MA4FCP200 Flip Chip PIN Diode Rev. V3 Features 1264 Outline ♦ Low Series Resistance ♦ Low Capacitance ♦ Fast Switching Speed ♦ Silicon Nitride Passivation ♦ Polymer Scratch Protection ♦ RoHS Compliant Description M/A-COM Technology Solutions MA4FCP200 is a silicon flip chip PIN diode fabricated using a patented HMIC process which provides for repeatable electrical characteristics. This diode is fabricated on epitaxial wafers using a process designed for extremely low parasitics. The diode is fully passivated with silicon nitride to minimize leakage current. The chip also has an additional polymer layer for impact and scratch protection to prevent damage to the active area during handling. Applications The small outline and low 0.05pS RC product, make the device useful in multi-throw switches and switched phase shifter circuits requiring <20nS switching speeds at operating frequencies up to 18GHz. Absolute Maximum Ratings1 TAMB = +25°C (unless otherwise specified) Parameter ohmic, gold contacts. Inches Dim. Millimeters Min. Max. Min. Max. Absolute Maximum A 0.014 0.015 0.356 0.381 Forward Current 100mA B 0.008 0.009 0.203 0.229 Reverse Voltage - 70V C 0.004 0.005 0.102 0.127 Operating Temperature - 55°C to + 125°C D 0.003 0.004 0.076 0.102 Storage Temperature - 55°C to + 150°C E 0.002 0.003 0.175 0.225 F 0.008 0.010 0.203 0.254 G 0.004 0.006 0.102 0.152 Dissipated Power RF plus DC Mounting Temperature 1 • Backside metal contacts: 0.1μM thick gold. • Yellow hatched areas indicate backside, mounting, 100mW +300°C for 10 seconds 1. Exceeding any of these limits may cause permanent damage to the chip. ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4FCP200 Flip Chip PIN Diode Rev. V3 Electrical Specifications @ TAMB +25°C Parameters @ Conditions Total Capacitance @ -40V, 1MHz1 Total Capacitance @ -40V, 1GHz 1,3 Symbol Units Min. Typ. Max. CT pF —— 0.025 0.030 CT pF —— 0.020 —— 2,3 RS Ω —— 2.4 3.0 2,3 Series Resistance @ +50mA , 1GHz RS Ω —— 2.8 —— Forward Voltage @ +100mA VF V —— 1.25 1.5 Reverse Voltage @ -10μA VR V 70 —— —— Reverse Current @ -70V IR μA —— —— 10 Lifetime @ IF = +10mA / IREV = -6mA TL nS —— 100 —— Steady State Thermal Resistance4 θ °C/W —— 900 —— Series Resistance @ +50mA , 100MHz 1. Total capacitance is equivalent to the sum of junction capacitance, Cj, plus the die parasitic capacitance, Cp. 2. The series resistance, RS, is equal to the total diode resistance which also includes the resistance of the junction, Rj. 3. Rs and Cp measured on an HP4291A with die mounted in an ODS-186 package. 4. Steady-state Thermal Resistance measured with die mounted in an ODS-186 package. 186 ESD These devices very susceptible to ESD and are rated Class 0 (0-199V) per HBM MIL-STD-883, method 3015.7 [C = 100pF ±10%, R = 1.5kW ±1%]. Even though die survived ESD testing to 100V , they should be handled in a static free environment. 2 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4FCP200 Flip Chip PIN Diode Rev. V3 Typical Performance @ TAMB +25°C MA4FCP200 Rs vs I 1000.0 Rs_50 MHz Rs_100 MHz Rs_500 MHz Rs ( Ohms ) 100.0 10.0 1.0 0.01 0.10 1.00 10.00 100.00 I ( mA ) MA4FCP200 Rs vs Frequency 5 10mA 4 Rs ( Ohms ) 50mA 3 2 100mA 1 0 0 200 400 600 800 1000 F ( MHz ) 3 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4FCP200 Flip Chip PIN Diode Rev. V3 Typical Performance @ TAMB +25°C 4 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4FCP200 Flip Chip PIN Diode Rev. V3 MA4FCP200 SPICE Model PinDiodeModel NLPINM1 Is=1.0E-14 A wBv= 70 V Vi=0.0 V wPmax= 100 mW Un= 900 cm^2/V-sec Ffe= 1.0 Wi= 5.0 um Rr= 10 K Ohms Cjmin= 0.02 pF Tau= 0.10 usec Rs(I)= Rc + Rj(I) = 0.05 Ohm + Rj(I) Cj0= 0.03 pF Vj= 0.7 V M= 0.5 Fc= 0.5 Imax= 1.0 E+5 A/m^2 Kf=0.0 Af=1.0 Rs Ls = 0.6nH _ + Ct 5 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4FCP200 Flip Chip PIN Diode Rev. V3 Handling Procedures All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should insure that abrasion and mechanical shock are minimized. Bonding Techniques These devices were designed for insertion onto hard or soft substrates with the junction (pad) side down. They can be mounted with electrically conductive epoxy or with a eutectic solder preform. However, tin rich solders will scavenge gold from the bottom contacts and are not recommended. Indalloy or 80/20, Au/Sn, solders are acceptable. Maximum soldering temperature must be <300°C for <10 sec. These chips are designed to be inserted onto hard or soft substrates with the junction side down. They should be mounted onto silkscreened circuits using electrically conductive Ag epoxy, approximately 1-2 mils in thickness and cured at approximately 90°C to 150°C per manufacturer’s schedule. For extended cure times, >30 minutes, temperatures must be kept below 200°C. The die can also be assembled using non conductive epoxy with the junction side up, and wire or ribbon bonds made to the pads. Circuit Mounting Dimensions ( Inches ) 0.013” 0.012” (2) PL 0.008” (2) PL Ordering Information Part Number MA4FCP200 MA4FCP200-W Packaging Die in Gel Pack Wafer Cut on Tape 6 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice.