BYV26DGP, BYV26EGP www.vishay.com Vishay General Semiconductor Glass Passivated Ultrafast Plastic Rectifier FEATURES • Superectifier structure for high reliability condition SUPERECTIFIER • Cavity-free glass passivated pellet chip junction ® • Ultrafast reverse recovery time • Low forward voltage drop • Low switching losses, high efficiency • High forward surge capability • Solder dip 275 °C max. 10 s, per JESD 22-B106 DO-204AC (DO-15) • AEC-Q101 qualified • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 TYPICAL APPLICATIONS PRIMARY CHARACTERISTICS For use in high frequency rectification and freewheeling application in switching mode converters and inverters for consumer, computer and telecommunication. IF(AV) 1.0 A VRRM 800 V, 1000 V IFSM 30 A MECHANICAL DATA trr 75 ns VF at IF 1.3 V Case: DO-204AC, molded epoxy over glass body Molding compound meets UL 94 V-0 flammability rating Base P/N-E3 - RoHS-compliant, commercial grade Base P/NHE3 - RoHS-compliant, AEC-Q101 qualified TJ max. 175 °C Package DO-204AC (DO-15) Diode variation Single die Terminals: Matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 E3 suffix meets JESD 201 class 1A whisker test, HE3 suffix meets JESD 201 class 2 whisker test Polarity: Color band denotes cathode end MAXIMUM RATINGS (TA = 25 °C unless otherwise noted) PARAMETER SYMBOL BYV26DGP BYV26EGP UNIT Maximum repetitive peak reverse voltage VRRM 800 1000 V Maximum RMS voltage VRMS 560 700 V Maximum DC blocking voltage VDC 800 1000 V Maximum average forward rectified current 0.375" (9.5 mm) lead length (fig. 1) IF(AV) 1.0 A Peak forward surge current 10 ms single half sine-wave superimposed on rated load IFSM 30 A Non repetitive peak reverse energy ERSM (1) 10 mJ Operating junction and storage temperature range TJ, TSTG -65 to +175 °C Note (1) Peak reverse energy measured at I = 400 mA, T = T max. on inductive load, t = 20 μs R J J Revision: 17-Feb-16 Document Number: 88554 1 For technical questions within your region: [email protected], [email protected], [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 BYV26DGP, BYV26EGP www.vishay.com Vishay General Semiconductor ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted) PARAMETER TEST CONDITIONS Minimum avalanche breakdown voltage 100 μA Maximum instantaneous forward voltage 1.0 A TJ = 25 °C TJ = 175 °C TA = 25 °C Maximum DC reverse current at rated DC blocking voltage TA = 165 °C SYMBOL BYV26DGP BYV26EGP UNIT VBR 900 1100 V 2.5 VF V 1.3 5.0 IR μA 150 Max. reverse recovery time IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A trr 75 ns Typical junction capacitance 4.0 V, 1 MHz CJ 15 pF THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted) PARAMETER SYMBOL Typical thermal resistance BYV26DGP BYV26EGP RJA (1) 70 RJL (2) 16 UNIT °C/W Notes (1) Thermal resistance from junction to ambient at 0.375" (9.5 mm) lead length, mounted on PCB with 0.5" x 0.5" (12 mm x 12 mm) copper pads (2) Thermal resistance from junction to lead at 0.375" (9.5 mm) lead length with both leads attached to heatsink ORDERING INFORMATION (Example) PREFERRED P/N UNIT WEIGHT (g) PREFERRED PACKAGE CODE BASE QUANTITY DELIVERY MODE BYV26EGP-E3/54 0.428 54 4000 13" diameter paper tape and reel BYV26EGP-E3/73 0.428 73 2000 Ammo pack packaging (1) 0.428 54 4000 13" diameter paper tape and reel BYV26EGPHE3/73 (1) 0.428 73 2000 Ammo pack packaging BYV26EGPHE3/54 Note (1) AEC-Q101 qualified Revision: 17-Feb-16 Document Number: 88554 2 For technical questions within your region: [email protected], [email protected], [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 BYV26DGP, BYV26EGP www.vishay.com Vishay General Semiconductor RATINGS AND CHARACTERISTICS CURVES (TA = 25 °C unless otherwise noted) TL = Lead Temperature Resistive or Inductive Load Lead Mounted on Heatsinks 1.0 0.8 0.6 Mounted on P.C.B. 0.375" (9.5 mm) Lead Length on 0.47" x 0.47" (12 mm x 12 mm) Copper Pads 0.4 0.2 TA = Ambient Temperature 100 Instantaneous Forward Current (A) Average Forward Rectified Current (A) 1.2 25 50 75 100 125 TJ = 125 °C 0.1 TJ = 25 °C 175 0.6 1.0 1.4 1.8 2.2 2.6 3.0 3.4 Instantaneous Forward Voltage (V) Fig. 1 - Maximum Forward Current Derating Curve Fig. 4 - Typical Instantaneous Forward Voltage Characteristics 100 D = 0.3 D = 0.5 1.4 D = 0.2 D = 1.0 1.2 D = 0.1 1.0 0.8 T 0.6 0.4 0.2 D = tp/T tp Instantaneous Reverse Leakage Current (μA) D = 0.8 1.6 0 TJ = 175 °C TJ = 165 °C 10 TJ = 125 °C 1 0.1 TJ = 25 °C 0.01 0.001 0 0.2 0.4 0.6 0.8 1.0 1.2 0 20 40 60 80 100 Average Forward Current (A) Percent of Peak Reverse Voltage (%) Fig. 2 - Forward Power Loss Characteristics Fig. 5 - Typical Reverse Leakage Characteristics 100 100 TJ = TJ Max. 10 ms Single Half Sine-Wave Junction Capacitance (pF) Peak Forward Surge Current (A) 1 Temperature (°C) 1.8 Average Power Loss (W) 150 TJ = 150 °C 0.01 0.2 0 0 TJ = 175 °C 10 10 1 1 10 100 TJ = 25 °C f = 1.0 MHz Vsig = 50 mVp-p 10 1 0.1 1 10 Number of Cycles at 60 Hz Reverse Voltage (V) Fig. 3 - Maximum Non-Repetitive Peak Forward Surge Current Fig. 6 - Typical Junction Capacitance 100 Revision: 17-Feb-16 Document Number: 88554 3 For technical questions within your region: [email protected], [email protected], [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 BYV26DGP, BYV26EGP www.vishay.com Vishay General Semiconductor Transient Thermal Impedance (°C/W) 100 10 Mounted on P.C.B. 0.375" (9.5 mm) Lead Length on 0.47" x 0.47" (12 mm x 12 mm) Copper Pads 1 0.01 0.1 1 10 100 t - Pulse Duration (s) Fig. 7 - Typical Transient Thermal Impedance PACKAGE OUTLINE DIMENSIONS in inches (millimeters) DO-204AC (DO-15) 0.034 (0.86) 0.028 (0.71) DIA. 1.0 (25.4) MIN. 0.300 (7.6) 0.230 (5.8) 0.140 (3.6) 0.104 (2.6) DIA. 1.0 (25.4) MIN. Revision: 17-Feb-16 Document Number: 88554 4 For technical questions within your region: [email protected], [email protected], [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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