506AA

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
DFN8 2x2, 0.5P
CASE 506AA
ISSUE F
DATE 04 MAY 2016
1
SCALE 4:1
D
PIN ONE
REFERENCE
0.10 C
2X
ÎÎ
ÎÎ
ÎÎ
0.10 C
2X
A
B
0.10 C
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994 .
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L
L1
DETAIL A
E
OPTIONAL
CONSTRUCTIONS
ÏÏ
ÎÎ
ÎÎ
EXPOSED Cu
TOP VIEW
A
DETAIL B
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
A3
MOLD CMPD
A1
ÎÎ
ÏÏ
DETAIL B
0.08 C
ALTERNATE
CONSTRUCTIONS
(A3)
A1
NOTE 4
C
SIDE VIEW
SEATING
PLANE
GENERIC
MARKING DIAGRAM*
1
DETAIL A
D2
1
8X
XXMG
G
L
4
XX = Specific Device Code
M = Date Code
G
= Pb−Free Device
E2
K
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.20
0.30
2.00 BSC
1.10
1.30
2.00 BSC
0.70
0.90
0.50 BSC
0.30 REF
0.25
0.35
−−−
0.10
8
5
8X
e/2
e
b
0.10 C A B
0.05 C NOTE 3
BOTTOM VIEW
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
RECOMMENDED
SOLDERING FOOTPRINT*
8X
1.30
0.50
PACKAGE
OUTLINE
0.90
2.30
1
8X
0.30
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON18658D
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
DFN8 2.0X2.0, 0.5P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON18658D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY T. GURNETT
21 MAY 2004
A
CHANGED TITLE FROM 301AA TO 506AA. REQ. BY T. GURNETT
14 JUN 2004
B
SWITCHED LABELS E AND E/2 IN EXPOSED PAD DIAGRAM. REQ. BY A. TAM.
18 APR 2005
C
CHANGED MARKING DIAGRAM. REMOVED NOTE 5. CHANGED DIMS E2 AND L.
REQ. BY C. REBELLO
20 MAY 2005
D
CHANGED DATE CODE IDENTIFIER FROM “D” TO “M”. REQ. BY C. REBELLO
17 JUN 2005
E
UPDATED DRAWING FORMAT, INCLUDING LEAD OPTION DETAILS. UPDATED
MARKING INFORMATION. ADDED SOLDERING FOOTPRINT. REQ. BY J. LIU.
22 JAN 2010
F
ADDED OPTIONAL CONSTRUCTION TO DETAIL B. REQ. BY J. LIU.
04 MAY 2016
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2016
May, 2016 − Rev. F
Case Outline Number:
506AA