MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSOP−5 CASE 483 ISSUE M 5 1 SCALE 2:1 DATE 17 MAY 2016 NOTE 5 2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSION A. 5. OPTIONAL CONSTRUCTION: AN ADDITIONAL TRIMMED LEAD IS ALLOWED IN THIS LOCATION. TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2 FROM BODY. D 5X 0.20 C A B 0.10 T M 2X 0.20 T 5 B 1 4 2 S 3 K B DETAIL Z G A A TOP VIEW DIM A B C D G H J K M S DETAIL Z J C 0.05 H C SIDE VIEW SEATING PLANE END VIEW GENERIC MARKING DIAGRAM* SOLDERING FOOTPRINT* 0.95 0.037 MILLIMETERS MIN MAX 2.85 3.15 1.35 1.65 0.90 1.10 0.25 0.50 0.95 BSC 0.01 0.10 0.10 0.26 0.20 0.60 0_ 10 _ 2.50 3.00 1.9 0.074 5 5 XXXAYWG G 1 1 Analog 2.4 0.094 XXX = Specific Device Code A = Assembly Location Y = Year W = Work Week G = Pb−Free Package 1.0 0.039 XX MG G Discrete/Logic XX = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) 0.7 0.028 SCALE 10:1 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: STATUS: 98ARB18753C ON SEMICONDUCTOR STANDARD NEW STANDARD: © Semiconductor Components Industries, LLC, 2002 October, DESCRIPTION: 2002 − Rev. 0 TSOP−5 http://onsemi.com 1 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. Case Outline Number: PAGE 1 OFXXX 2 DOCUMENT NUMBER: 98ARB18753C PAGE 2 OF 2 ISSUE REVISION DATE O INITIATED NEW MECHANICAL OUTLINE #483. REQ BY WL CHIN/L. RENNICK. 28 OCT 1998 A UPDATE OUTLINE DRAWING TO CORRECT DIN “C” (SHOULD BE FROM TIP OF LID TO TOP OF PKG). DIM IN TABLE INCORRECTLY LISTED TO G, F TO H, H TO J, N TO L & R TO M. REQ BY F. PADILLA 13 NOV 1998 B CHANGE OF LEGAL ONWERSHIP FROM MOTOROLA TO ON SEMICONDUCTOR. REQ BY A. GARLINGTON 20 APR 2001 C ADDED NOTE “4”. REQ BY S. RIGGS 27 JUN 2003 D ADDED FOOTPRINT INFORMATION. UPDATED MARKING. REQ. BY D. JOERSZ 07 APR 2005 E CHANGED DEVICE MARKING FROM AWW TO AYW. REQ. BY J. MANES. 14 SEP 2005 F UPDATED DRAWINGS TO LATEST JEDEC STANDARDS. ADDED NOTE 5. REQ. BY T. GURNETT. 07 JUN 2006 G ADDED MARKING DIAGRAM FOR IC OPTION. REQ. BY J. MILLER. 21 FEB 2007 H CORRECTED MARKING DIAGRAM ERROR BY REVERSING ANALOG AND DISCRETE LABELS. REQ. BY GK SUA. 18 MAY 2007 J CHANGED NOTE 4. REQ. BY A. GARLINGTON. 13 MAR 2013 K REMOVED DIMENSION L AND ADDED DATUMS A AND B TO TOP VIEW. REQ. BY A. GARLINGTON. 19 APR 2013 L REMOVED −02 FROM CASE CODE VARIANT. REQ. BY N. CALZADA. 23 SEP 2015 M CHANGED DIMENSIONS A & B FROM BASIC TO MIN AND MAX VALUES. REQ. BY A. GARLINGTON. 17 MAY 2016 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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This literature is subject to all applicable copyright laws and is not for resale in any manner. © Semiconductor Components Industries, LLC, 2016 May, 2016 − Rev. M Case Outline Number: 483