74AHC1G4210
10-stage divider and oscillator
Rev. 1 — 15 April 2016
Product data sheet
1. General description
74AHC1G4210 is a 10-stage divider and oscillator. It consists of a chain of 10 flip-flops.
Each flip-flop divides the frequency of the previous flip-flop by two, consequently the
74AHC1G4210 counts up to 210 = 1024. The single inverting stage (X1 to X2) functions as
a crystal oscillator or an input buffer for an external oscillator. When used as a buffer the
output X2 should be left floating. The frequency of the output (Q) is the frequency applied
to X1 divided by 1024. The divider advances on the negative-going transition of X1.
The X1 input is overvoltage tolerant. This feature allows the use of this device as a voltage
level translator in mixed voltage environments.
2. Features and benefits
Wide supply voltage range from 2.0 V to 5.5 V
Overvoltage tolerant inputs to 5.5 V
High noise immunity
CMOS low power dissipation
ESD protection:
HBM JESD22-A114F: exceeds 2000 V
CDM JESD22-C101E: exceeds 1000 V
Latch-up performance exceeds 100 mA per JESD 78 Class II
Specified from 40 C to +85 C and 40 C to +125 C
3. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range
Name
Description
Version
74AHC1G4210GW
40 C to +125 C
TSSOP5
plastic thin shrink small outline package; 5 leads;
body width 1.25 mm
SOT353-1
74AHC1G4210GM
40 C to +125 C
XSON6
plastic extremely thin small outline package;
no leads; 6 terminals; body 1 1.45 0.5 mm
SOT886
74AHC1G4210
NXP Semiconductors
10-stage divider and oscillator
4. Marking
Table 2.
Marking codes
Type number
Marking[1]
74AHC1G4210GW
C1
74AHC1G4210GM
C1
[1]
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
5. Functional diagram
;
;
4
67$*(
&2817(5
DDD
Fig 1.
Logic symbol
;
))
;
'
'
))
'
&3
&3
&3
4
))
4
4
4
DDD
Fig 2.
Logic diagram
6. Pinning information
6.1 Pinning
$+&*
$+&*
;
;
*1'
;
9&&
;
QF
*1'
4
9&&
4
DDD
7UDQVSDUHQWWRSYLHZ
DDD
Fig 3.
Pin configuration SOT353-1
74AHC1G4210
Product data sheet
Fig 4.
Pin configuration SOT886
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Rev. 1 — 15 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
2 of 14
74AHC1G4210
NXP Semiconductors
10-stage divider and oscillator
6.2 Pin description
Table 3.
Pin description
Symbol
Pin
Description
SOT353-1
SOT886
X1
1
1
clock input/oscillator pin
X2
2
2
oscillator pin
GND
3
3
ground (0 V)
Q
4
4
divider output
n.c.
-
5
not connected
VCC
5
6
supply voltage
7. Functional description
;
4
DDD
Fig 5.
Timing diagram
8. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
Min
Max
Unit
VCC
supply voltage
Conditions
0.5
+7.0
V
VI
input voltage
0.5
+7.0
V
IIK
input clamping current
VI < 0.5 V
20
-
IOK
output clamping current
VO < 0.5 V or VO > VCC + 0.5 V
IO
output current
0.5 V < VO < VCC + 0.5 V
ICC
mA
-
20
mA
-
25
mA
supply current
-
75
mA
IGND
ground current
75
-
mA
Tstg
storage temperature
65
+150
C
Ptot
total power dissipation
-
250
mW
[1]
[2]
Tamb = 40 C to +125 C
[1]
[2]
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
For TSSOP5 package: above 87.5 C the value of Ptot derates linearly with 4.0 mW/K.
For XSON6 package: above 118 C the value of Ptot derates linearly with 7.8 mW/K.
74AHC1G4210
Product data sheet
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Rev. 1 — 15 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
3 of 14
74AHC1G4210
NXP Semiconductors
10-stage divider and oscillator
9. Recommended operating conditions
Table 5.
Recommended operating conditions
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
Min
Typ
Max
Unit
2.0
5.0
5.5
V
VCC
supply voltage
VI
input voltage
0
-
5.5
V
VO
output voltage
0
-
VCC
V
Tamb
ambient temperature
40
+25
+125
C
t/V
input transition rise and fall
rate
VCC = 3.3 V 0.3 V
-
-
100
ns/V
VCC = 5.0 V 0.5 V
-
-
20
ns/V
10. Static characteristics
Table 6.
Static characteristics
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
VIH
VIL
VOH
25 C
Conditions
40 C to +85 C 40 C to +125 C Unit
Min
Typ
Max
Min
Max
Min
Max
VCC = 2.0 V
1.7
-
-
1.7
-
1.7
-
V
VCC = 3.0 V
2.4
-
-
2.4
-
2.4
-
V
VCC = 5.5 V
4.4
-
-
4.4
-
4.4
-
V
VCC = 2.0 V
-
-
0.3
-
0.3
-
0.3
V
VCC = 3.0 V
-
-
0.6
-
0.6
-
0.6
V
VCC = 5.5 V
-
-
1.1
-
1.1
-
1.1
V
HIGH-level
Q; VI = VIH or VIL
output voltage
IO = 50 A; VCC = 2.0 V
1.9
2.0
-
1.9
-
1.9
-
V
IO = 50 A; VCC = 3.0 V
2.9
3.0
-
2.9
-
2.9
-
V
IO = 50 A; VCC = 4.5 V
4.4
4.5
-
4.4
-
4.4
-
V
IO = 4.0 mA; VCC = 3.0 V
2.58
-
-
2.48
-
2.40
-
V
IO = 8.0 mA; VCC = 4.5 V
3.94
-
-
3.8
-
3.70
-
V
IO = 50 A; VCC = 2.0 V
1.9
2.0
-
1.9
-
1.9
-
V
IO = 50 A; VCC = 3.0 V
2.9
3.0
-
2.9
-
2.9
-
V
IO = 50 A; VCC = 4.5 V
4.4
4.5
-
4.4
-
4.4
-
V
IO = 2.0 mA; VCC = 3.0 V
2.58
-
-
2.48
-
2.40
-
V
IO = 3.0 mA; VCC = 4.5 V
3.94
-
-
3.8
-
3.70
-
V
HIGH-level
input voltage
LOW-level
input voltage
X1
X1
X2; VI = VIH or VIL
74AHC1G4210
Product data sheet
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Rev. 1 — 15 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
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74AHC1G4210
NXP Semiconductors
10-stage divider and oscillator
Table 6.
Static characteristics …continued
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
VOL
25 C
Conditions
40 C to +85 C 40 C to +125 C Unit
Min
Typ
Max
Min
Max
Min
Max
LOW-level
Q; VI = VIH or VIL
output voltage
IO = 50 A; VCC = 2.0 V
-
0
0.1
-
0.1
-
0.1
V
IO = 50 A; VCC = 3.0 V
-
0
0.1
-
0.1
-
0.1
V
IO = 50 A; VCC = 4.5 V
-
0
0.1
-
0.1
-
0.1
V
IO = 4.0 mA; VCC = 3.0 V
-
-
0.36
-
0.44
-
0.55
V
IO = 8.0 mA; VCC = 4.5 V
-
-
0.36
-
0.44
-
0.55
V
IO = 50 A; VCC = 2.0 V
-
0
0.1
-
0.1
-
0.1
V
IO = 50 A; VCC = 3.0 V
-
0
0.1
-
0.1
-
0.1
V
IO = 50 A; VCC = 4.5 V
-
0
0.1
-
0.1
-
0.1
V
IO = 2.0 mA; VCC = 3.0 V
-
-
0.36
-
0.44
-
0.55
V
IO = 3.0 mA; VCC = 4.5 V
-
-
0.36
-
0.44
-
0.55
V
-
-
0.1
-
1.0
-
2.0
A
X2; VI = VIH or VIL
II
input leakage
current
X1; VI = 5.5 V or GND;
VCC = 0 V to 5.5 V
ICC
supply current VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
1.0
-
10
-
40
A
CI
input
capacitance
-
3
8
-
8
-
8
pF
X1
11. Dynamic characteristics
Table 7.
Dynamic characteristics
GND = 0 V; tr = tf = 3.0 ns. For test circuit see Figure 8. For waveforms see Figure 6 and Figure 7.
Symbol Parameter
tpd
propagation
delay
25 C
Conditions
Min
Typ
Max
Min
Max
Min
Max
-
3
7
1
11
1
13
ns
-
7
13
1
16
1
18
ns
CL = 15 pF
-
2
5
1
7
1
9
ns
CL = 50 pF
-
6
10
1
11
1
12
ns
CL = 15 pF
-
24
41
1
50
1
59
ns
CL = 50 pF
-
26
45
1
53
1
63
ns
CL = 15 pF
-
17
27
1
33
1
39
ns
CL = 50 pF
-
19
30
1
38
1
44
ns
[1]
X1 to X2
VCC = 3.0 V to 3.6 V
[2]
CL = 15 pF
CL = 50 pF
VCC = 4.5 V to 5.5 V
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
Product data sheet
[3]
[1]
X1 to Q
74AHC1G4210
40 C to +85 C 40 C to +125 C Unit
[2]
[3]
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Rev. 1 — 15 April 2016
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74AHC1G4210
NXP Semiconductors
10-stage divider and oscillator
Table 7.
Dynamic characteristics …continued
GND = 0 V; tr = tf = 3.0 ns. For test circuit see Figure 8. For waveforms see Figure 6 and Figure 7.
Symbol Parameter
tW
pulse width
fmax
CPD
25 C
Conditions
Min
Typ
Max
Min
Max
Min
Max
VCC = 3.0 V to 3.6 V
4
-
-
5
-
7
-
ns
VCC = 4.5 V to 5.5 V
3
-
-
4
-
5
-
ns
VCC = 3.3 V
125
-
-
100
-
70
-
MHz
VCC = 5 V
165
-
-
125
-
100
-
MHz
X1 HIGH or LOW
maximum
frequency
X1
power
dissipation
capacitance
CL = 50 pF; fi = 1 MHz;
VI = GND to VCC
VCC = 3.3 V
[4]
-
4
-
-
-
-
-
pF
VCC = 5 V
[4]
-
5
-
-
-
-
-
pF
[1]
tpd is the same as tPLH and tPHL.
[2]
Typical values are measured at VCC = 3.3 V.
[3]
Typical values are measured at VCC = 5.0 V.
[4]
40 C to +85 C 40 C to +125 C Unit
CPD is used to determine the dynamic power dissipation PD (W).
PD = CPD VCC2 fi + CL VCC2 fi/1024 where:
fi = input frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in Volts.
74AHC1G4210
Product data sheet
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Rev. 1 — 15 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
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74AHC1G4210
NXP Semiconductors
10-stage divider and oscillator
12. Waveforms
9,
IPD[
9,
90
;LQSXW
;LQSXW
*1'
W:
*1'
W3+/
92+
90
Table 8.
90
4RXWSXW
92/
Fig 6.
W3/+
W3+/
W3/+
92+
;RXWSXW
90
92/
DDD
DDD
Measurement points are given in Table 8.
Measurement points are given in Table 8.
VOL and VOH are typical output voltage levels that occur
with the output load.
VOL and VOH are typical output voltage levels that occur
with the output load.
Input X1 to output X2 propagation delay times
Fig 7.
Input X1 to output Q propagation delay times
Measurement points
Inputs
Output
VI
VM
VM
GND to VCC
0.5 VCC
0.5 VCC
9&&
38/6(
*(1(5$725
9,
92
'87
57
&/
PQD
Test data is given in Table 7. Definitions for test circuit:
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
Fig 8.
Test circuit for measuring switching times
74AHC1G4210
Product data sheet
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Rev. 1 — 15 April 2016
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74AHC1G4210
NXP Semiconductors
10-stage divider and oscillator
13. Crystal oscillator
13.1 Typical crystal oscillator circuit
A typical crystal oscillator schematic is shown in Figure 9. R1 is the power limiting resistor,
its value depends on the frequency and required stability against changes in VCC or
average ICC. For starting and maintaining oscillation a minimum transconductance is
necessary, so R1 should not be too large. A practical value for R1 is 2.2 k.
5ELDV Nȍ
$+&*
9&&
; ;
)
LQSXW
RXWSXW
9,
I N+]
5ELDV
)
$ ,2
NȍWR0ȍ
*1'
5
Nȍ
PQD
gfs = IO / VI at VO is constant.
&
S)WRS)
&
S)
See also Figure 11.
DDD
Fig 9.
External component connection for a crystal
oscillator
Fig 10. Test set-up for measuring forward
transconductance
DDD
JIV
P$9
9&&9
Tamb = 25 C.
(1) Maximum.
(2) Typical.
(3) Minimum.
Fig 11. Typical forward transconductance as function of the supply voltage
74AHC1G4210
Product data sheet
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Rev. 1 — 15 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
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74AHC1G4210
NXP Semiconductors
10-stage divider and oscillator
14. Package outline
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Fig 12. Package outline SOT353-1 (TSSOP5)
74AHC1G4210
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 15 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
9 of 14
74AHC1G4210
NXP Semiconductors
10-stage divider and oscillator
627
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Fig 13. Package outline SOT886 (XSON6)
74AHC1G4210
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 15 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
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74AHC1G4210
NXP Semiconductors
10-stage divider and oscillator
15. Abbreviations
Table 9.
Abbreviations
Acronym
Description
CDM
Charged Device Model
DUT
Device Under Test
ESD
ElectroStatic Discharge
HBM
Human Body Model
MM
Machine Model
16. Revision history
Table 10.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
74AHC1G4210 v.1
20160415
Product data sheet
-
-
74AHC1G4210
Product data sheet
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Rev. 1 — 15 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
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74AHC1G4210
NXP Semiconductors
10-stage divider and oscillator
17. Legal information
17.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
17.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
17.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
74AHC1G4210
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 15 April 2016
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NXP Semiconductors
10-stage divider and oscillator
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may be subject to export control regulations. Export might require a prior
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Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
17.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
18. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
74AHC1G4210
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 15 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
13 of 14
NXP Semiconductors
74AHC1G4210
10-stage divider and oscillator
19. Contents
1
2
3
4
5
6
6.1
6.2
7
8
9
10
11
12
13
13.1
14
15
16
17
17.1
17.2
17.3
17.4
18
19
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 1
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Recommended operating conditions. . . . . . . . 4
Static characteristics. . . . . . . . . . . . . . . . . . . . . 4
Dynamic characteristics . . . . . . . . . . . . . . . . . . 5
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Crystal oscillator . . . . . . . . . . . . . . . . . . . . . . . . 8
Typical crystal oscillator circuit . . . . . . . . . . . . . 8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11
Legal information. . . . . . . . . . . . . . . . . . . . . . . 12
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Contact information. . . . . . . . . . . . . . . . . . . . . 13
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2016.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 15 April 2016
Document identifier: 74AHC1G4210