MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS DFN8 2x2, 0.5P CASE 506AA ISSUE F DATE 04 MAY 2016 1 SCALE 4:1 D PIN ONE REFERENCE 0.10 C 2X ÎÎ ÎÎ ÎÎ 0.10 C 2X A B 0.10 C L NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994 . 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. L L1 DETAIL A E OPTIONAL CONSTRUCTIONS ÏÏ ÎÎ ÎÎ EXPOSED Cu TOP VIEW A DETAIL B DIM A A1 A3 b D D2 E E2 e K L L1 A3 MOLD CMPD A1 ÎÎ ÏÏ DETAIL B 0.08 C ALTERNATE CONSTRUCTIONS (A3) A1 NOTE 4 C SIDE VIEW SEATING PLANE GENERIC MARKING DIAGRAM* 1 DETAIL A D2 1 8X XXMG G L 4 XX = Specific Device Code M = Date Code G = Pb−Free Device E2 K MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.20 0.30 2.00 BSC 1.10 1.30 2.00 BSC 0.70 0.90 0.50 BSC 0.30 REF 0.25 0.35 −−− 0.10 8 5 8X e/2 e b 0.10 C A B 0.05 C NOTE 3 BOTTOM VIEW *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. RECOMMENDED SOLDERING FOOTPRINT* 8X 1.30 0.50 PACKAGE OUTLINE 0.90 2.30 1 8X 0.30 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: 98AON18658D Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed STATUS: ON SEMICONDUCTOR STANDARD versions are uncontrolled except when stamped “CONTROLLED COPY” in red. NEW STANDARD: © Semiconductor Components Industries, LLC, 2002 Case Outline Number: http://onsemi.com DFN8 2.0X2.0, 0.5P DESCRIPTION: October, 2002 − Rev. 0 PAGE 1 OFXXX 2 1 DOCUMENT NUMBER: 98AON18658D PAGE 2 OF 2 ISSUE REVISION DATE O RELEASED FOR PRODUCTION. REQ. BY T. GURNETT 21 MAY 2004 A CHANGED TITLE FROM 301AA TO 506AA. REQ. BY T. GURNETT 14 JUN 2004 B SWITCHED LABELS E AND E/2 IN EXPOSED PAD DIAGRAM. REQ. BY A. TAM. 18 APR 2005 C CHANGED MARKING DIAGRAM. REMOVED NOTE 5. CHANGED DIMS E2 AND L. REQ. BY C. REBELLO 20 MAY 2005 D CHANGED DATE CODE IDENTIFIER FROM “D” TO “M”. REQ. BY C. REBELLO 17 JUN 2005 E UPDATED DRAWING FORMAT, INCLUDING LEAD OPTION DETAILS. UPDATED MARKING INFORMATION. ADDED SOLDERING FOOTPRINT. REQ. BY J. LIU. 22 JAN 2010 F ADDED OPTIONAL CONSTRUCTION TO DETAIL B. REQ. BY J. LIU. 04 MAY 2016 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. © Semiconductor Components Industries, LLC, 2016 May, 2016 − Rev. F Case Outline Number: 506AA