MA4SPS42X Series SURMOUNTTM PIN Diodes MA4SPS421, MA4SPS422 Rev. V7 MA4SPS421 MA4SPS422 Features Surface Mount No Wire Bonding Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance Higher Average and Peak Power Handling RoHS Compliant* and 260º Reflow Compatible Description This device is a Silicon-Glass PIN diode chip fabricated with M/A-COM Technology Solutions patented HMICTM process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. Selective backside metallization is applied producing a surface mount device. This vertical topology provides for exceptional heat transfer. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch and impact protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly. 1. Backside metal: 0.1 µM thick. 2. Yellow hatched areas indicate backside ohmic gold contacts. 3. All devices have the same outline dimensions (A to G). DIM INCHES MM MIN. MAX. MIN. MAX. A 0.040 0.042 1.025 1.075 B 0.021 0.023 0.525 0.575 C 0.004 0.008 0.102 0.203 D 0.013 0.015 0.325 0.375 E 0.011 0.013 0.275 0.325 F 0.013 0.015 0.325 0.375 G 0.019 0.021 0.475 0.525 Applications These surmount devices are suitable for usage in moderate incident power (10W C.W.) or higher incident peak power (500W) series, shunt, or series-shunt switches. Lower parasitic inductance, 0.1 to 0.2nH, and excellent RC constant (0.45pS), make the devices ideal for higher frequency switch elements compared to their plastic device counterparts. Absolute Maximum Ratings @ TA = 25°C (unless otherwise specified) Parameter Absolute Maximum Forward Current 250mA Reverse Voltage -200V Operating Temperature -55°C to +125°C Storage Temperature -55°C to +150°C Junction Temperature Dissipated Power ( RF & DC ) Mounting Temperature +175°C 1.8W +280°C for 30 seconds * Restrictions on Hazardous Substances, European Union Directive 2002/95/EC. 1 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4SPS42X Series SURMOUNTTM PIN Diodes MA4SPS421, MA4SPS422 Rev. V7 Electrical Specifications @ TA = +25°C MA4SPS421 Parameter Symbol Conditions MA4SPS422 Units Typ. Max. Typ. Max. 0.175 0.340 0.500 Capacitance CT 0V, 1MHz 1 pF 0.130 Capacitance CT 0V, 1GHz 1,3 pF 0.080 Capacitance CT - 40V, 1MHz 1 pF 0.090 Capacitance CT - 40V, 1GHz 1,3 pF 0.070 0.130 Resistance RS +10mA, 1GHz 2,3 Ω 6.200 3.100 Forward Voltage VF +10mA V 0.900 Reverse Leakage Current IR -200V μA 0.140 0.125 0.950 0.180 0.840 |-10| 0.300 0.900 |-10| F1 = 1000MHz Input Third Order Intercept Point IIP3 F2 = 1010MHz dBm 50 50 µS 5 10 °C/W 80 70 Input Power = +10dBm I bias = +10mA +10mA / -6mA Minority Carrier Lifetime TL C.W. Thermal Resistance RØJL (50% - 90% V) IH = 0.5A, IL = 10mA4 1. Total Capacitance, CT, is equivalent to the sum of Junction Capacitance and Parasitic Capacitance. CT = CJ (Junction Capacitance) + CPAR (Parasitic Capacitance) 2. Series resistance RS is equivalent to the total diode resistance: RS = RJ (Junction Capacitance Junction Resistance) + RO (Ohmic Resistance) 3 RS and CT are measured on an HP4291A Impedance Analyzer with die mounted in an ODS-186 package. . 4. Steady-state RØJL measured with die mounted in an ODS-186 package. 2 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4SPS42X Series SURMOUNTTM PIN Diodes MA4SPS421, MA4SPS422 Rev. V7 Typical Performance @ TAMB = +25°C Rs vs. Current (100MHz & 1GHz) MA4SPS421 Rs vs. Current (100MHz & 1GHz) 100.00 100MHz Rs (ohms) Rs (ohms) 100.00 10.00 Rs vs. CurrentMA4SPS422 @ 100MHz & GHz MA4SPS422 100MHz 10.00 1 GHz 1.00 1.00E-03 1 GHz 1.00E-02 1.00 1.00E-03 1.00E-01 1.00E-02 1.00E-01 Current (A) Ct vs Voltage (@ 100MHz & 1GHz) MA4SPS422 3.0E-13 3.0E-13 2.5E-13 2.5E-13 2.0E-13 2.0E-13 Ct (F) Ct (F) Ct vs Voltage (@ 100MHz & 1GHz) MA4SPS421 1.5E-13 100MHz 1.0E-13 5.0E-14 100MHz 1.5E-13 1GHz 1.0E-13 5.0E-14 1GHz 0.0E+00 0.0E+00 0 10 20 30 0 40 10 Voltage (V) 30 40 30 40 Rp vs Voltage (@ 100MHz & 1GHz) MA4SPS422 Rp vs Voltage (@ 100MHz & 1GHz) MA4SPS421 1000000 1000000 100MHz 10000 100000 Rp (ohms) 100000 Rp (ohms) 20 Voltage (V) 1GHz 1000 100 100MHz 10000 1GHz 1000 100 10 10 1 1 0 10 20 Voltage (V) 30 40 0 10 20 Voltage (V) 3 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4SPS42X Series SURMOUNTTM PIN Diodes MA4SPS421, MA4SPS422 Rev. V7 Typical Performance @ TA = +25°C Ct vs Frequency (@ 0, 5 & 40V) MA4SPS422 3.0E-13 3.0E-13 2.5E-13 2.5E-13 2.0E-13 2.0E-13 Ct (F) Ct (F) Ct vs Frequency (@ 0, 5 & 40V) MA4SPS421 1.5E-13 0V 1.0E-13 5V 5.0E-14 5V 1.5E-13 40V 1.0E-13 40V 0.0E+00 0.0E+00 0V 5.0E-14 5.0E+08 1.0E+09 1.5E+09 0.0E+00 0.0E+00 2.0E+09 5.0E+08 1.5E+09 2.0E+09 Frequency (Hz) Frequency (Hz) Ls vs Frequency (@ 10mA & 100mA) MA4SPS422 Ls vs Frequency (@ 10mA & 100mA) MA4SPS421 3.00E-10 3.00E-10 2.50E-10 2.50E-10 100mA 2.00E-10 2.00E-10 10mA 1.50E-10 Ls (H) Ls (H) 1.0E+09 1.00E-10 1.00E-10 5.00E-11 5.00E-11 0.00E+00 0.0E+00 5.0E+08 1.0E+09 1.5E+09 2.0E+09 100mA 1.50E-10 10mA 0.00E+00 0.0E+00 5.0E+08 1.0E+09 1.5E+09 2.0E+09 Frequency (Hz) Frequency (Hz) Rs vs. Frequency (@10mA & 100mA) MA4SPS422 Rs vs. Frequency (@10mA&100mA) MA4SPS421 8 10 6 10mA Rs (ohms) Rs(ohms) 8 7 6 4 100mA 4 3 2 2 0 1.00E+06 5 1 2.51E+08 5.01E+08 Frequency(Hz) 7.50E+08 1.00E+09 10mA 100mA 0 0.00E+00 2.00E+08 4.00E+08 6.00E+08 8.00E+08 1.00E+09 Frequency (Hz) 4 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4SPS42X Series SURMOUNTTM PIN Diodes MA4SPS421, MA4SPS422 Rev. V7 MA4SPS421 ADS SPICE Model PinDiodeModel NLPINM1 Is=3.5E-12A Vi=0.0V Un=900cm^2/V-sec Wi=100μm Rr=11KΩ Cmin=0.06pF Tau= 5μS Rs=0.1Ω Cj0=0.07pF Vj=0.7V M=0.5 Fc=0.5 Imax=3.1 E+8 A/m^2 Kf=0.0 Af=1.0 wBv=260V wPmax=1.6W Ffe=1.0 MA4SPS421 Schematic Diagram Ls Cp Rp Rvia Rvia Notes Rs = 2 * Rvia + Rp + 5 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4SPS42X Series SURMOUNTTM PIN Diodes MA4SPS421, MA4SPS422 Rev. V7 MA4SPS422 ADS SPICE wBv=340V wPmax=1.8W Ffe=1.0 PinDiodeModel NLPINM1 Is=3.5E-12A Vi=0.0V Un=900cm^2/V-sec Wi=100μm Rr=9 KΩ Cmin=0.12pF Tau= 10μS Rs=0.1Ω Cj0=0.13pF Vj=0.7V M=0.5 Fc=0.5 Imax=7.8E+7 A/m^2 Kf=0.0 Af=1.0 MA4SPS422 Schematic Diagram Ls Cp Rp RVIA Notes : Rs = 2 * Rvia + Rp RRiVIA + 6 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4SPS42X Series SURMOUNTTM PIN Diodes MA4SPS421, MA4SPS422 Rev. V7 Handling All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should insure that abrasion and mechanical shock are minimized. Bonding Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are conveniently located on the bottom surface of these devices and are removed from the active junction locations. These devices are well suited for solder attachment onto hard and soft substrates. The use of 80/20, Au/Sn, 60/40, Sn/Pb or RoHS compliant solders is recommended. Conductive silver epoxy solder may also be used but could result in an increase in series and thermal resistance. When soldering these devices to a hard substrate, hot gas die bonding is preferred. We recommend utilizing a vacuum tip and force of 60 to 100 grams applied normal to the top surface of the device. When soldering to soft substrates, it is recommended to use a lead-tin interface at the circuit board mounting pads. Position the die so that its mounting pads are aligned with the circuit board mounting pads and reflow the solder by heating the circuit trace near the mounting pad while applying 60 to 100 grams of force perpendicular to the top surface of the die. The solder joint must not be made one at a time, creating unequal heat flow and thermal stress. Solder reflow should not be performed by causing heat to flow through the top surface of the die. Since the HMIC glass is transparent, the edges of the mounting pads closest to each other can be visually inspected through the die after attach is completed. Recommended temperature and re-flow profiles for 60/40, Sn/Pb and RoHS compliant solders are provided in Application Note M538 , “Surface Mounting Instructions“. Application Note M541 “Bonding and Handling Procedures for Chip Diode Devices” provides handling and assembly recommendations. Ordering Information The MA4SPS42X series of SURMOUNTS may be ordered in either gel packs or tape and reeled by adding the appropriate suffix per the table below. Tape and reel dimensions are provided in Application Note M513 located on the M/A-COM Tech website @ www.macomtech.com. Part Number Gel Pack Tape and Reel Pocket Tape MA4SPS421 MADP-000421-12940P MA4SPS422 MADP-000422-12950P 7 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice.