74AHCU04-Q100 Hex unbuffered inverter Rev. 2 — 7 December 2015 Product data sheet 1. General description The 74AHCU04-Q100 is high-speed Si-gate CMOS device and is pin compatible with low-power Schottky TTL (LSTTL). It is specified in compliance with JEDEC standard No. 7A. The 74AHCU04-Q100 is a general-purpose hex unbuffered inverter. Each of the six inverters is a single stage. This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications. 2. Features and benefits Automotive product qualification in accordance with AEC-Q100 (Grade 1) Specified from 40 C to +85 C and from 40 C to +125 C Low power dissipation Balanced propagation delays Inputs accept voltages higher than VCC ESD protection: MIL-STD-883, method 3015 exceeds 2000 V HBM JESD22-A114F exceeds 2000 V MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 ) Multiple package options 3. Ordering information Table 1. Ordering information Type number Package Temperature range 74AHCU04D-Q100 Name 40 C to +125 C SO14 74AHCU04PW-Q100 40 C to +125 C TSSOP14 Description Version plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1 74AHCU04BQ-Q100 40 C to +125 C DHVQFN14 plastic dual in-line compatible thermal enhanced very SOT762-1 thin quad flat package; no leads; 14 terminals; body 2.5 3 0.85 mm 74AHCU04-Q100 NXP Semiconductors Hex unbuffered inverter 4. Functional diagram 1 1 1A 1Y 2 3 2A 2Y 4 3 5 5 3A 3Y 6 9 4A 4Y 8 11 5A 5Y 10 13 6A 6Y 12 9 11 13 2 1 4 1 6 1 8 1 10 1 12 A Y mna045 mna343 mna342 Fig 1. 1 Logic symbol Fig 2. IEC logic symbol Fig 3. Logic diagram (one inverter) 5. Pinning information $ WHUPLQDO LQGH[DUHD $+&84 9&& $+&84 < $ $ 9&& $ < < $ < $ $ < $ < $ $ < < < $ *1' < *1' < *1' < $ DDD 7UDQVSDUHQWWRSYLHZ DDD (1) This is not a supply pin. The substrate is attached to this pad using conductive die attach material. There is no electrical or mechanical requirement to solder this pad. However, if it is soldered, the solder land should remain floating or be connected to GND. Fig 4. Pin configuration SO14 and TSSOP14 74AHCU04_Q100 Product data sheet Fig 5. Pin configuration DHVQFN14 All information provided in this document is subject to legal disclaimers. Rev. 2 — 7 December 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 2 of 15 74AHCU04-Q100 NXP Semiconductors Hex unbuffered inverter 5.1 Pin description Table 2. Pin description Symbol Pin Description 1A, 2A, 3A, 4A, 5A, 6A 1, 3, 5, 9, 11, 13 data input 1Y, 2Y, 3Y, 4Y, 5Y, 6 2, 4, 6, 8, 10, 12 data output GND 7 ground (0 V) VCC 14 supply voltage 6. Functional description Table 3. Function table H = HIGH voltage level; L = LOW voltage level Input Output nA nY L H H L 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VCC supply voltage Max Unit 0.5 +7.0 V 20 - mA +7.0 V VO < 0.5 V or VO > VCC + 0.5 V - 20 mA 0.5 V < VO < VCC + 0.5 V - 25 mA supply current - 75 mA ground current 75 - mA 65 +150 C - 500 mW input clamping current input voltage IOK output clamping current IO output current ICC IGND Tstg storage temperature total power dissipation VI < 0.5 V Min 0.5 IIK VI Ptot Conditions [1] Tamb = 40 C to +125 C [2] [1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] For SO14 packages: above 70 C the value of Ptot derates linearly with 8 mW/K. For TSSOP14 packages: above 60 C the value of Ptot derates linearly with 5.5 mW/K. For DHVQFN14 packages: above 60 C the value of Ptot derates linearly with 4.5 mW/K. 74AHCU04_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 7 December 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 3 of 15 74AHCU04-Q100 NXP Semiconductors Hex unbuffered inverter 8. Recommended operating conditions Table 5. Recommended operating conditions Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ Max Unit VCC supply voltage 2.0 5.0 5.5 V VI input voltage 0 - 5.5 V VO output voltage 0 - VCC V Tamb ambient temperature 40 +25 +125 C t/V input transition rise and fall rate VCC = 3.3 V 0.3 V - - 100 ns/V VCC = 5.0 V 0.5 V - - 20 ns/V 9. Static characteristics Table 6. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter 25 C Conditions Min VIH VIL VOH VOL HIGH-level input voltage LOW-level input voltage Typ 40 C to +85 C Max Min 40 C to +125 C Unit Max Min Max VCC = 2.0 V 1.7 - - 1.7 - 1.7 - V VCC = 3.0 V 2.4 - - 2.4 - 2.4 - V VCC = 5.5 V 4.4 - - 4.4 - 4.4 - V VCC = 2.0 V - - 0.3 - 0.3 - 0.3 V VCC = 3.0 V - - 0.6 - 0.6 - 0.6 V VCC = 5.5 V - - 1.1 - 1.1 - 1.1 V HIGH-level VI = VIH or VIL output voltage IO = 50 A; VCC = 2.0 V 1.8 2.0 - 1.8 - 1.8 - V IO = 50 A; VCC = 3.0 V 2.7 3.0 - 2.7 - 2.7 - V IO = 50 A; VCC = 4.5 V 4.0 4.5 - 4.0 - 4.0 - V IO = 4.0 mA; VCC = 3.0 V 2.58 - - 2.48 - 2.4 - V IO = 8.0 mA; VCC = 4.5 V 3.94 - - 3.8 - 3.7 - V LOW-level VI = VIH or VIL output voltage IO = 50 A; VCC = 2.0 V - 0 0.2 - 0.2 - 0.2 V IO = 50 A; VCC = 3.0 V - 0 0.3 - 0.3 - 0.3 V IO = 50 A; VCC = 4.5 V - 0 0.5 - 0.5 - 0.5 V IO = 4.0 mA; VCC = 3.0 V - - 0.36 - 0.44 - 0.55 V IO = 8.0 mA; VCC = 4.5 V - - 0.36 - 0.44 - 0.55 V - - 0.1 - 1.0 - 2.0 A II input leakage current ICC supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 2.0 - 20 - 40 A CI input capacitance - 3 10 - 10 - 10 pF 74AHCU04_Q100 Product data sheet VI = 5.5 V or GND; VCC = 0 V to 5.5 V All information provided in this document is subject to legal disclaimers. Rev. 2 — 7 December 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 4 of 15 74AHCU04-Q100 NXP Semiconductors Hex unbuffered inverter 10. Dynamic characteristics Table 7. Dynamic characteristics GND = 0 V; For test circuit see Figure 7. Symbol Parameter 25 C Conditions Min propagation delay tpd nA to nY; see Figure 6 [1] VCC = 3.0 V to 3.6 V [2] CL = 15 pF CL = 50 pF CL = 15 pF CL = 50 pF power dissipation capacitance [4] CL = 50 pF; fi = 1 MHz; VI = GND to VCC [1] tpd is the same as tPLH and tPHL. [2] Typical values are measured at VCC = 3.3 V. Max Min Max Min Max - 3.0 7.1 1.0 8.5 1.0 9.0 ns - 3.4 10.6 1.0 12.0 1.0 13.5 ns - 2.4 5.5 1.0 6.5 1.0 7.0 ns - 3.5 7.0 1.0 8.0 1.0 9.0 ns - 9.1 - [3] VCC = 4.5 V to 5.5 V CPD Typ 40 C to +85 C 40 C to +125 C Unit [3] Typical values are measured at VCC = 5.0 V. [4] CPD is used to determine the dynamic power dissipation (PD in W). - - - - pF PD = CPD VCC2 fi N + (CL VCC2 fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; (CL VCC2 fo) = sum of outputs. 11. Waveforms VI VM nA input VM VCC GND t PHL t PLH PULSE GENERATOR VOH VM nY output VOL VI VO DUT RT VM mna344 CL 50 pF mna034 VM = 0.5 VCC; VI = GND to VCC. Test data is given in Table 7. Definitions for test circuit: CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to output impedance Zo of the pulse generator. Fig 6. The input (nA) to output (nY) propagation delay times 74AHCU04_Q100 Product data sheet Fig 7. Test circuit for measuring switching times All information provided in this document is subject to legal disclaimers. Rev. 2 — 7 December 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 5 of 15 74AHCU04-Q100 NXP Semiconductors Hex unbuffered inverter 12. Typical transfer characteristics mna353 2 VO VO (V) mna352 4 700 ICC (μA) 6 VO (V) ICC (mA) VO 500 3 1 300 2 2 0.5 100 1 0 1.5 4 ICC ICC 0 0 0 0.5 1 1.5 V (V) i 2 −100 0 0 Tamb = 25 C. Fig 8. 1 2 3 Vi (V) −2 Tamb = 25 C. VCC = 2.0 V; IO = 0 A Fig 9. VCC = 3.0 V; IO = 0 A mna351 8 30 VO (V) ICC (mA) 6 20 4 10 Rbias = 560 kΩ VCC ICC 2 0 0.47 μF VO 0 0 2 Tamb = 25 C. 4 Vi (V) 6 −10 input output VI (f = 1 kHz) 100 μF A IO GND mna050 I O g fs = --------V I fi = 1 kHz at VO is constant Fig 10. VCC = 5.5 V; IO = 0 A 74AHCU04_Q100 Product data sheet Fig 11. Test set-up for measuring forward transconductance All information provided in this document is subject to legal disclaimers. Rev. 2 — 7 December 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 6 of 15 74AHCU04-Q100 NXP Semiconductors Hex unbuffered inverter mna355 40 g fs (mA/V) 30 20 10 0 0 2 4 VCC (V) 6 Tamb = 25 C. Fig 12. Typical forward transconductance as a function of the supply voltage 13. Application information Some applications are: • Linear amplifier (see Figure 13) • Crystal oscillator design (see Figure 14) Remark: All values given are typical unless otherwise specified. R2 R1 VCC 1 μF R2 R1 U04 U04 C1 ZL C2 out mna052 mna053 Maximum Vo(p-p) = VCC 1.5 V centered at 0.5 VCC. C1 = 47 pF (typical) G ol G v = – --------------------------------------R1 1 + ------- 1 + G ol R2 C2 = 33 pF (typical) R1 = 1 M to 10 M (typical R2 optimum value depends on the frequency and required stability against changes in VCC or average minimum ICC. ICC is typically 5 mA at VCC = 5 V and fi = 10 MHz. Gol = open loop gain Gv = voltage gain R1 3 k, R2 1 M ZL > 10 k; Gol = 12 (typical) Typical unity gain bandwidth product is 5 MHz. Fig 13. Used as a linear amplifier 74AHCU04_Q100 Product data sheet Fig 14. Crystal oscillator configuration All information provided in this document is subject to legal disclaimers. Rev. 2 — 7 December 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 7 of 15 74AHCU04-Q100 NXP Semiconductors Hex unbuffered inverter Table 8. External components for resonator (f < 1 MHz) All values given are typical and must be used as an initial set-up. Frequency R1 R2 C1 C2 10 kHz to 15.9 kHz 22 M 220 k 56 pF 20 pF 16 kHz to 24.9 kHz 22 M 220 k 56 pF 10 pF 25 kHz to 54.9 kHz 22 M 100 k 56 pF 10 pF 55 kHz to 129.9 kHz 22 M 100 k 47 pF 5 pF 130 kHz to 199.9 kHz 22 M 47 k 47 pF 5 pF 200 kHz to 349.9 kHz 10 M 47 k 47 pF 5 pF 350 kHz to 600 kHz 10 M 47 k 47 pF 5 pF Table 9. Optimum value for R2 Frequency R2 Optimum for 3 kHz 2.0 k minimum required ICC 8.0 k minimum influence due to change in VCC 1.0 k minimum required ICC 6 kHz 4.7 k minimum influence by VCC 0.5 k minimum required ICC 2.0 k minimum influence by VCC 14 kHz 0.5 k minimum required ICC 1.0 k minimum influence by VCC >14 kHz - replace R2 by C3 with a typical value of 35 pF 10 kHz 74AHCU04_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 7 December 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 8 of 15 74AHCU04-Q100 NXP Semiconductors Hex unbuffered inverter 14. Package outline SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 D E A X c y HE v M A Z 8 14 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 7 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.35 0.014 0.0075 0.34 0.16 0.15 0.010 0.057 inches 0.069 0.004 0.049 0.05 0.244 0.039 0.041 0.228 0.016 0.028 0.024 0.01 0.01 0.028 0.004 0.012 θ 8o o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT108-1 076E06 MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 15. Package outline SOT108-1 (SO14) 74AHCU04_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 7 December 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 9 of 15 74AHCU04-Q100 NXP Semiconductors Hex unbuffered inverter TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1 E D A X c y HE v M A Z 8 14 Q (A 3) A2 A A1 pin 1 index θ Lp L 1 7 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.1 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 1 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.72 0.38 8o o 0 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT402-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 MO-153 Fig 16. Package outline SOT402-1 (TSSOP14) 74AHCU04_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 7 December 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 10 of 15 74AHCU04-Q100 NXP Semiconductors Hex unbuffered inverter '+94)1SODVWLFGXDOLQOLQHFRPSDWLEOHWKHUPDOHQKDQFHGYHU\WKLQTXDGIODWSDFNDJHQROHDGV WHUPLQDOVERG\[[PP % ' 627 $ $ $ ( F GHWDLO; WHUPLQDO LQGH[DUHD WHUPLQDO LQGH[DUHD & H H Y Z E & $ % & \ \ & / (K H N 'K ; N PP VFDOH 'LPHQVLRQVPPDUHWKHRULJLQDOGLPHQVLRQV 8QLW PP PD[ QRP PLQ $ $ E F ' 'K ( (K H H N / Y Z \ \ 1RWH 3ODVWLFRUPHWDOSURWUXVLRQVRIPPPD[LPXPSHUVLGHDUHQRWLQFOXGHG 2XWOLQH YHUVLRQ 627 5HIHUHQFHV ,(& -('(& -(,7$ VRWBSR (XURSHDQ SURMHFWLRQ ,VVXHGDWH 02 Fig 17. Package outline SOT762-1 (DHVQFN14) 74AHCU04_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 7 December 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 11 of 15 74AHCU04-Q100 NXP Semiconductors Hex unbuffered inverter 15. Abbreviations Table 10. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor LSTTL Low-power Schottky Transistor-Transistor Logic ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model CDM Charge Device Model TTL Transistor-Transistor Logic 16. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes 74AHCU04_Q100 v.2 20151207 Product data sheet - 74AHCU04_Q100 v.1 Modifications: 74AHCU04_Q100 v.1 74AHCU04_Q100 Product data sheet • General description corrected (added “-Q100” to product types (errata)). 20130605 Product data sheet - All information provided in this document is subject to legal disclaimers. Rev. 2 — 7 December 2015 - © NXP Semiconductors N.V. 2015. All rights reserved. 12 of 15 74AHCU04-Q100 NXP Semiconductors Hex unbuffered inverter 17. Legal information 17.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 17.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 17.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. 74AHCU04_Q100 Product data sheet Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. Unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. All information provided in this document is subject to legal disclaimers. Rev. 2 — 7 December 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 13 of 15 74AHCU04-Q100 NXP Semiconductors Hex unbuffered inverter No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. 17.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 18. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] 74AHCU04_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 7 December 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 14 of 15 NXP Semiconductors 74AHCU04-Q100 Hex unbuffered inverter 19. Contents 1 2 3 4 5 5.1 6 7 8 9 10 11 12 13 14 15 16 17 17.1 17.2 17.3 17.4 18 19 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4 Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Typical transfer characteristics . . . . . . . . . . . . 6 Application information. . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Contact information. . . . . . . . . . . . . . . . . . . . . 14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP Semiconductors N.V. 2015. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 7 December 2015 Document identifier: 74AHCU04_Q100