483

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TSOP−5
CASE 483
ISSUE M
5
1
SCALE 2:1
DATE 17 MAY 2016
NOTE 5
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
D 5X
0.20 C A B
0.10 T
M
2X
0.20 T
5
B
1
4
2
S
3
K
B
DETAIL Z
G
A
A
TOP VIEW
DIM
A
B
C
D
G
H
J
K
M
S
DETAIL Z
J
C
0.05
H
C
SIDE VIEW
SEATING
PLANE
END VIEW
GENERIC
MARKING DIAGRAM*
SOLDERING FOOTPRINT*
0.95
0.037
MILLIMETERS
MIN
MAX
2.85
3.15
1.35
1.65
0.90
1.10
0.25
0.50
0.95 BSC
0.01
0.10
0.10
0.26
0.20
0.60
0_
10 _
2.50
3.00
1.9
0.074
5
5
XXXAYWG
G
1
1
Analog
2.4
0.094
XXX = Specific Device Code
A
= Assembly Location
Y
= Year
W = Work Week
G
= Pb−Free Package
1.0
0.039
XX MG
G
Discrete/Logic
XX = Specific Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
0.7
0.028
SCALE 10:1
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
98ARB18753C
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
TSOP−5
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98ARB18753C
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
INITIATED NEW MECHANICAL OUTLINE #483. REQ BY WL CHIN/L. RENNICK.
28 OCT 1998
A
UPDATE OUTLINE DRAWING TO CORRECT DIN “C” (SHOULD BE FROM TIP OF
LID TO TOP OF PKG). DIM IN TABLE INCORRECTLY LISTED TO G, F TO H,
H TO J, N TO L & R TO M. REQ BY F. PADILLA
13 NOV 1998
B
CHANGE OF LEGAL ONWERSHIP FROM MOTOROLA TO ON SEMICONDUCTOR. REQ BY A. GARLINGTON
20 APR 2001
C
ADDED NOTE “4”. REQ BY S. RIGGS
27 JUN 2003
D
ADDED FOOTPRINT INFORMATION. UPDATED MARKING. REQ. BY D. JOERSZ
07 APR 2005
E
CHANGED DEVICE MARKING FROM AWW TO AYW. REQ. BY J. MANES.
14 SEP 2005
F
UPDATED DRAWINGS TO LATEST JEDEC STANDARDS. ADDED NOTE 5. REQ.
BY T. GURNETT.
07 JUN 2006
G
ADDED MARKING DIAGRAM FOR IC OPTION. REQ. BY J. MILLER.
21 FEB 2007
H
CORRECTED MARKING DIAGRAM ERROR BY REVERSING ANALOG AND
DISCRETE LABELS. REQ. BY GK SUA.
18 MAY 2007
J
CHANGED NOTE 4. REQ. BY A. GARLINGTON.
13 MAR 2013
K
REMOVED DIMENSION L AND ADDED DATUMS A AND B TO TOP VIEW. REQ.
BY A. GARLINGTON.
19 APR 2013
L
REMOVED −02 FROM CASE CODE VARIANT. REQ. BY N. CALZADA.
23 SEP 2015
M
CHANGED DIMENSIONS A & B FROM BASIC TO MIN AND MAX VALUES. REQ.
BY A. GARLINGTON.
17 MAY 2016
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2016
May, 2016 − Rev. M
Case Outline Number:
483