Data Sheet

PESD1LVDS
ESD protection for in-vehicle ultra high-speed interfaces
Rev. 2 — 23 January 2013
Product data sheet
1. Product profile
1.1 General description
The device is designed to protect in-vehicle ultra high-speed interfaces in automotive
applications, such as Low-Voltage Differential Signaling (LVDS), High-Definition
Multimedia Interface (HDMI) and DisplayPort interfaces against ElectroStatic
Discharge (ESD).
The device is housed in an ultra small SOT1165-1 (XSON10) Surface-Mounted
Design (SMD) plastic package.
1.2 Features and benefits
 System ESD protection for LVDS, HDMI and DisplayPort interfaces
 Line capacitance of only 0.6 pF with  0.05 pF matching capacitance between
signal pairs
 Ultra small XSON10 package with design-friendly ‘pass-thru’ signal routing
 AEC-Q101 qualified
1.3 Applications
The devices are designed for high-speed receiver and transmitter port protection:
 Automotive A/V monitors, displays and cameras
1.4 Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
VRWM
reverse standoff voltage
Cch
[1]
channel capacitance
This parameter is guaranteed by design.
Conditions
f = 1 MHz;
Vbias = 2.5 V
[1]
Min
Typ
Max
Unit
-
-
5.5
V
-
0.6
-
pF
PESD1LVDS
NXP Semiconductors
ESD protection for in-vehicle ultra high-speed interfaces
2. Pinning information
Table 2.
Pinning
Pin
Symbol
Description
1
CH1
negative channel 1
ESD protection
2
CH1+
Simplified outline
positive channel 1
ESD protection
Graphic symbol
10
9
8
7
6
1
2
3
4
5
1
2
4
5
Transparent top view
3
GND
ground
4
CH2
negative channel 2
ESD protection
5
CH2+
positive channel 2
ESD protection
6
n.c.
not connected
7
n.c.
not connected
8
GND
ground
9
n.c.
not connected
10
n.c.
not connected
XSON10
3, 8
001aai619
3. Ordering information
Table 3.
Ordering information
Type number
PESD1LVDS
Package
Name
Description
Version
XSON10
plastic extremely thin small outline package; no leads; SOT1165-1
10 terminals; body 1  2.5  0.5 mm
4. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Tstg
Tamb
Conditions
Min
Max
Unit
storage temperature
55
+125
C
ambient temperature
40
+85
C
Min
Max
Unit
-
8
kV
Table 5.
ESD maximum ratings
Tamb = 25 C unless otherwise specified.
Symbol
VESD
PESD1LVDS
Product data sheet
Parameter
Conditions
electrostatic
discharge voltage
IEC 61000-4-2
(contact discharge)
[1]
Device stressed with ten non-repetitive ESD pulses.
[2]
All pins to ground.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 23 January 2013
[1][2]
© NXP B.V. 2013. All rights reserved.
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PESD1LVDS
NXP Semiconductors
ESD protection for in-vehicle ultra high-speed interfaces
Table 6.
ESD standards compliance
Standard
Conditions
IEC 61000-4-2; level 4 (ESD)
> 8 kV (contact)
MIL-STD-883; class 3B (human body model)
> 8 kV
001aaa631
IPP
100 %
90 %
10 %
t
tr = 0.7 ns to 1 ns
30 ns
60 ns
Fig 1.
ESD pulse waveform according to IEC 61000-4-2
5. Characteristics
Table 7.
Characteristics
Tamb = 25 C unless otherwise specified.
PESD1LVDS
Product data sheet
Symbol
Parameter
VRWM
reverse standoff voltage
IRM
reverse leakage current
per channel;
V = 3.0 V
VBR
breakdown voltage
I = 1 mA
VF
forward voltage
C(I/O-GND)
input/output to ground
capacitance
f = 1 MHz;
Vbias = 2.5 V
C(I/O-GND)
input/output to ground
capacitance variation
Cch(mutual)
mutual channel
capacitance
[1]
This parameter is guaranteed by design.
[2]
Between signal pin and pin n.c.
Conditions
Min
Typ
Max
Unit
-
-
5.5
V
-
-
1
A
6
-
9
V
-
0.7
-
V
[1]
-
0.6
-
pF
f = 1 MHz;
Vbias = 2.5 V
[1]
-
0.05
-
pF
f = 1 MHz;
Vbias = 2.5 V
[1][2]
-
0.07
-
pF
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 23 January 2013
© NXP B.V. 2013. All rights reserved.
3 of 12
PESD1LVDS
NXP Semiconductors
ESD protection for in-vehicle ultra high-speed interfaces
ESD TESTER
RZ
450 Ω
RG 223/U
50 Ω coax
4 GHz DIGITAL
OSCILLOSCOPE
10x
ATTENUATOR
CZ
50 Ω
DUT
(DEVICE
UNDER
TEST)
IEC 61000-4-2 network
CZ = 150 pF; RZ = 330 Ω
vertical scale = 2 kV/div
horizontal scale = 15 ns/div
vertical scale = 20 V/div
horizontal scale = 10 ns/div
GND
GND
unclamped +8 kV ESD pulse waveform
(IEC 61000-4-2 network)
clamped +8 kV ESD pulse waveform
(IEC 61000-4-2 network)
vertical scale = 2 kV/div
horizontal scale = 15 ns/div
GND
GND
vertical scale = 20 V/div
horizontal scale = 10 ns/div
unclamped –8 kV ESD pulse waveform
(IEC 61000-4-2 network)
Fig 2.
clamped –8 kV ESD pulse waveform
(IEC 61000-4-2 network)
006aac764
ESD clamping test setup and waveforms
PESD1LVDS
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 23 January 2013
© NXP B.V. 2013. All rights reserved.
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PESD1LVDS
NXP Semiconductors
ESD protection for in-vehicle ultra high-speed interfaces
6. Application information
The devices are designed to provide high-level ESD protection for high-speed serial
data buses such as LVDS, HDMI and DisplayPort data lines.
When designing the Printed-Circuit Board (PCB), careful consideration should be given to
impedance matching, and signal coupling.
Basic application diagrams for the ESD protection of an HDMI interface are shown in
Figure 3.
PESD1LVDS
TMDS_D2+
5
4
8
3
2
1
TMDS_CH2+
TMDS_GND
TMDS_CH2–
TMDS_D2–
GND
TMDS_D1+
TMDS_CH1+
TMDS_GND
TMDS_CH1–
TMDS_D1–
PESD1LVDS
TMDS_D0+
5
TMDS_CH2+
TMDS_GND
4
8
3
2
1
TMDS_CH2–
TMDS_D0–
GND
TMDS_CLK+
TMDS_CH1+
HDMI
CONNECTOR
TMDS_GND
TMDS_CH1–
TMDS_CLK–
CEC
n.c.
DDC_CLK
DDC_DAT
GND
+5 V
HOT PLUG DETECTION
6
5
4
100 nF
1
2
3
006aac617
Fig 3.
PESD1LVDS
Product data sheet
Application diagram of HDMI ESD protection
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 23 January 2013
© NXP B.V. 2013. All rights reserved.
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PESD1LVDS
NXP Semiconductors
ESD protection for in-vehicle ultra high-speed interfaces
7. Test information
7.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
PESD1LVDS
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 23 January 2013
© NXP B.V. 2013. All rights reserved.
6 of 12
PESD1LVDS
NXP Semiconductors
ESD protection for in-vehicle ultra high-speed interfaces
8. Package outline
XSON10: plastic, extremely thin small outline package; no leads;
10 terminals; body 1 x 2.5 x 0.5 mm
SOT1165-1
X
B
D
A
E
A
A1
c
terminal 1
index area
detail X
e1
b1
e
terminal 1
index area
1
5
C
C A B
C
v
w
b
y1 C
y
L
k
10
6
Terminal#3 identification
0
1
Dimensions
Unit
mm
max
nom
min
2 mm
scale
A
0.5
D(1)
E(1)
e
e1
0.05 0.25 0.45
2.6
0.20 0.40 0.127 2.5
0.00 0.15 0.35
2.4
1.1
1.0
0.9
0.5
2
A1
b
b1
c
k
L
v
0.1
0.2
0.43
0.38
0.33
w
y
y1
0.05 0.05 0.05
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
References
Outline
version
IEC
JEDEC
JEITA
SOT1165-1
---
---
---
Fig 4.
sot1165-1_po
European
projection
Issue date
10-02-12
13-01-09
Package outline SOT1165-1 (XSON10)
PESD1LVDS
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 23 January 2013
© NXP B.V. 2013. All rights reserved.
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PESD1LVDS
NXP Semiconductors
ESD protection for in-vehicle ultra high-speed interfaces
9. Soldering
Footprint information for reflow soldering of XSON10 package
SOT1165-1
Hx
P
C
Hy
Ay
By
0.05
D
D1
0.05
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
solder paste deposit
solder land plus solder paste
occupied area
solder resist
Dimensions in mm
P
Ay
By
C
D
D1
Hx
Hy
0.500
1.3
0.25
0.525
0.20
0.40
2.45
1.6
Remark:
Stencil of 75 μm is recommended.
A stencil of 75 μm gives an aspect ratio of 0.77
With a stencil of 100 μm one will obtain an aspect ratio of 0.58
sot1165-1_fr
Reflow soldering is the only recommended soldering method.
Fig 5.
Reflow soldering footprint SOT1165-1 (XSON10)
PESD1LVDS
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 23 January 2013
© NXP B.V. 2013. All rights reserved.
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PESD1LVDS
NXP Semiconductors
ESD protection for in-vehicle ultra high-speed interfaces
10. Revision history
Table 8.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PESD1LVDS v.2
20130123
Product data sheet
-
PESD1LVDS v.1
Modifications:
PESD1LVDS v.1
PESD1LVDS
Product data sheet
•
Figure 4 “Package outline SOT1165-1 (XSON10)”: updated
20111010
Product data sheet
-
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 23 January 2013
-
© NXP B.V. 2013. All rights reserved.
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PESD1LVDS
NXP Semiconductors
ESD protection for in-vehicle ultra high-speed interfaces
11. Legal information
11.1
Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
11.2
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
11.3
Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
PESD1LVDS
Product data sheet
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 23 January 2013
© NXP B.V. 2013. All rights reserved.
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NXP Semiconductors
ESD protection for in-vehicle ultra high-speed interfaces
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
11.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
PESD1LVDS
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 23 January 2013
© NXP B.V. 2013. All rights reserved.
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PESD1LVDS
NXP Semiconductors
ESD protection for in-vehicle ultra high-speed interfaces
13. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
7.1
8
9
10
11
11.1
11.2
11.3
11.4
12
13
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Application information. . . . . . . . . . . . . . . . . . . 5
Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6
Quality information . . . . . . . . . . . . . . . . . . . . . . 6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9
Legal information. . . . . . . . . . . . . . . . . . . . . . . 10
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Contact information. . . . . . . . . . . . . . . . . . . . . 11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 23 January 2013
Document identifier: PESD1LVDS