10.5
9.0
2.5
2.0
11.5
9.5
ns
3−8
*Voltage Range 3.3 V is 3.3 V ±0.3 V.
*Voltage Range 5.0 V is 5.0 V ±0.5 V.
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3
MC74AC244, MC74ACT244
DC CHARACTERISTICS
Symbol
VCC
(V)
Parameter
74ACT
74ACT
TA = +25°C
TA =
−40°C to +85°C
Typ
Unit
Conditions
Guaranteed Limits
VIH
Minimum High Level Input Voltage
4.5
5.5
1.5
1.5
2.0
2.0
2.0
2.0
V
VOUT = 0.1 V
or VCC − 0.1 V
VIL
Maximum Low Level Input Voltage
4.5
5.5
1.5
1.5
0.8
0.8
0.8
0.8
V
VOUT = 0.1 V
or VCC − 0.1 V
VOH
Minimum High Level Output Voltage
4.5
5.5
4.49
5.49
4.4
5.4
4.4
5.4
V
IOUT = −50 mA
V
4.5
5.5
−
−
3.86
4.86
3.76
4.76
*VIN = VIL or VIH
−24 mA
IOH
−24 mA
4.5
5.5
0.001
0.001
0.1
0.1
0.1
0.1
V
IOUT = 50 mA
V
4.5
5.5
−
−
0.36
0.36
0.44
0.44
*VIN = VIL or VIH
24 mA
24 mA
IOL
Maximum Input Leakage Current
5.5
−
±0.1
±1.0
mA
VI = VCC, GND
DICCT
Additional Max. ICC/Input
5.5
0.6
−
1.5
mA
VI = VCC − 2.1 V
IOZ
Maximum 3−State Current
5.5
−
±0.5
±5.0
mA
VI (OE) = VIL, VIH
VI = VCC, GND
VO = VCC, GND
IOLD
†Minimum Dynamic Output Current
5.5
−
−
75
mA
VOLD = 1.65 V Max
5.5
−
−
−75
mA
VOHD = 3.85 V Min
5.5
−
8.0
80
mA
VIN = VCC or GND
VOL
IIN
Maximum Low Level Output Voltage
IOHD
ICC
Maximum Quiescent Supply Current
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
AC CHARACTERISTICS (For Figures and Waveforms − See AND8277/D at www.onsemi.com)
Parameter
Symbol
VCC*
(V)
74ACT
74ACT
TA = +25°C
CL = 50 pF
TA = −40°C to +85°C
CL = 50 pF
Min
Typ
Max
Min
Max
Unit
Figure
No.
tPLH
Propagation Delay
Data to Output
5.0
2.0
6.5
9.0
1.5
10.0
ns
3−5
tPHL
Propagation Delay
Data to Output
5.0
2.0
7.0
9.0
1.5
10.0
ns
3−5
tPZH
Output Enable Time
5.0
1.5
6.0
8.5
1.0
9.5
ns
3−7
tPZL
Output Enable Time
5.0
2.0
7.0
9.5
1.5
10.5
ns
3−8
tPHZ
Output Disable Time
5.0
2.0
7.0
9.5
1.5
10.5
ns
3−7
tPLZ
Output Disable Time
5.0
2.5
7.5
10.0
2.0
10.5
ns
3−8
*Voltage Range 5.0 V is 5.0 V ±0.5 V.
CAPACITANCE
Symbol
Parameter
Value Typ
Unit
Test Conditions
CIN
Input Capacitance
4.5
pF
VCC = 5.0 V
CPD
Power Dissipation Capacitance
45
pF
VCC = 5.0 V
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4
MC74AC244, MC74ACT244
ORDERING INFORMATION
Device
Package
Shipping†
SOIC−20
(Pb−Free)
1000 / Tape & Reel
MC74AC244DWG
38 Units / Rail
MC74AC244DWR2G
MC74ACT244DWG
38 Units / Rail
MC74ACT244DWR2G
1000 / Tape & Reel
MC74AC244DTR2G
2500 / Tape & Reel
TSSOP−20
(Pb−Free)
MC74ACT244DTR2G
2500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MARKING DIAGRAMS
SOIC−20W
TSSOP−20
20
20
AC
244
ALYWG
G
AC244
AWLYYWWG
1
1
20
20
ACT
244
ALYWG
G
ACT244
AWLYYWWG
1
1
A
= Assembly Location
WL, L
= Wafer Lot
YY, Y
= Year
WW, W = Work Week
G or G
= Pb−Free Package
(Note: Microdot may be in either location)
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5
MC74AC244, MC74ACT244
PACKAGE DIMENSIONS
TSSOP−20
DT SUFFIX
CASE 948E−02
ISSUE C
20X
0.15 (0.006) T U
2X
K REF
0.10 (0.004)
S
L/2
20
M
T U
S
V
ÍÍÍÍ
ÍÍÍÍ
ÍÍÍÍ
K
K1
S
J J1
11
B
L
SECTION N−N
−U−
PIN 1
IDENT
0.25 (0.010)
N
1
10
M
0.15 (0.006) T U
S
A
−V−
N
F
DETAIL E
C
G
D
0.100 (0.004)
−T− SEATING
H
DETAIL E
SOLDERING FOOTPRINT*
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
MILLIMETERS
INCHES
DIM MIN
MAX
MIN
MAX
A
6.40
6.60 0.252
0.260
B
4.30
4.50 0.169
0.177
C
--1.20
--0.047
D
0.05
0.15 0.002
0.006
F
0.50
0.75 0.020
0.030
G
0.65 BSC
0.026 BSC
−W−
H
0.27
0.37
0.011
0.015
J
0.09
0.20 0.004
0.008
J1
0.09
0.16 0.004
0.006
K
0.19
0.30 0.007
0.012
K1
0.19
0.25 0.007
0.010
L
6.40 BSC
0.252 BSC
M
0_
8_
0_
8_
7.06
1
0.65
PITCH
16X
0.36
16X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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6
MC74AC244, MC74ACT244
PACKAGE DIMENSIONS
SOIC−20W
DW SUFFIX
CASE 751D−05
ISSUE G
20
11
X 45 _
h
H
M
E
0.25
10X
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
q
A
B
M
D
1
10
20X
B
B
0.25
M
T A
S
B
S
L
A
18X
e
A1
DIM
A
A1
B
C
D
E
e
H
h
L
q
MILLIMETERS
MIN
MAX
2.35
2.65
0.10
0.25
0.35
0.49
0.23
0.32
12.65
12.95
7.40
7.60
1.27 BSC
10.05
10.55
0.25
0.75
0.50
0.90
0_
7_
SEATING
PLANE
C
T
ON Semiconductor and the
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For additional information, please contact your local
Sales Representative
MC74AC244/D