CIC61508 Functional Safety Companion Chip Data Sheet V1.2 2011-06 Edition 2011-06 Published by Infineon Technologies AG 81726 Munich, Germany © 2011 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. CIC61508 Functional Safety Companion Chip Data Sheet V1.2 2011-06 CIC61508 CIC61508 Data Sheet Revision History: V1.2 2011-06 Previous Versions: V1.0, V1.1 Page Subjects (major changes since last revision) 20 Typical SPI timing parameters are replaced by limit values. We Listen to Your Comments Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us to continuously improve the quality of this document. Please send your proposal (including a reference to this document) to: [email protected] Data Sheet V1.2, 2011-06 CIC61508 Table of Contents Table of Contents 1 1.1 1.2 1.3 1.4 1.5 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Functional Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power Supply and Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.1 2.1.1 2.1.2 2.1.3 2.2 2.2.1 2.2.2 2.2.3 2.2.4 2.3 2.3.1 2.3.2 2.3.3 2.3.4 Electrical Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Parameter Interpretation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Absolute Maximum Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Input/Output Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Supply Threshold Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Voltage Monitor Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Power Supply Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Testing Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Output Rise/Fall Times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Reset Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 SPI Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 3 3.1 3.2 3.3 Package and Quality Declaration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Quality Declaration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Data Sheet I-1 1 1 1 1 2 5 21 21 22 23 V1.2, 2011-06 Functional Safety Companion Chip 1 Overview 1.1 Features CIC61508 The CIC61508 has the following features: • • • • • • • • • Power supply monitor for over- and under-voltage Sequencer Task monitor Data comparison and verification functions SPI communication monitor Safety path control (enable/disable) Configurable Wake-Up Timer Wide range of voltage supply supported (3.3V or 5.0V +/-10%) TSSOP-38 package available 1.2 Ordering Information For the available ordering codes for the CIC61508, please refer to your responsible sales representative or your local distributor. This document decribes the device types shown in Table 1-1. Table 1-1 CIC61508 Device Types Device Type Power Supply Ambient Temperature Range SAA-CIC61508-OSRF 5V 5.0 V -40 to 140 °C SAA-CIC61508-OSRF 3V 3.3 V -40 to 140 °C 1.3 Functional Summary The CIC61508 is a Companion Safety Monitor Chip to build up functional safety applications; examples include airbag, Electrical Powered Steering (EPS) and damping systems. The chip is responsible for monitoring the host microcontroller’s behaviour. It can monitor the host microcontroller’s power supply and verify the host microcontroller’s requests. It therefore serves as an independent diagnostic monitoring device to allow the host microcontroller system to be SIL3 approved. Data Sheet 1 V1.2, 2011-06 CIC61508 Overview 1.4 Pin Configuration VDDP 1 38 RESET SCLK 2 37 NC MTSR 3 36 NC MRST 4 35 NC NC 5 34 NC NC 6 33 SYSDISA VSSC 7 32 SYSDISB VDDC 8 31 NC 30 CS 29 NC NC 9 NC 10 VSSP 11 28 NC NC 12 27 NC SYSDISC 13 26 SEND NC 14 25 SENREF SENA 15 24 SENGND SENB 16 23 VSSP SENC 17 22 VSSP VDDP 18 21 VSSP VSSP 19 20 VSSP CIC61508 Figure 1-1 CIC61508 Pinout (PG-TSSOP-38) Table 1-2 Pin Definitions and Functions (PG-TSSOP-38) Pin Type Number Reset Symbol State1) 1 - - VDDP Voltage Supply 2 I Hi-Z SCLK SPI Clock 3 I Hi-Z MTSR SPI Input 4 O Hi-Z MRST SPI Output 5 - - NC Not connected Data Sheet Function 2 V1.2, 2011-06 CIC61508 Overview Table 1-2 Pin Definitions and Functions (PG-TSSOP-38) Pin Type Number Reset Symbol State1) Function 6 - - NC Not connected 7 - - VSSC Supply Ground (Digital) 8 - - VDDC Core Supply Monitor 9 - - NC Not connected 10 - - NC Not connected 11 - - VSSP Supply Ground 12 - - NC Not connected 13 O PU SYSDISC System Disable C 14 - - NC Not connected 15 I Hi-Z SENA Analog Input A 16 I Hi-Z SENB Analog Input B 17 I Hi-Z SENC Analog Input C 18 - - VDDP Voltage Supply 19 - - VSSP Supply Ground 20 - - VSSP Supply Ground 21 - - VSSP Supply Ground 22 - - VSSP Supply Ground 23 - - VSSP Supply Ground 24 - - SENGND Analog Ground 25 - - SENREF Analog Reference 26 I Hi-Z SEND Analog Input D 27 - - NC Not connected 28 - - NC Not connected 29 - - NC Not connected 30 I/O PD CS Chip Select / Wake-Up Output 31 - - NC Not connected 32 O Hi-Z SYSDISB System Disable B 33 O Hi-Z SYSDISA System Disable A 34 - - NC Not connected 35 - - NC Not connected Data Sheet 3 V1.2, 2011-06 CIC61508 Overview Table 1-2 Pin Definitions and Functions (PG-TSSOP-38) Pin Type Number Reset Symbol State1) Function 36 - - NC Not connected 37 - - NC Not connected 38 I PU RESET Reset Input 1) Abbreviations: PU - Pull up; PD - Pull down; Hi-Z - High impedance. Data Sheet 4 V1.2, 2011-06 CIC61508 Overview 1.5 Power Supply and Reset The power supply to the CIC61508 is regulated by the internal voltage regulator that comes with detection circuitries to ensure that the supplied voltages are within the specified operating range. The CIC61508 microcontroller requires a power supply voltage level (VDDP) of 3.3 V or 5.0 V, which must be provided from the external power supply pin. VDDP is used to power up the CIC61508. In order to power up the chip properly, the external reset pin RESET must be asserted until the internal working voltage (VDDC) reaches 90% of its intended voltage of 2.5 V. The delay of external reset can be realized by an external capacitor at RESET pin. This capacitor value must be selected so that VRESET reaches 0.4 V, but not before VDDC reaches 0.9* VDDC. A typical application example is shown in Figure 1-2. VDDP capacitor value is 300 nF. VDDC capacitor value is 220 nF. The capacitor connected to RESET pin is 100 nF. Typically, the time taken for VDDC to reach 0.9*VDDC is less than 50 μs once VDDP reaches 2.3V. Hence, based on the condition that 10% to 90% VDDP (slew rate) is less than 500 μs, the RESET pin should be held low for 500 μs typically. See Figure 1-3. Vin VR 3.3 / 5V e.g. 300nF VSSP typ. 100nF VDDP 220nF VDDC VSSC RESET 30k CIC61508 Figure 1-2 Data Sheet Reset Circuitry 5 V1.2, 2011-06 CIC61508 Overview Voltage 5V VDDP 2.5V 2.3V 0.9*VDDC VDDC Time Voltage RESET with capacitor 5V < 0.4V 0V Time typ. < 50us Figure 1-3 VDDP, VDDC and VRESET during Power-on Reset An external hardware reset is triggered when the reset input pin RESET is asserted and held low for at least 100 ns. VDDC detector in the internal voltage regulator detects brownout when the core supply voltage VDDC dips below the threshold voltage VDDC_TH (2.1 V). The brownout will cause the device to be reset. Both the hardware reset and the brownout reset have the same effect as a power-on reset, therefore the SYSDISx pins will be reset to their default states shown in Table 1-2. Data Sheet 6 V1.2, 2011-06 CIC61508 Electrical Parameters 2 Electrical Parameters Chapter 2 provides the characteristics of the electrical parameters which are implementation-specific for the CIC61508. 2.1 General Parameters The general parameters are described here to aid the users in interpreting the parameters mainly in Section 2.2 and Section 2.3. 2.1.1 Parameter Interpretation The parameters listed in this section represent partly the characteristics of the CIC61508 and partly its requirements on the system. To aid interpreting the parameters easily when evaluating them for a design, they are indicated by the abbreviations in the “Symbol” column: • • CC These parameters indicate Chip Characteristics, which are distinctive features of the CIC61508 and must be regarded for a system design. SR These parameters indicate System Requirements, which must be provided by the system in which the CIC61508 is designed in. Data Sheet 7 V1.2, 2011-06 CIC61508 Electrical Parameters 2.1.2 Absolute Maximum Rating Maximum ratings are the extreme limits to which the CIC61508 can be subjected to without permanent damage. Table 1 Absolute Maximum Rating Parameters Parameter Symbol Limit Values TA Storage temperature TST Junction temperature TJ Voltage on power supply pin with VDDP respect to VSS Voltage on any pin with respect VIN to VSS Ambient temperature Unit Notes min. max. -40 140 °C -65 150 °C -40 150 °C -0.5 6 V -0.5 VDDP + 0.5 or max. 6 V under bias under bias whichever is lower Note: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. During absolute maximum rating overload conditions (VIN > VDDP or VIN < VSS) the voltage on VDDP pin with respect to ground (VSS) must not exceed the values defined by the absolute maximum ratings. Data Sheet 8 V1.2, 2011-06 CIC61508 Electrical Parameters 2.1.3 Operating Conditions The following operating conditions must not be exceeded in order to ensure correct operation of the CIC61508. All parameters mentioned in the following table refer to these operating conditions, unless otherwise noted. Table 2 Operating Condition Parameters Parameter Symbol min. Limit Values typ. max. Unit Notes/ Conditions V Digital power supply voltage VDDP 3.0 - 3.6 Digital power supply voltage VDDP 4.5 - 5.5 Digital ground voltage VSS 0 Operating Clock Frequency1) fCLK - 26.7 - MHz -40 - 140 °C Ambient temperature TA 3.3V Variant 5.0V Variant V 1) Some parts of the CIC61508 run at 80 MHz frequency. These frequencies are internal working frequencies of the CIC61508. Data Sheet 9 V1.2, 2011-06 CIC61508 Electrical Parameters 2.2 DC Parameters The electrical characteristics of the DC Parameters are detailed in this section. 2.2.1 Input/Output Characteristics Table 3 provides the characteristics of the input/output pins of the CIC61508. Table 3 Input/Output Characteristics (Operating Conditions apply) Parameter Symbol Limit Values min. Unit Test Conditions max. VDDP = 5 V Range Output low voltage VOL CC – 1.0 V – 0.4 V Output high voltage VOH CC VDDP - – 1.0 V IOL = 15 mA IOL = 5 mA IOH = -15 mA VDDP - – V IOH = -5 mA V CMOS Mode V CMOS Mode – V CMOS Mode – V CMOS Mode Input Hysteresis on port HYSP CC 0.08 × – pins1) VDDP V CMOS Mode -10 μA – μA 10 μA – μA CC -0.5 0.5 μA VIH,min VIL,max VIL,max VIH,min 0 < VIN < VDDP, TA ≤ 140°C SR -5 5 mA 0.4 Input low voltage on port pins VILP Input low voltage on RESET pin VILR Input high voltage on port pins VIHP Input high voltage on RESET pin VIHR 0.3 × SR – VDDP 0.3 × SR – VDDP SR 0.7 × VDDP SR 0.7 × VDDP Pull-up current IPU SR – Pull-down current IPD SR – -150 150 Input leakage current 2)3) IOZ1 Overload current on any IOV pin Data Sheet 10 V1.2, 2011-06 CIC61508 Electrical Parameters Table 3 Input/Output Characteristics (Operating Conditions apply) (cont’d) Parameter Symbol Limit Values min. Unit Test Conditions max. Absolute sum of overload currents Σ|IOV| SR – 25 mA 3) Voltage on any pin during VDDP power off VPO SR – 0.3 V 4) Maximum current per IM SR SR – pin (excluding VDDP and VSS) 15 mA Maximum current for all Σ|IM| pins (excluding VDDP and VSS) SR – 60 mA IMVDDP SR – 80 mA SR – 80 mA Maximum current into VDDP Maximum current out of IMVSS VSS VDDP = 3.3 V Range Output low voltage VOL CC – 1.0 V – 0.4 V Output high voltage VOH CC VDDP - – 1.0 V IOL = 8 mA IOL = 2.5 mA IOH = -8 mA VDDP - – V IOH = -2.5 mA V CMOS Mode V CMOS Mode – V CMOS Mode – V CMOS Mode CC 0.03 × – V CMOS Mode -5 μA – μA VIH,min VIL,max 0.4 Input low voltage on port pins VILP Input low voltage on RESET pin VILR Input high voltage on port pins VIHP Input high voltage on RESET pin VIHR Input Hysteresis1) HYS 0.3 × SR – VDDP 0.3 × SR – VDDP SR 0.7 × VDDP SR 0.7 × VDDP VDDP Pull-up current IPU SR – -50 Data Sheet 11 V1.2, 2011-06 CIC61508 Electrical Parameters Table 3 Input/Output Characteristics (Operating Conditions apply) (cont’d) Parameter Symbol Limit Values min. Pull-down current IPD SR – 50 Unit Test Conditions max. 5 μA – μA Input leakage current2)3) IOZ1 CC -0.5 0.5 μA Overload current on any IOV pin SR -5 5 mA VIL,max VIH,min 0 < VIN < VDDP, TA ≤ 140°C Absolute sum of overload currents Σ|IOV| SR – 25 mA 3) Voltage on any pin during VDDP power off VPO SR – 0.3 V 4) Maximum current per IM SR SR – pin (excluding VDDP and VSS) 15 mA Maximum current for all Σ|IM| pins (excluding VDDP and VSS) SR – 60 mA IMVDDP SR – 80 mA 80 mA Maximum current into VDDP Maximum current out of IMVSS SR – VSS 1) Not subjected to production test, verified by design/characterization. Hysteresis is implemented to avoid meta stable states and switching due to internal ground bounce. It cannot be guaranteed that it suppresses switching due to external system noise. 2) An additional error current (IINJ) will flow if an overload current flows through an adjacent pin. RESET pin has internal pull devices and is not included in the input leakage current characteristic. 3) Not subjected to production test, verified by design/characterization. 4) Not subjected to production test, verified by design/characterization. However, for applications with strict low power-down current requirements, it is mandatory that no active voltage source is supplied at any pin when VDDP is powered off. Data Sheet 12 V1.2, 2011-06 CIC61508 Electrical Parameters 2.2.2 Supply Threshold Characteristics Table 4 provides the characteristics of the supply threshold in the CIC61508. Note: VDDC is an internal working voltage used by some parts of the CIC61508. 5.0V VDDPPW VDDP 2.5V V DDCPW VDDCBO VDDC VDDCPOR VDDCBOPD Figure 1 Supply Threshold Parameters Table 4 Supply Threshold Parameters (Operating Conditions apply) Parameters Symbol VDDC prewarning voltage1) VDDC brownout voltage in VDDCPW VDDCBO Limit Values Unit min. typ. max. CC 2.2 2.3 2.4 V CC 2.0 2.1 2.2 V VDDC brownout voltage in power-down mode2) VDDCBOPD CC 1.3 1.5 1.7 V VDDP prewarning voltage3) VDDPPW VDDCPOR CC 3.4 4.0 4.65 V CC 1.3 1.5 1.7 V active mode1) Power-on reset voltage2) 1) Detection is disabled in power-down mode. 2) Detection is enabled in both active and power-down mode. 3) Detection is enabled for external power supply of 5.0V. Detection is disabled for external power supply of 3.3V. Data Sheet 13 V1.2, 2011-06 CIC61508 Electrical Parameters 2.2.3 Voltage Monitor Characteristics All ground pins (VSS) must be externally connected to one single star point in the system. The voltage difference between the ground pins must not exceed 200mV. Table 1 Voltage Monitor Characteristics (Operating Conditions apply) Parameter Symbol Limit Values typ . max. Unit Test Conditions/ Remarks Analog reference voltage VAREF SR VAGND VDDP +1 VDDP V + 0.05 Analog reference ground VAGND SR VSS 0.05 -1 Analog input voltage range VAIN SR VAGND – VAREF V Total unadjusted error (for 10-bit conversion TUE CC – – 2 LSB 5V variant – – 3 LSB 3.3V variant Switched capacitance at the reference voltage input CAREFSW CC – 10 20 pF 1)2) Switched capacitance at the analog voltage inputs CAINSW CC – 5 7 pF 1)3) Input resistance of RAREF the reference input CC – 1 2 kΩ 1) Input resistance of RAIN the selected analog channel CC – 1 1.5 kΩ 1) min. VSS VAREF V 1) Not subject to production test, verified by design/characterization. 2) This represents an equivalent switched capacitance. This capacitance is not switched to the reference voltage at once. Instead of this, smaller capacitances are successively switched to the reference voltage. 3) The sampling capacity of the conversion C-Network is pre-charged to VAREF/2 before connecting the input to the C-Network. Because of the parasitic elements, the voltage measured at ANx is lower than VAREF/2. Data Sheet 14 V1.2, 2011-06 CIC61508 Electrical Parameters Analog Input Circuitry R EXT VAIN R AIN, On SENx C EXT C AINSW SENGND Reference Voltage Input Circuitry RAREF, On SENREF VAREF C AREFSW SENGND Figure 2 Data Sheet Voltage Monitor Input Circuits 15 V1.2, 2011-06 CIC61508 Electrical Parameters 2.2.4 Power Supply Current Table 2 provides the characteristics of the power supply current in the CIC61508. Table 2 Power Supply Current Parameters (Operating Conditions apply) Parameter Symbol Limit Values 1) typ. Unit Test Condition 2) max. Active Mode IDDP 22.6 24.5 mA Periodic Wake-up (low current) Mode3) IPWU 4.1 - mA 4) 1) The typical current values are based on preliminary measurements and are to be used as reference only. These values are periodically measured at TA = + 25 °C and VDDP = 5.0 V. 2) The maximum current values are measured under worst case conditions (TA = + 140 °C and VDDP = 5.5 V). 3) The periodic wake-up or low current mode is entered once the wake-up timer functionality is enabled. 4) Not subjected to production test, verified by design/characterization. Data Sheet 16 V1.2, 2011-06 CIC61508 Electrical Parameters 2.3 AC Parameters The electrical characteristics of the AC Parameters are detailed in this section. 2.3.1 Testing Waveforms The testing waveforms for rise/fall time, output delay and output high impedance are shown in Figure 3, Figure 4 and Figure 5. VDDP 90% 10% 10% VSS Figure 3 90% tF tR Rise/Fall Time Parameters VDDP VDDE / 2 Test Points VDDE / 2 VSS Figure 4 Testing Waveform, Output Delay VLoad + 0.1 V VLoad - 0.1 V Figure 5 Data Sheet Timing Reference Points VOH - 0.1 V VOL - 0.1 V Testing Waveform, Output High Impedance 17 V1.2, 2011-06 CIC61508 Electrical Parameters 2.3.2 Output Rise/Fall Times Table 1 provides the characteristics of the output rise/fall times in the CIC61508. Table 1 Output Rise/Fall Times Parameters (Operating Conditions apply) Parameter Symbol Limit Values Unit Test Conditions min. max. VDDP = 5V Range Rise/fall times1) 2) tR, tF – 10 ns 20 pF.3) tR, tF – 10 ns 20 pF.4) VDDP = 3.3V Range Rise/fall times 1) 2) 1) Rise/Fall time measurements are taken with 10% - 90% of pad supply. 2) Not all parameters are 100% tested, but are verified by design/characterization and test correlation. 3) Additional rise/fall time valid for CL = 20pF - 100pF @ 0.125 ns/pF. 4) Additional rise/fall time valid for CL = 20pF - 100pF @ 0.225 ns/pF. VDDP 90% 90% VSS 10% 10% tF tR Figure 6 Data Sheet Rise/Fall Times Parameters 18 V1.2, 2011-06 CIC61508 Electrical Parameters 2.3.3 Reset Timing Table 3 provides the characteristics of the reset timing in the CIC61508. Table 2 Reset Timing (Operating Conditions apply) Parameter Symbol Limit Values min. typ. Start-up time from an immediate wake-up timer reset1) tSWU CC – Unit Test Conditions max. 55.8 – ms 2) 1) The start-up time is measured from the time the immediate wake-up timer reset is triggered to the time the start-up BIST is completed. The immediate wake-up timer reset is triggered by a SFR write command to the WAKERELOAD SFR while WAKEPRESCALAR SFR is configured with the value 8XH. 2) Not subjected to production test, verified by design/characterization. Data Sheet 19 V1.2, 2011-06 CIC61508 Electrical Parameters 2.3.4 SPI Timing Table 3 provides the characteristics of the SPI timing in the CIC61508. Note: These parameters are not subject to production test but verified by design and/or characterization. Table 3 SPI Timing (Operating Conditions apply; CL = 50 pF) Parameter Symbol t0 t1 t2 t3 t4 t5 t6 SCLK clock period Data valid Data setup time Data hold time Clock active after CS becomes valid Clock inactive before CS becomes invalid Time between active CS 1) SR Limit Values min. max. 500 2000 Unit ns CC 0 – ns SR 22 – ns SR 0 – ns SR 2.0 3.5 μs SR 0 2.8 μs SR 60.7 65 μs 1) The typical value is based on 8 consecutive 16-bit data transfers per heartbeat, at a baud rate of 2 Mbaud. CS t4 t0 t5 t6 SCK t1 MRST LSB MSB t 2 t3 MTSR Figure 4 Data Sheet LSB MSB SPI Timing 20 V1.2, 2011-06 CIC61508 Package and Quality Declaration 3 Package and Quality Declaration Chapter 3 provides the information of the CIC61508 package and reliability section. 3.1 Package Parameters Table 3 provides the thermal characteristics of the package used in CIC61508. Table 3 Thermal Characteristics of the Package Parameter Symbol Limit Values Min. Unit Notes Max. PG-TSSOP-38 Thermal resistance junction RTJC case1) CC - 15.7 K/W - Thermal resistance junction RTJL lead1) CC - 39.2 K/W - 1) The thermal resistances between the case and the ambient (RTCA) , the lead and the ambient (RTLA) are to be combined with the thermal resistances between the junction and the case (RTJC), the junction and the lead (RTJL) given above, in order to calculate the total thermal resistance between the junction and the ambient (RTJA). The thermal resistances between the case and the ambient (RTCA), the lead and the ambient (RTLA) depend on the external system (PCB, case) characteristics, and are under user responsibility. The junction temperature can be calculated using the following equation: TJ=TA+RTJA × PD, where the RTJA is the total thermal resistance between the junction and the ambient, while PD is given by the multiplication of the max. VDDP and max. IDDP. The total junction ambient resistance RTJA can be obtained from the upper four partial thermal resistances, by a) simply adding only the two thermal resistances (junction lead and lead ambient), or b) by taking all four resistances into account, depending on the precision needed. Data Sheet 21 V1.2, 2011-06 CIC61508 Package and Quality Declaration 3.2 Package Outline Figure 7 show the package outline of the CIC61508. Figure 7 Data Sheet PG-TSSOP-38 Package Outline 22 V1.2, 2011-06 CIC61508 Package and Quality Declaration 3.3 Quality Declaration Table 4 shows the characteristics of the quality parameters in the CIC61508. Table 4 Quality Parameters1) Parameter Symbol Limit Values Min. Operation Lifetime tOP when the device is used at the four stated TA 2) Typ. Unit Notes TA = 140°C TA = 125°C TA = 85°C TA = -40°C TA = 108°C TA = 27°C Max. - - 1500 hours - - 2000 hours - - 10000 hours - - 1500 hours hours Operation Lifetime tOP2 when the device is used at the two stated TA2) - - 18000 - - 130000 hours Weighted Average Temperature3) TWA - 106 - °C For 15000 hours ESD susceptibility according to Human Body Model (HBM) for all pins (except VDDC) VHBM - - 2000 V Conforming to EIA/JESD22A114-B ESD susceptibility according to Human Body Model (HBM) for VHBMC 600 Conforming to EIA/JESD22A114-B VDDC ESD susceptibility according to Charged Device Model (CDM) pins VCDM - - 750 V Conforming to JESD22-C101-C 1) Not all parameters are 100% tested, but are verified by design/characterization and test correlation. 2) This lifetime refers only to the time when the device is powered-on. 3) This parameter is derived based on the Arrhenius model. Data Sheet 23 V1.2, 2011-06 w w w . i n f i n e o n . c o m Published by Infineon Technologies AG