506BJ

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
DFN8 3x3, 0.5P
CASE 506BJ-01
ISSUE O
1
SCALE 2:1
DATE 08 NOV 2007
PIN 1
REFERENCE
2X
0.10 C
2X
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
0.10 C
EDGE OF PACKAGE
A
B
D
NOTES:
1. DIMENSIONS AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND 0.30
MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L
L1
DETAIL A
E
OPTIONAL
CONSTRUCTION
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
L
TOP VIEW
DETAIL A
OPTIONAL
CONSTRUCTION
DETAIL B
0.05 C
A
8X
0.05 C
(A3)
NOTE 4
SIDE VIEW
A1
D2
8X
L
1
C
DETAIL A
4
OPTIONAL
CONSTRUCTION
K
8
5
e
8X
ÏÏ
ÏÏ
1
MOLD CMPD
DETAIL B
E2
8X
GENERIC
MARKING DIAGRAM*
SEATING
PLANE
EXPOSED Cu
b
0.10 C A B
BOTTOM VIEW
0.05 C
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.18
0.30
3.00 BSC
1.64
1.84
3.00 BSC
1.35
1.55
0.50 BSC
0.20
--0.30
0.50
0.00
0.03
NOTE 3
SOLDERMASK DEFINED
MOUNTING FOOTPRINT
1.85
XXXXX
XXXXX
ALYWG
G
8
XXXXX = Specific Device Code
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= Pb-Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb-Free indicator, “G” or microdot “ G”,
may or may not be present.
8X
0.35
8X
3.30
1.55
0.63
0.50
PITCH
DIMENSION: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON25786D
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
DFN8 3X3, 0.5P
DESCRIPTION:
October, 2002
- Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON25786D
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY T. GURNETT.
DATE
08 NOV 2007
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2007
November, 2007 - Rev. 01O
Case Outline Number:
506BJ