MatrixCam VDK Reference Design Documentation Package

TND6201/D
MatrixCamt
Video Development Kit
Reference Design
Documentation Package
www.onsemi.com
Overview
MatrixCam Video Development Kit is a low power, smart 1080P
video camera that streams video over Wi-Fi® and Ethernet, and is
targeted towards the Internet of Things (IoT) market. MatrixCamt
VDK revolutionizes IoT by providing vision and connectivity based
on an open source platform solution, and enables fast time-to-market
for IoT developers.
To make it an intelligent streaming device, a PIR sensor is integrated
to detect movement and to wake up the system to start video
streaming. The system has the additional option for wake up through
Bluetooth® Low Energy (BLE). On wake up, a push notification is
sent to a mobile device alerting the user. The product will have
different resolution selection options for video streaming. The product
supports micro SD card slot and cloud service option for storage and
playback of images/video clips. The camera connects to a cloud
service with support for both video on demand (VOD) and live
streaming.
Additionally, the user will be able to configure the IoT device using
a GUI or mobile application. To receive the requests from this GUI, an
embedded HTTP server is provided in the IoT device. The following
features will be controlled by the GUI:
• Network Configuration
• Video Configuration
• View Live Stream
• Cloud Storage
SD-Card Recording and File List
• Firmware Upgrade
TECHNICAL NOTE
Figure 1. MatrixCam VDK Camera
Key Features
Application Processor:
• 1080p @ 30 fps Video Streaming over Ethernet & Wi-Fi
• Resolution Options for Video and Still Images
• Built-In Image Signal Processor
• Live Streaming and Recording on Wake Up from Standby
• Bluetooth Low Energy (BLE) and PIR Wake Up from Standby
Wireless Connectivity:
• Wi-Fi:
♦ Single Band (2.4 GHz) Wi-Fi Module Capable of 802.11b/g/n
♦ Wi-Fi Runs in Client Mode
♦ Low Power in Standby Mode
• Bluetooth Low Energy (BLE):
♦ Ability to Connect Camera to other BLE 4.0 Devices in a House
♦ Ability to Wake Up from Standby
© Semiconductor Components Industries, LLC, 2015
October, 2015 − Rev. 2
1
Publication Order Number:
TND6201/D
TND6201/D
Image Sensor Specification:
• Resolution: 1920 × 1080 @ 30 fps
• Pixel Size: 3 mm
• CFA: RGB Bayer
• Shutter Type: Electronic Rolling Shutter(ERR), Global
Rolling Shutter
• Input Clock Range: 6−48 MHz
• Output: Serial, Parallel
• Output Clock Max: 148.5 Mp/s (4-lane HiSpi),
74.25 Mp/s (Parallel)
• Frame Rate: 30 fps
• Responsivity: 4.0 V/lux-sec
• SNRMAX: 41 dB
• Supply Voltage:
♦ I/O: 1.8 or 2.8 V
♦ Digital: 1.8 V
♦ Analog: 2.8 V
♦ HiSpi: 0.3 V−0.6 V (SLVS), 1.7 V−1.9 V (HiVcm)
Major Components
Description
ON Semiconductor
AR0230
2 MP/1080p CMOS Image Sensor with
Superior Low Light Performance
Gainspan Wi-Fi Module
GS2011M Module Streams Data over Wi-Fi
Bluetooth Module
Noridc BLE nRF51822
TI DM368
ARM9® Core, High Performance Digital
Media System on Chip
PIR Motion Sensor
Triggers Camera Functions on Motion
Detection
Microphone
Omnidirectional Microphones
LEDs
For Power, Video Streaming
USB Port
Provides Power to Board, Firmware
Upgrades
Battery
4200 mAH Lithium-ion Battery
Storage
microSD Card Slot
Specifications Board
Lens Specification:
• HFOV (Horizontal Field of View): 105°
• VFOV (Vertical Field of View): 80°
Audio:
• Microphones: Omni-directional Microphones
• Audio Encoding: 16 kHz, 32/64 kbps AAC−LC
• Speaker: NXP (Cellphone Speaker) 0.5 W
Ethernet:
• IEEE 802.3u 10/100mbps
Figure 2. MatrixCam VDK Camera Block Diagram
Sensors:
• Passive Infra-Red
• Ability to Detect People at 10−15 Feet
• Detection Angle of at Least 140°
•
•
Storage:
• microSDt Card Slot
•
LED:
• Multi-Color LED to Show Status
MatrixCam VDK has an embedded web server & an
embedded streaming server. It can interact with the world
via:
• Application Programming Interfaces (API)
• Cloud Integration
Real Time Clock:
• RTC of GS2011MIES will be used
USB Connector (Micro-USB):
• For Debugging
• For Firmware Upgrade
• Recording and Playing Back Pictures and Video to and
•
There are 3 Main Functions of the Camera:
Configuration (Frame per Second, Resolution,
Recording Video Configurations)
Control (Record, Take Snapshot, Change Image
Quality)
View Live Stream
Additionally, an Open Source Automated Test Suite is
available that provides validation of the APIs.
from SD Card
There will be a Slide Switch to Turn ON/OFF the
Board
Power:
• Micro-USB
• Single Cell Lithium ion Battery Charger
www.onsemi.com
2
TND6201/D
Application Programming Interface Architecture
BOA
Web
Server
http
Ethernet
or Wi-Fi
rtsp
Streaming
Server
MatrixCam Video Development Kit
Figure 3. Application Programming Interface Architecture
•
•
•
There are enablers in the Camera to support 3 types of Cloud Integration Use Cases.
Push Notification:
♦ From Camera to mobile device.
♦ Google® Cloud Messaging Push Notification
Live Streaming from Camera to Cloud (Amazon® Web Services + Media Streaming Server)
♦ Hooks Inside the Camera
♦ Demo Cloud Platform
Cloud Recording – Record Video on the Cloud for Playback at a Later Time
www.onsemi.com
3
TND6201/D
Push Notification
Google
Cloud
Messaging
PIR
Sensor
Ethernet
or Wi-Fi
Coming Soon
Push Notification
MatrixCam Video Development Kit
Figure 4. Push Notifications
1. When the MatrixCam VDK’s PIR sensor detects
motion, a push notification is sent to your mobile
device.
2. Push Server credentials can be customized and
entered via the Web GUI.
3. Instructions on how to setup a sample Push Server
on Google Cloud is part of Appendix A.
Streaming
Server
PIR
Sensor
Remote Viewing of Camera’s Live Stream
• This Section has instructions on how to setup Amazon
Web Services (EC2) with Wowza® Streaming Media
Engine to pull the rtsp from the Camera.
IMPORTANT! The Camera must have a publicly
accessible IP Address
• How to Configure the Web GUI credentials to setup
Cloud Recording.
• If enabled by user, PIR motion will trigger recording on
the cloud for a short customizable period of time.
Ethernet
or Wi-Fi
Pull rtsp
http
http − Start Recording on Cloud
http − Stop Recording on Cloud
Video Streaming
MatrixCam Video Development Kit
Figure 5. Live Streaming
www.onsemi.com
4
Media
Streaming
Server on
the Cloud
TND6201/D
Google Cloud Messaging Server
Architecture and Technology
For the purpose of demonstration we use the following
architecture provided by Google − Google Cloud
Messaging.
The PIR sensor on the Matrix board detects motion and
starts SD Card Recording of the Video Stream. It also
initiates a push notification from a custom instance of the
Google Cloud Messaging System to all registered mobile
devices.
As of Version 1.0, only Androidt Devices are supported.
In future this support will be extended to web apps and iOS®.
Client App
3rd Party App
Server
GCM Connection Servers
Figure 6. Google Cloud Messaging
The GCM is a 3-tiered architecture:
3rd Party App Server:
This is a dedicated app server that users of the Matrix
Board set up to send messages from the camera via the GCM
Connection Servers to a dedicated application on mobile
devices. We will walk through the steps to set this up in
Section.
GCM Connection Servers:
Provided by Google. In this setup, we only http as the
communication protocol (not XMPP) and push notifications
are sent from camera to device. There is no communication
from device to the camera in the current version.
www.onsemi.com
5
MatrixCam VDK Overall Block Diagram
TND6201/D
Figure 7. MatrixCam VDK Interconnection Diagram
6
www.onsemi.com
TND6201/D
DM368 Main Architecture
Figure 8. DM368 Main Architecture
www.onsemi.com
7
TND6201/D
Bill of Materials (BOM)
Table 1. BILL OF MATERIALS
Manufacturer
Manufacturer
Part Number
Item
EN
Description
Qty.
Reference Design
1
501-1-00198
BPCB, 6L, 95 × 60 mm,
OSMU_ICDK
1
2
204-1-00023
Battery, Li-ion, 3.7 V,
4.2 Ah, 20 × 41 × 50 mm,
Holder Mount
1
UFO SOURCE ENERGY
BATTERY
TECHNOLOGY CO.,
LIMITED
U954048−2P
BT1
3
102-1-01803
Cap, Cer-X5R, 10 mF,
10 V, 20%, 0402
34
SAMSUNG
ELECTRO−MECHANICS
AMERICA, INC
CL05A106MP5NUNC
C3, C4, C31, C86, C152, C153,
C154, C171, C172, C173, C190,
C191, C192, C257, C264, C267,
C269, C271, C273, C275, C293,
C302, C305, C308, C309, C326,
C327, C340, C343, C344, C365,
C417, C418, C475
4
102-1-01641
Cap, Cer-X5R, 1 mF, 10 V,
10%, 0402
13
MURATA
MANUFACTURING
CO,LTD
WALSIN TECHNOLOGY
CORP.
AVX CORPORATION
GRM155R61A105KE15D
0402X105K100
0402ZD105KAT2A
C5, C6, C104, C107, C111, C114,
C117, C124, C128, C132, C367,
C438, C463
5
102-1-01604
Cap, Cer-X5R, 0.1 mF,
10 V, 10%, 0402
113
AVX CORPORATION
WALSIN TECHNOLOGY
CORP.
WALSIN TECHNOLOGY
CORP.
0402ZD104KAT2A
0402X104K100
0402X104K100CT
C8, C9, C10, C11, C12, C13, C14,
C15, C16, C17, C18, C19, C20,
C21, C22, C26, C42, C106, C109,
C110, C113, C119, C126, C130,
C134, C136, C137, C138, C139,
C140, C141, C142, C143, C155,
C156, C157, C158, C159, C160,
C161, C162, C174, C175, C176,
C177, C178, C179, C180, C181,
C253, C265, C266, C272, C276,
C277, C278, C279, C281, C282,
C283, C294, C295, C296, C297,
C303, C306, C307, C310, C311,
C312, C324, C325, C328, C329,
C341, C342, C346, C348, C350,
C353, C354, C355, C370, C371,
C372, C373, C375, C376, C377,
C380, C381, C419, C420, C421,
C429, C436, C440, C442, C448,
C449, C450, C462, C464, C465,
C466, C469, C472, C474, C476,
C477, C506, C509, C510
6
102-1-00001
Cap, Cer-X7R, 0.01 mF,
10 V, 10%, 0402
34
AVX CORPORATION
KEMET
0402ZC103KAT2A
C0402C103K8RAC
C24, C25, C27, C28, C29, C30,
C120, C127, C131, C135, C248,
C249, C252, C259, C298, C299,
C300, C301, C304, C318, C319,
C334, C335, C345, C347, C349,
C361, C362, C439, C461, C467,
C470, C471, C473
7
102-1-01791
Cap, Cer-X5R, 22 mF,
10 V, 20%, 0603
4
TDK CORPORATION
WALSIN TECHNOLOGY
CORP.
C1608X5R1A226M080AC
0603X226M100
C89, C251, C268, C274
8
102-1-00047
Cap, Cer-X7R, 560 pF,
25 V, 10%, 0402
24
AVX CORPORATION
KEMET
04023C561KAT2A
C0402C561K3RAC
C144, C145, C146, C147, C148,
C149, C150, C151, C163, C164,
C165, C166, C167, C168, C169,
C170, C182, C183, C184, C185,
C186, C187, C188, C189
9
102-1-01647
Cap, Cer-X5R, 10 mF,
16 V, 10%, 0805
1
AVX CORPORATION
WALSIN TECHNOLOGY
CORP.
0805YD106KAT2A
0805X106K160
C250
10
102-1-00208
Cap, Cer-X5R, 2.2 mF,
10 V, 10%, 0402
2
TDK CORPORATION
AVX CORPORATION
WALSIN TECHNOLOGY
CORP.
C1005X5R1A225K
0402ZD225KAT*A
0402X225K100
C256, C468
11
102-1-00819
Cap, Cer-NPO, 27 pF,
25 V, 1%, 0603
2
AVX CORPORATION
06033A270FAT2A
C263, C270
12
102-1-00027
Cap, Cer-X7R, 0.01 mF,
25 V, 10%, 0402
1
AVX CORPORATION
KEMET
WALSIN TECHNOLOGY
CORP.
04023C103KAT2A
C0402C103K3RAC
0402B103K250
C280
13
102-1-00017
Cap, Cer-X7R, 270 pF,
10 V, 10%, 0402
2
AVX CORPORATION
KEMET
0402ZC271KAT2A
C0402C271K8RAC
C351, C352
14
102-1-00103
Cap, Cer-X7R, 1800 pF,
10 V, 10%, 0603
2
AVX CORPORATION
KEMET
0603ZC182KAT2A
C0603C182K8RAC
C356, C359
15
102-1-00464
Cap, Cer-X7R, 1.5 mF,
10 V, 10%, 1206
1
AVX CORPORATION
KEMET
1206ZC155KAT2A
C1206C155K8RAC
C357
BPCB1
www.onsemi.com
8
TND6201/D
Table 1. BILL OF MATERIALS (continued)
Item
EN
Description
Qty.
Manufacturer
Manufacturer
Part Number
16
102-1-00117
Cap, Cer-X7R, 8200 pF,
10 V, 10%, 0603
1
AVX CORPORATION
KEMET
0603ZC822KAT2A
C0603C822K8RAC
C358
17
102-1-00091
Cap, Cer-X5R, 4.7 mF,
16 V, 10%, 0603
1
TAIYO YUDEN
TDK CORPORATION
EMK107ABJ475KA−T
C1608X5R1C475K
C360
18
102-1-00862
Cap, Cer-NPO, 36 pF,
50 V, 1%, 0603
2
AVX CORPORATION
06035A360FAT2A
C363, C364
19
102-1-00210
Cap, Cer-X5R, 0.22 mF,
10 V, 10%, 0402
3
MURATA
MANUFACTURING
CO,LTD
WALSIN TECHNOLOGY
CORP.
GRM155R61A224KE19D
0402X224K100
C366, C446, C507
20
102-1-01640
Cap, Cer-X5R, 10 mF,
10 V, 20%, 0603
3
TAIYO YUDEN
LMK107BJ106MALTD
C368, C369, C374
21
102-1-01639
Cap, Cer-NPO, 24 pF,
50 V, 5%, 0402
2
AVX CORPORATION
04025A240JAT2A
C378, C379
22
102-1-01612
Cap, Cer-X7R, 1000 pF,
2 kV, 10%, 1210
2
AVX CORPORATION
WALSIN TECHNOLOGY
CORP.
PROSPERITY
DIELECTRICS CO.
1210GC102KAT1A
1210B102K202
MA1210XR−102K−202ER
C382, C383
23
102-1-00011
Cap, Cer-X7R, 1000 pF,
10 V, 10%, 0402
2
AVX CORPORATION
KEMET
0402ZC102KAT2A
C0402C102K8RAC
C422, C441
24
102-1-01677
Cap, Cer-NPO, 2.2 pF,
50 V, ±0.1 pF, 0402
1
AVX CORPORATION
04025A2R2BAT2A
C423
25
102-4-00009
Cap, RF, Cer-NPO, 5 pF,
50 V, 0.25 pF, 0402
1
MURATA
MANUFACTURING
CO,LTD
GJM1555C1H5R0CB01D
C424
26
102-4-00004
Cap, RF, Cer-NPO, 1 pF,
50 V, ±0.1 pF, Low ESR,
0402
1
AVX CORPORATION
MURATA
MANUFACTURING
CO,LTD
04025U1R0BAT**
GJM1555C1H1R0BB01*
C425
27
102-1-00626
Cap, Cer-NPO, 1.5 pF,
50 V, 0.25 pF, 0402
1
AVX CORPORATION
04025A1R5CAT2A
C426
28
102-1-00016
Cap, Cer-X7R, 2200 pF,
10 V, 10%, 0402
1
AVX CORPORATION
KEMET
0402ZC222KAT2A
C0402C222K8RAC
C427
29
102-1-01672
Cap, Cer-NPO, 2.7 pF,
50 V, ±0.1 pF, 0402
1
AVX CORPORATION
04025A2R7BAT2A
C428
30
102-1-00009
Cap, Cer-X7R, 0.047 mF,
10 V, 10%, 0402
1
AVX CORPORATION
KEMET
0402ZC473KAT2A
C0402C473K8RAC
C430
31
102-1-00744
Cap, Cer-NPO, 18 pF,
25 V, 1%, 0402
2
AVX CORPORATION
04023A180FAT2A
C431, C433
32
102-1-00758
Cap, Cer-NPO, 12 pF,
50 V, 1%, 0402
2
AVX CORPORATION
04025A120FAT2A
C432, C434
33
102-2-00491
Cap, Low ESR, 33 mF,
10 V, 10%, 700 mE,
Size A
1
AVX CORPORATION
TPSA336K010R0700
C443
34
102-1-00003
Cap, Cer-X7R, 0.015 mF,
10 V, 10%, 0402
1
AVX CORPORATION
KEMET
0402ZC153KAT2A
C0402C153K8RAC
C444
35
102-1-01735
Cap, Cer-X5R, 100 mF,
10 V, 20%, 1206
1
TDK CORPORATION
WALSIN TECHNOLOGY
CORP.
C3216X5R1A107M
1206X107M100CT
C445
36
102-1-00209
Cap, Cer-X5R, 0.47 mF,
10 V, 10%, 0402
2
MURATA
MANUFACTURING
CO,LTD
WALSIN TECHNOLOGY
CORP.
GRM155R61A474KE15D
0402X474K100
C447, C508
37
102-1-01646
Cap, Cer-X7R, 1000 pF,
2 kV, 10%, 1206
1
AVX CORPORATION
JOHANSON
DIELECTRICS INC
1206GC102KAT1A
202R18W102KV4E
C455
38
106-4-00071
LED, Single, Red, 0603
3
DIALIGHT
598−8010−107F
D1, D2, D4
39
106-4-00070
LED, Single,
Yellow-Green, 0603
2
DIALIGHT
598−8060−107F
D3, D5
40
104-1-00002
F-Bead, 30 E, 1 A,
SMD0603
18
MURATA
MANUFACTURING
CO,LTD
BLM18PG300SN1
FB9, FB10, FB11, FB12, FB13,
FB14, FB16, FB17, FB19, FB21,
FB22, FB23, FB24, FB26, FB31,
FB32, FB33, FB34
41
104-1-00003
F-Bead, 600 E, 0.5 A,
SMD0603
1
MURATA
MANUFACTURING
CO,LTD
TDK CORPORATION
BLM18AG601SN1D
MMZ1608B601C
FB25
www.onsemi.com
9
Reference Design
TND6201/D
Table 1. BILL OF MATERIALS (continued)
Item
EN
Description
Qty.
Manufacturer
Manufacturer
Part Number
Reference Design
42
104-1-00004
F-Bead, 120 E, 0.5 A,
SMD0603
3
TAIYO YUDEN
BK1608HS121−T
FB27, FB28, FB29
43
303-1-00005
Filter, BPF, 1 ch,
2.45 GHz, WLAN/BT,
SMD0805
1
MURATA
MANUFACTURING
CO,LTD
LFB212G45CG1B982
FL2
44
201-1-00264
Conn, Berg strip, 1 × 2,
1.27 mm, 1 A, ST, TH
13
SULLINS CONNECTOR
SOLUTIONS
GRPB021VWVN−RC
H1, H2, H3, H4, H5, H6, H7, H8,
H9, H10, H11, H12, H16
45
201-2-00165
Conn, USB Micro B
Receptacle, 1 × 1,
Shielded, RA, SMD
1
MOLEX
473460001
J2
46
201-1-00153
Conn, USB Micro B
Receptacle, 1 × 1,
Shielded, ST, TH
1
MOLEX
105133−0011
J3
47
201-1-00107
Conn, Coaxial,
Receptacle, 50 E, 6 GHz,
ST, SMD
1
HRS (HIROSE
ELECTRIC CO LTD)
U.FL−R−SMT−1
J6
48
201-1-00362
Conn, RJ45 Jack, 1 × 1,
Shield, LED (G, Y), ST,
TH
1
AMPHENOL
RJHSE−3381−A1
J7
49
201-2-00176
Conn, microSD Card
Socket, 1 × 1, Push-Push,
RA, SMD
1
HRS (HIROSE
ELECTRIC CO LTD)
DM3AT−SF−PEJM5
J9010
50
103-1-00252
Ind, Power, 2.2 mH, 20%,
2.2 A, 115 mE, Shielded,
SMD
1
TDK CORPORATION
SPM3012T−2R2M
L1
51
103-1-00250
Ind, Power, 2.2 mH, 25%,
2.9 A, 35.9 E, Shielded,
SMD
1
SUMIDA AMERICA
COMPONENTS INC
CDRH5D16NP−2R2NC
L2
52
103-1-00205
Ind, Power, 1 mH, 30%,
2.45 A, 36 mE, Shielded,
90 MHz, SMD
2
MURATA
MANUFACTURING
CO,LTD
LQH44PN1R0NP0L
L3, L4
53
103-1-00032
Ind, Chip, 3.3 mH, 10%,
30 mA, 1.3 E, Shielded,
65 MHz, SMD0603
1
TDK CORPORATION
MLF1608A3R3KT
L5
54
103-2-00002
Ind, RF, Air Core, 3.3 nH,
±0.3 nH, 0.3 A, 0.17 E,
Shielded, 6 GHz,
SMD0402
1
MURATA
MANUFACTURING
CO,LTD
LQG15HS3N3S02
L10
55
103-2-00003
Ind, RF, Air Core, 4.7 nH,
±0.3 nH, 0.3 A, 0.18 E,
Shielded, 6 GHz,
SMD0403
1
MURATA
MANUFACTURING
CO,LTD
LQG15HS4N7S02
L11
56
103-2-00004
Ind, RF, Air Core, 10 nH,
5%, 0.3 A, 0.26 E,
Unshielded, 3.4 GHz,
SMD0402
1
MURATA
MANUFACTURING
CO,LTD
LQG15HS10NJ02
L12
57
103-1-00033
Ind, Chip, 2.7 nH, 2%,
1.5 A, 56 mE, Unshielded,
13 GHz, SMD0402
1
COILCRAFT
0402HP−2N7XGLW
L13
58
401-2-00042
Lens Holder, S-mount,
M12 × 0.5
1
XIAMEN LEADING
OPTICS CO., LTD
A02−002
MIS1
59
401-2-00040
Lens, Megapixel,
M12 × 0.5-6g, 1/2.7″
1
XIAMEN LEADING
OPTICS CO., LTD
M127B02820WR2
MIS2
60
401-2-00027
Lens-PIR, PD55-14006,
5.5 mm, 140°
1
FRESNELFACTORY
PD55−14006
MIS3
61
401-1-00115
MIC, Condenser, −44 dB,
±3dB, 100−20 KHz,
Omnidirectional
1
CUI INC
CMC−5044TF−A
MK1
62
305-1-00001
ESD suppressor, Bidir,
24 VDC, Polymer,
SMD0603
1
LITTELFUSE
PGB1010603MR
P1
63
305-1-00033
Diode, ESD-Bidir, 9.5 V,
90 W, SMD
1
TEXAS INSTRUMENTS
TPD1E10B09DPYR
P6
64
107-2-00105
Transistor, P-MOSFET,
20 V, 5.1 A, VGS = 8 V,
0.7 W, UDFN-6
3
ON SEMICONDUCTOR
NTLUS3A18PZTCG
Q1, Q2, Q4
65
107-1-00006
Transistor, BJT, Dual
NPN, 50 V, 0.1 A, 0.15 W,
SOT363−6
2
PANASONIC
DMC564040
Q6, Q7
www.onsemi.com
10
TND6201/D
Table 1. BILL OF MATERIALS (continued)
Item
EN
Description
Qty.
Manufacturer
Manufacturer
Part Number
Reference Design
66
107-2-00106
Transistor, N-MOSFET,
20 V, 0.75 A, VGS = 6 V,
0.31 W, SOT-723-3
2
ON SEMICONDUCTOR
NTK3134NT1G
Q8, Q9
67
101-3-00038
Res, I-Sense, 33 mE,
1/4 W, 1%, 1200 ppm/°C,
0805
1
YAGEO
RL0805FR-7W0R033L
R1
68
101-1-00001
Res, Chip, 0 E, 1.5 A,
0402
59
VISHAY
CRCW04020000Z0
R2, R3, R4, R5, R7, R19, R26,
R28, R29, R32, R36, R42, R55,
R56, R58, R59, R74, R75, R76,
R77, R78, R84, R99, R102, R103,
R105, R106, R107, R109, R116,
R131, R132, R142, R145, R150,
R217, R218, R220, R230, R238,
R239, R240, R241, R248, R249,
R253, R259, R267, R268, R269,
R270, R271, R272, R580, R585,
R594, R595, R597, R598
69
101-1-03415
Res, Chip, 220 E, 1/10 W,
1%, 0603
5
KOA SPEER
ELECTRONICS, INC.
RK73H1JTTD2200F
R9, R205, R206, R207, R208
70
101-1-02793
Res, Chip, 10 kW, 1/16 W,
5%, 0402
60
KOA SPEER
ELECTRONICS, INC.
VISHAY
WALSIN TECHNOLOGY
CORP.
RK73B1ETTP103J
CRCW040210K0JNED
WR04X103JTL
R10, R25, R30, R34, R39, R40,
R52, R53, R60, R62, R64, R65,
R66, R68, R71, R73, R81, R82,
R83, R88, R89, R93, R100, R110,
R111, R112, R113, R114, R115,
R117, R133, R134, R135, R136,
R137, R138, R139, R140, R141,
R143, R148, R231, R235, R236,
R237, R246, R250, R251, R252,
R260, R261, R264, R265, R588,
R589, R590, R591, R592, R593,
R607
71
101-1-03611
Res, Chip, 220 kW,
1/10 W, 1%, 0603
2
PANASONIC
ERJ-3EKF2203V
R24, R31
72
101-1-01181
Res, Chip, 174 kW,
1/10 W, 1%, 0603
1
KOA SPEER
ELECTRONICS, INC.
VISHAY
WALSIN TECHNOLOGY
CORP.
EVER OHMS
TECHNOLOGY
RK73H1JTTD1743F
CRCW0603174KFK
WR06X1743F
CR0603F174K
R27
73
101-1-01162
Res, Chip, 110 kW,
1/10 W, 1%, 0603
1
KOA SPEER
ELECTRONICS, INC.
VISHAY
RK73H1JTTD1103F
CRCW0603110KFK
R35
74
101-1-00389
Res, Chip, 10 kW, 1/16 W,
1%, 0402
38
KOA SPEER
ELECTRONICS, INC.
VISHAY
WALSIN TECHNOLOGY
CORP.
RK73H1ETTP1002F
CRCW040210K0FK
WR04X1002F
R37, R41, R125, R126, R127,
R129, R130, R151, R152, R153,
R154, R155, R157, R158, R159,
R160, R161, R186, R189, R195,
R196, R199, R200, R209, R242,
R582, R583, R584, R586, R587,
R599, R600, R601, R602, R603,
R604, R605, R606
75
101-1-02782
Res, Chip, 3.6 kW,
1/16 W, 5%, 0402
1
KOA SPEER
ELECTRONICS, INC.
VISHAY
RK73B1ETTP362J
CRCW04023K60JNED
R38
76
101-1-00485
Res, Chip, 100 kW,
1/16 W, 1%, 0402
6
KOA SPEER
ELECTRONICS, INC.
VISHAY
WALSIN TECHNOLOGY
CORP.
RK73H1ETTP1003F
CRCW0402100KFK
WR04X1003F
R43, R193, R204, R229, R232,
R245
77
101-1-00293
Res, Chip, 1 kW, 1/16 W,
1%, 0402
6
KOA SPEER
ELECTRONICS, INC.
VISHAY
WALSIN TECHNOLOGY
CORP.
YAGEO
RALEC
WALSIN TECHNOLOGY
CORP.
RK73H1ETTP1001F
CRCW04021K00FK
WR04X1001F
RC0402FR-071KL
RTT021001F
WR04X1001FTL
R44, R49, R50, R194, R262,
R263
78
101-1-00101
Res, Chip, 10 E, 1/16 W,
1%, 0402
9
KOA SPEER
ELECTRONICS, INC.
VISHAY
WALSIN TECHNOLOGY
CORP.
RK73H1ETTP10R0F
CRCW040210R0FK
WR04X10R0F
R45, R46, R47, R85, R104, R108,
R273, R274, R275
79
101-1-00168
Res, Chip, 49.9 E,
1/16 W, 1%, 0402
5
KOA SPEER
ELECTRONICS, INC.
VISHAY
WALSIN TECHNOLOGY
CORP.
RK73H1ETTP49R9F
CRCW040249R9FK
WR04X49R9F
R48, R162, R163, R164, R165
www.onsemi.com
11
TND6201/D
Table 1. BILL OF MATERIALS (continued)
Manufacturer
Part Number
Item
EN
Description
Qty.
Manufacturer
80
101-1-02797
Res, Chip, 15 kW, 1/16 W,
5%, 0402
6
KOA SPEER
ELECTRONICS, INC.
VISHAY
RK73B1ETTP153J
CRCW040215K0JNED
R51, R54, R57, R79, R80, R124
81
101-1-02769
Res, Chip, 1 kW, 1/16 W,
5%, 0402
10
KOA SPEER
ELECTRONICS, INC.
VISHAY
ROHM
WALSIN TECHNOLOGY
CORP.
RK73B1ETTP102J
CRCW04021K00JNED
MCR01MRTJ102
WR04X102JTL
R61, R63, R67, R69, R70, R72,
R144, R146, R147, R149
82
101-1-00002
Res, Chip, 0 E, 1 A, 0603
1
KOA SPEER
ELECTRONICS, INC.
PANASONIC
WALSIN TECHNOLOGY
CORP.
RK73Z1JTTD
ERJ-3GEY0R00V
WR06X000PTL
R87
83
101-1-02773
Res, Chip, 1.5 kW,
1/16 W, 5%, 0402
5
KOA SPEER
ELECTRONICS, INC.
VISHAY
RK73B1ETTP152J
CRCW04021K50JNED
R96, R97, R118, R119, R596
84
101-1-00817
Res, Chip, 28 E, 1/10 W,
1%, 0603
1
KOA SPEER
ELECTRONICS, INC.
VISHAY
RK73H1JTTD28R0F
CRCW060328R0FK
R98
85
101-1-00310
Res, Chip, 1.5 kW,
1/16 W, 1%, 0402
1
KOA SPEER
ELECTRONICS, INC.
VISHAY
WALSIN TECHNOLOGY
CORP.
RK73H1ETTP1501F
CRCW04021K50FK
WR04X1501FTLV
R101
86
101-1-03433
Res, Chip, 2.4 kW,
1/16 W, 0.5%, 25 ppm/°C,
0402
1
PANASONIC
SUSUMU
ERA-2AED242
RR0510P-242-D
R120
87
101-1-00324
Res, Chip, 2.1 kW,
1/16 W, 1%, 0402
1
KOA SPEER
ELECTRONICS, INC.
VISHAY
RK73H1ETTP2101F
CRCW04022K10FK
R121
88
101-1-00325
Res, Chip, 2.15 kW,
1/16 W, 1%, 0402
1
KOA SPEER
ELECTRONICS, INC.
VISHAY
RK73H1ETTP2151F
CRCW04022K15FK
R122
89
101-1-00185
Res, Chip, 75 E, 1/16 W,
1%, 0402
5
KOA SPEER
ELECTRONICS, INC.
VISHAY
RK73H1ETTP75R0F
CRCW040275R0FK
R123, R167, R168, R169, R171
90
101-1-02785
Res, Chip, 4.7 kW,
1/16 W, 5%, 0402
1
KOA SPEER
ELECTRONICS, INC.
VISHAY
WALSIN TECHNOLOGY
CORP.
RK73B1ETTP472J
CRCW04024K70JNED
WR04X472JTL
R128
91
101-1-02776
Res, Chip, 2 kW, 1/16 W,
5%, 0402
1
KOA SPEER
ELECTRONICS, INC.
VISHAY
WALSIN TECHNOLOGY
CORP.
RK73B1ETTP202J
CRCW04022K00JNED
WR04X202JTL
R156
92
101-1-02931
Res, Chip, 510 E, 1/10 W,
5%, 0603
2
KOA SPEER
ELECTRONICS, INC.
VISHAY
WALSIN TECHNOLOGY
CORP.
RK73B1JTTD511J
CRCW0603510RJNEA
WR06X511JTL
R166, R170
93
101-1-03393
Res, Chip, 33 E, 1/10 W,
1%, 0402
1
PANASONIC
ERJ2RKF33R0X
R172
94
101-1-02809
Res, Chip, 47 kW, 1/16 W,
5%, 0402
1
KOA SPEER
ELECTRONICS, INC.
VISHAY
WALSIN TECHNOLOGY
CORP.
RK73B1ETTP473J
CRCW040247K0JNED
WR04X473JTL
R197
95
101-1-03398
Res, Chip, 620 kW,
1/16 W, 1%, 0402
1
WALSIN TECHNOLOGY
CORP.
WR04X6203F
R198
96
101-1-02795
Res, Chip, 12 kW, 1/16 W,
5%, 0402
1
KOA SPEER
ELECTRONICS, INC.
VISHAY
RK73B1ETTP123J
CRCW040212K0JNED
R201
97
101-1-03432
Res, Chip, 3.3 kW,
1/16 W, 0.1%, 0402
1
PANASONIC
ERA−2AEB332
R202
98
101-1-02825
Res, Chip, 220 kW,
1/16 W, 5%, 0402
1
KOA SPEER
ELECTRONICS, INC.
VISHAY
WALSIN TECHNOLOGY
CORP.
RK73B1ETTP224J
CRCW0402220KJNED
WR04X224JTL
R203
99
101-1-03203
Res, Chip, 10 MW, 1/8 W,
5%, 0805
1
KOA SPEER
ELECTRONICS, INC.
VISHAY
RK73B2ATTD106J
CRCW080510M0JNEA
R215
www.onsemi.com
12
Reference Design
TND6201/D
Table 1. BILL OF MATERIALS (continued)
Manufacturer
Part Number
Item
EN
Description
Qty.
Manufacturer
100
101-1-02777
Res, Chip, 2.2 kW,
1/16 W, 5%, 0402
1
KOA SPEER
ELECTRONICS, INC.
VISHAY
WALSIN TECHNOLOGY
CORP.
RK73B1ETTP222J
CRCW04022K20JNED
WR04X222J
R219
101
101-1-00197
Res, Chip, 100 E, 1/16 W,
1%, 0402
2
KOA SPEER
ELECTRONICS, INC.
VISHAY
WALSIN TECHNOLOGY
CORP.
RK73H1ETTP1000F
CRCW0402100RFK
WR04X1000FTL
R233, R234
102
101-1-02786
Res, Chip, 5.1 kW,
1/16 W, 5%, 0402
1
KOA SPEER
ELECTRONICS, INC.
VISHAY
WALSIN TECHNOLOGY
CORP.
RK73B1ETTP512J
CRCW04025K10JNED
WR04X512JTL
R266
103
401-1-00145
Speaker, 1 W, 8 E,
16 × 16 × 4.7 mm
1
SOBERTON INC
SP-1605
SP1
104
205-1-00035
Switch, Tactile, SPST-NO,
32 V, 50 mA, Vertical,
SMD
3
C&K COMPONENTS
KMR231NG LFS
SW2, SW7, SW9
105
205-1-00041
Switch, DIP, 2 Position,
25 mA, Vertical, SMD
4
C&K COMPONENTS
TDA02H0SB1
SW3, SW4, SW5, SW8
106
205-1-00016
Switch, Tactile, SPST-NO,
Vertical, SMD
1
OMRON ELECTRONIC
COMPONENTS PTE
LTD.
B3FS-1050
SW10
107
105-1-00024
Xmr, ETH, 10/100M,
Single,
(CMC-1CT:1CT-CMC),
(1CT:1CT-CMC), SMD
1
WÜRTH ELECTRONICS,
INC
749013011
T1
108
301-1-00044
IC, SoC, TMS320DM368,
Digital Media, 432 MHz,
PBGA-338
1
TEXAS INSTRUMENTS
TMS320DM368ZCED
U1
109
301-2-00008
IC, DDR2, 256 MB,
×16 bit, 400 MHz, BGA-84
1
MICRON
MT47H128M16RT-25E
U2
110
301-2-00152
IC, NOR Flash, 16 MB,
×16 bit, 70 ns, FBGA-64
1
MICRON
M29W128GL70ZS6F
U3
111
301-2-00121
IC, NAND Flash, 128 MB,
×8 bit, 20 ns, VFBGA-63
1
MICRON
MT29F1G08ABADAH4-IT:D
U4
112
301-4-00281
IC, Switcher, 2.3−5.5 VIN,
0.6−5.5 VOUT/1.2 A,
3 MHz, Sync Buck Conv,
WDFN-8
2
ON SEMICONDUCTOR
NCP6332BMTAATBG
U6, U9
113
301-4-00284
IC, LDO, 1.9−5.5 VIN,
2.8 VOUT/0.25 A,
WLCSP-4
2
ON SEMICONDUCTOR
NCP160AFCS280T2G
U7, U10
114
301-0-00713
IC, NL27WZ08, Dual
2-Input AND Gate,
VFSOP-8
1
ON SEMICONDUCTOR
NL27WZ08USG
U11
115
301-0-00701
IC, MAX708, mP
Supervisory Circuit,
SOIC-8
1
ON SEMICONDUCTOR
MAX708TESA-TG
U12
116
301-0-00707
IC, NCP1855, Single Cell
Li-ion Battery Charger,
CSP-25
1
ON SEMICONDUCTOR
NCP1855FCCT1G
U13
117
301-4-00230
IC, Switcher, 2.5−5.5 VIN,
(2.8/3.3) VOUT/1 A,
WSON-12
1
TEXAS INSTRUMENTS
LM3668SD-2833/NOPB
U15
118
304-1-00048
Image sensor, CMOS,
1928(H) × 1088(V), 1/2.7″,
iBGA-80
1
ON SEMICONDUCTOR
AR023ZMCSC00SUEA0-D
RBR
U17
119
301-0-00703
IC, PCA9306, Dual Bidir
I2C & SM Bus
Voltage-Level Translator,
UDFN-8
1
ON SEMICONDUCTOR
PCA9306FMUTCG
U19
120
301-0-00704
IC, EMI6316, 4-Line EMI
Filter With ESD,
WLCSP-15
1
ON SEMICONDUCTOR
EMI6316FCTBG
U20
121
301-0-00705
IC, EMI2121, Single Pair,
Common Mode EMI Filter
with ESD, WDFN-8
2
ON SEMICONDUCTOR
EMI2121MTTAG
U21, U23
122
301-0-00387
IC, FT230, USB to UART
Interface, QFN-16
2
FTDI CHIP
FT230XQ
U22, U49
www.onsemi.com
13
Reference Design
TND6201/D
Table 1. BILL OF MATERIALS (continued)
Item
EN
Description
Qty.
Manufacturer
Manufacturer
Part Number
Reference Design
123
301-4-00145
IC, LDO, 2−18 VIN,
0.5−1 VOUT/4 mA,
TSOT-6
1
ANALOG DEVICES
ADR130BUJZ
U24
124
301-0-00634
IC, OPA2322, Dual
Op-Amp, CMOS, 20 MHz,
SON-8
1
TEXAS INSTRUMENTS
OPA2322AIDRG*
U25
125
301-0-00709
IC, NCP2824, Class D
Audio Power Amplifier,
2.4 W, WCSP-9
1
ON SEMICONDUCTOR
NCP2824FCT2G
U26
126
301-5-00003
IC, RTL8201CP, Single
Port Fast Ethernet PHY,
LQFP-48
1
REALTEK
RTL8201CP-LF
U27
127
301-1-00094
IC, SoC, NRF51822,
32-Bit ARM Cortex® M0,
BT (LE-4.0), 2.4 GHz,
QFN-48
1
NORDIC
SEMICONDUCTOR
NRF51822-QFAC
U30
128
301-0-00561
IC, NCS36000, Passive
Infrared (PIR) Detector
Controller, Integrated
LDO, SOIC-14
1
ON SEMICONDUCTOR
NCS36000D*G
U32
129
301-0-00706
IC, CAT5137,
128-Position Digital
Potentiometer, I2C,
SC70-6
1
ON SEMICONDUCTOR
CAT5137SDI 00GT3
U33
130
301-0-00570
IC, 74LVC2G17, Dual
Schmitt Trigger Buffer,
SC70-6
1
TEXAS INSTRUMENTS
SN74LVC2G17DCKR
U34
131
301-0-00712
IC, NL27WZ32, Dual
2-Input OR Gate,
VFSOP-8
2
ON SEMICONDUCTOR
NL27WZ32USG
U43, U45
132
301-0-00708
IC, LC709202, Single Cell
Li-ion Battery Fuel Gauge,
I2C, WFQFN-16
1
ON SEMICONDUCTOR
LC709202FRD-01
U44
133
301-0-00722
IC, PCA9538, 8-Bit I/O
Expander, I2C, HVQFN-16
1
NXP
SEMICONDUCTORS
PCA9538BS
U46
134
301-0-00719
IC, LM3881, Power
Supply Sequencer,
VSSOP-8
1
TEXAS INSTRUMENTS
LM3881MM/NOPB
U47
135
510-4-00030
Module, Wi-Fi,
SPI+UART+SDIO+I2C,
802.11b/g/n, Low Power
SoC, Dual ARM Cortex
M3, SMD
1
GAINSPAN
GS2011MIES
U48
136
301-0-00344
IC, LTC2950-1,
Pushbutton On/Off
Controller, TSOT23-8
1
LINEAR TECHNOLOGY
CORPORATION
LTC2950CTS8-1
U50
137
301-0-00560
IC, PCA9541A, 2-Channel
I2C-Master Selector,
HVQFN-16
1
NXP
SEMICONDUCTORS
PCA9541ABS/01
U51
138
304-1-00035
PIR Motion Sensor,
2−15 VIN, 4.6 mVpp,
Angle(Hori−90°,
Vert−90°), TH
1
MURATA
MANUFACTURING
CO,LTD
IRA-S210ST01
XDCR1
139
108-1-00078
XTAL, 24 MHz, 18 pF,
±10 ppm, 60 E,
2.5 × 3.2 mm, SMD
1
ABRACON
CORPORATION
ABM8-24.000MHZ-R60-D-1
-W-T
X1
140
108-1-00003
XTAL, 25 MHz, 18 pF,
±30 ppm, 60 E,
2.5 × 3.2 mm, SMD
1
CTS
403C35D25M00000
X2
141
108-1-00009
XTAL, 32.768 KHz,
12.5 pF, ±20 ppm, 70K,
1.5 × 3.2 mm, SMD
1
MICRO CRYSTAL
CTS
MICRO CRYSTAL
ABRACON
CORPORATION
CC7V-T1A-32.768KHZ-12.5
PF-20PPM-TA-QC
TF322P32K7680
CM7V-T1A-32.768KHZ-12.5
PF-20PPM-TA-QC
ABS07-32.768KHZ-T
X5
142
108-1-00080
XTAL, 16 MHz, 8 pF,
±15 ppm, 80E,
2 × 2.5 mm, SMD
1
AVX CORPORATION
NDK
CX2520DB16000D0GEJCC
NX2520SA-16MHZ-STD-CS
W-4
X6
143
302-1-00074
Osc, MEMS, 27 MHz,
±50 ppm, 1.8−3.3 V,
CMOS, 15 pF, SMD
1
ABRACON
CORPORATION
ASEMB-27.000MHZ-LC-T
Y1
www.onsemi.com
14
TND6201/D
Table 1. BILL OF MATERIALS (continued)
Manufacturer
Part Number
Item
EN
Description
Qty.
Manufacturer
Reference Design
144
401-1-00090
Jumper, 2Pin, 1 × 1,
1.27 mm, 1 A, Closed Top
16
SULLINS CONNECTOR
SOLUTIONS
NPB02SVAN-RC
Z1, Z2, Z3, Z4, Z5, Z6, Z7, Z8, Z9,
Z10, Z11, Z15, Z16, Z17, Z18,
Z22
145
510-3-00006
Module, microSD Card,
16 GB
1
TOSHIBA
CORPORATION
SD-C16GJ(BL5
Z12
146
401-1-00122
Antenna,
FXP73.07.0100A,
Wi-Fi+BT+Zigbee+ISM
band, 2.4 GHz, Linear,
50E, 5 W, Patch
2
TAOGLAS ANTENNA
SOLUTIONS
FXP73.07.0100A
Z13, Z14
147
401-2-00041
Light Pipe, Rigid Lens,
Dia = 3 mm,
Height = 10 mm, Vertical,
TH
3
BIVAR
VLP-500-F
Z19, Z20, Z21
Amazon is a registered trademark of Amazon.com, Inc. ARM, and Cortex are registered trademarks of ARM Limited (or its subsidiaries) in the
EU and/or elsewhere. Bluetooth is a registered trademark of Bluetooth SIG. Google is a registered trademarks of Google Inc. iOS is a registered
trademarks of Apple Inc. Wi-Fi is a registered trademark of the Wi-Fi Alliance. Wowza is a registered trademark of Wowza Media Systems, LLC
in the United States and/or other countries. Android is a trademark of Google Inc. MatrixCam is a trademark of Semiconductor Components
Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. microSD and SDHC are trademarks of SD−3C, LLC
in the United States, other countries or both. All other brand names and product names appearing in this document are registered trademarks
or trademarks of their respective holders.
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable
copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
www.onsemi.com
15
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
TND6201/D