ULLGA8 1.5x1.5, 0.5P

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ULLGA8, 1.5x1.5, 0.5P
CASE 613AG−01
ISSUE A
1
SCALE 4:1
A
B
D
PIN ONE
REFERENCE
0.10 C
ÏÏÏ
ÏÏÏ
ÏÏÏ
0.10 C
DATE 18 APR 2011
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
E
DIM
A
A1
b
b1
D
E
e
L
L1
L3
TOP VIEW
0.05 C
A
8X
GENERIC
MARKING DIAGRAM*
0.05 C
A1 C
SIDE VIEW
b1
e
8X
3
1
MILLIMETERS
MIN
MAX
−−−
0.40
0.00
0.05
0.20
0.30
0.30
0.40
1.50 BSC
1.50 BSC
0.50 BSC
0.25
0.35
0.05 REF
0.15 REF
SEATING
PLANE
1
L
X
M
G
L3
XM
G
= Specific Device Code
= Date Code
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
7
5
L1
8X
b
0.10 C A B
BOTTOM VIEW
0.05 C
NOTE 3
MOUNTING FOOTPRINT
7X
0.32
8X
0.51
PACKAGE
OUTLINE
1.65
1
0.42
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON34822E
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
ULLGA8, 1.5X1.5, 0.5P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON34822E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY T. GURNETT.
23 SEP 2008
A
CORRECTED MARKING DIAGRAM. REQ. BY S. CHANG.
18 APR 2011
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2011
April, 2011 − Rev. 01A
Case Outline Number:
613AG