Technical Brief 493 Sn/Pb and Pb-free Reflow Soldering Temperature Profiles TABLE 1. REFLOW PROFILES PROFILE FEATURE SN-PB EUTECTIC ASSEMBLY PB-FREE ASSEMBLY Temperature Min (TSMIN) 100°C 150°C Temperature Max (TSMAX) 150°C 200°C Preheat/Soak Time (tS) from (TSMIN to TSMAX) Ramp-up rate (TL to TP) 60-120 seconds 60-120 seconds 3 °C/second max. 3 °C/second max. 183°C 217°C Liquidous Temperature (TL) Time (tL) maintained above TL 60-150 seconds 60-150 seconds Peak package body temperature (TP) For users, TP must not exceed the Classification temp in Table 2. For suppliers, TP must equal or exceed the Classification temp in Table 2. For users, TP must not exceed the Classification temp in Table 3. For suppliers, TP must equal or exceed the Classification temp in Table 3. Time (tP) within 5°C of the specified classification temperature (TC); see Figure 1 and Note 1 20 seconds (Note 1) 30 seconds (Note 1) 6°C/second max. 6°C/second max. 6 minutes max. 8 minutes max. Ramp-down rate (TP to TL) Time 25°C to peak temperature NOTES: 1. Tolerance for peak profile temperature (TP) is defined as a supplier minimum and a user maximum. 2. All temperatures refer to the center of the package, measured on the package body surface that is facing up during assembly reflow (e.g., live-bug). If parts are reflowed in other than the normal live-bug assembly reflow orientation (i.e., dead-bug), TP shall be within ± 2 °C of the live-bug TP and still meet the TC requirements, otherwise, the profile shall be adjusted to achieve the latter. To accurately measure actual peak package body temperatures, refer to JEP140 for recommended thermocouple use. 3. Reflow profiles in this document are for classification/preconditioning and are not meant to specify board assembly profiles. Actual board assembly profiles should be developed based on specific process needs and board designs and should not exceed the parameters given above. For example, if TC is 260°C and time tP is 30 seconds, this means the following for the supplier and the user. For a supplier: The peak temperature must be at least 260°C. The time above 255°C must be at least 30 seconds. For a user: The peak temperature must not exceed 260°C. The time above 255°C must not exceed 30 seconds. TABLE 2. SnPb EUTECTIC PROCESS - REFLOW PEAK TEMPERATURES (TC) TABLE 3. PB-FREE PROCESS - REFLOW PEAK TEMPERATURES (TC) PACKAGE THICKNESS VOLUME mm3 < 350 VOLUME mm3 ≥ 350 < 2.5 mm 235°C 220°C ≥ 2.5 mm 220°C 220°C PACKAGE THICKNESS VOLUME mm3 < 350 VOLUME mm3 350 -2000 VOLUME mm3 > 2000 < 1.6mm 260°C 260°C 260°C 1.6mm-2.5 mm 260°C 250°C 245°C > 2.5mm 250°C 245°C 245°C NOTES: 4. At the discretion of the device manufacturer, but not the board assembler/user, the maximum peak package body temperature (TP) can exceed the values specified in Tables 2 or 3. The use of a higher TP does not change the classification temperature (TC). 5. Package volume excludes external terminals (e.g., balls, bumps, lands, leads) and/or non-integral heat sinks. 6. The maximum component temperature reached during reflow depends on package thickness and volume. The use of convection reflow processes reduces the thermal gradients between packages. However, thermal gradients due to differences in thermal mass of SMD packages may still exist. October 18, 2012 TB493.0 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. Copyright Intersil Americas Inc. 2012. All Rights Reserved. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries. All other trademarks mentioned are the property of their respective owners. Technical Brief 493 FIGURE 1. PEAK REFLOW PROFILE Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that the Application Note or Technical Brief is current before proceeding. For information regarding Intersil Corporation and its products, see www.intersil.com 2 TB493.0 October 18, 2012