TAYCHIPST BYV26EGP

BYV26AGP THRU BYV26EGP
SINTERED GLASS JUNCTION
FAST SWITCHING PLASTIC RECTIFIER
200V-1000V
1.0A
FEATURES
D
D
D
D
High temperature metallurgically bonded construction
Sintered glass cavity free junction
Capability of meeting environmental standard of
MIL-S-19500
High temperature soldering guaranteed
350°C /10sec/0.375”lead length at 5 lbs tension
Operate at Ta =55°C with no thermal run away
Typical Ir<0.1µA
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC blocking Voltage
Reverse avalanche breakdown voltage
at IR = 0.1 mA
Maximum Average Forward Rectified
Current 3/8”lead length at Ta =55°C
Peak Forward Surge Current 8.3ms single
half sine-wave superimposed on rated load
Maximum Forward Voltage at rated Forward
Current and 50°C
Non-repetitive peak reverse avalanche energy
(Note 1)
Maximum DC Reverse Current
Ta =25°C
at rated DC blocking voltage
Ta =150°C
Maximum Reverse Recovery Time (Note 2)
SYMBOL
BYV26
AGP
BYV26
BGP
BYV26
CGP
BYV26
DGP
BYV26
EGP
units
Vrrm
Vrms
Vdc
200
140
200
400
280
400
600
420
600
800
560
800
1000
700
1000
V
V
V
V(BR)R (min)
300
500
700
900
1100
V
If(av)
1.0
A
Ifsm
30
A
Vf
2.5
V
Ersm
10
mJ
Ir
5.0
150.0
µA
µA
Typical Junction Capacitance
(Note 3)
Trr
Cj
Typical Thermal Resistance
(Note 4)
Rθja
55.0
Tstg, Tj
-65 to +175
Storage and Operating Junction Temperature
30
75
15.0
nS
pF
°C /W
°C
Note: 1.R=400mA; Tj=Tjmax prior to surge; inductive load switched off
2.Reverse Recovery Condition If =0.5A, Ir =1.0A, Irr =0.25A
3.Measured at 1.0 MHz and applied reverse voltage of 4.0Vdc
4.Thermal Resistance from Junction to Ambient at 3/8”lead length, P.C. Board Mounted
E-mail: [email protected]
1 of 2
Web Site: www.taychipst.com
BYV26AGP THRU BYV26EGP
SINTERED GLASS JUNCTION
FAST SWITCHING PLASTIC RECTIFIER
RATINGS AND CHARACTERISTIC CURVES
E-mail: [email protected]
2 of 2
200V-1000V
1.0A
BYV26AGP THRU BYV26EGP