74LVT04 3.3 V Hex inverter Rev. 2 — 28 April 2014 Product data sheet 1. General description The 74LVT04 is a high-performance product designed for VCC operation at 3.3 V. The 74LVT04 provides six inverting buffers. 2. Features and benefits TTL input and output switching levels Latch-up protection JESD78 class II exceeds 500 mA ESD protection: HBM JESD22-A114E exceeds 2000 V MM JESD22-A115-A exceeds 200 V Specified from 40 C to +85 C 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74LVT04D 40 C to +85 C SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 74LVT04DB 40 C to +85 C SSOP14 plastic shrink small outline package; 14 leads; body width 5.3 mm SOT337-1 74LVT04PW 40 C to +85 C TSSOP14 plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1 74LVT04 NXP Semiconductors 3.3 V Hex inverter 4. Functional diagram $ < $ < $ < $ < $ < $ < PQD Logic symbol Fig 1. Y A PQD Fig 2. mna341 IEC logic symbol Fig 3. Logic diagram for one gate 5. Pinning information 5.1 Pinning 1A 1 14 VCC 1Y 2 13 6A 2A 3 12 6Y 2Y 4 3A 5 3Y 6 9 4A GND 7 8 4Y 04 11 5A 10 5Y 001aac915 Fig 4. Pin configuration SOT108-1 (SO14), SOT337-1 (SSOP14) and SOT402-1 (TSSOP14) 74LVT04 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 28 April 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 2 of 13 74LVT04 NXP Semiconductors 3.3 V Hex inverter 5.2 Pin description Table 2. Pin description Symbol Pin Description nA 1, 3, 5, 9, 11, 13 data input nY 2, 4, 6, 8, 10, 12 data output GND 7 ground (0 V) VCC 14 supply voltage 6. Functional description Table 3. Function table[1] Input Output nA nY L H H L [1] H = HIGH voltage level; L = LOW voltage level; Z = high-impedance OFF-state. 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage Conditions Min Max Unit 0.5 +4.6 V 0.5 +7.0 V input voltage [1] VO output voltage output in OFF-state or HIGH-state [1] 0.5 +7.0 V IIK input clamping current VI < 0 V 50 - mA IOK output clamping current VO < 0 V 50 - mA IO output current output in LOW-state - 64 mA output in HIGH-state - 32 mA Tstg storage temperature 65 +150 C Tj junction temperature [2] - 150 C [3] - 500 mW VI total power dissipation Ptot Tamb = 40 °C to +85 °C [1] The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed. [2] The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. [3] For SO14 packages: above 70 C derate linearly with 8 mW/K. For SSOP14 and TSSOP14 packages: above 60 C derate linearly with 5.5 mW/K. 74LVT04 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 28 April 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 3 of 13 74LVT04 NXP Semiconductors 3.3 V Hex inverter 8. Recommended operating conditions Table 5. Recommended operating conditions Symbol Parameter VCC Conditions Min Max Unit supply voltage 2.7 3.6 V VI input voltage 0 5.5 V VIH HIGH-level input voltage 2.0 - V VIL LOW-level input voltage - 0.8 V IOH HIGH-level output current - 20 mA IOL LOW-level output current - 32 mA Tamb ambient temperature in free air 40 +85 C t/V input transition rise and fall rate outputs enabled - 10 ns/V 9. Static characteristics Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter 40 C to +85 C Conditions Typ[1] Min Unit Max VIK input clamp voltage VCC = 2.7 V; IIK = 18 mA - - 1.2 V VOH LOW-level input voltage VCC = 2.7 V to 3.6 V; IOH = 100 A VCC 0.2 - - V VCC = 2.7 V; IOH = 6 mA 2.4 - - V VCC = 3.0 V; IOH = 20 mA 2.0 - - V VCC = 2.7 V; IOL = 100 A - - 0.2 V VCC = 2.7 V; IOL = 24 mA - - 0.5 V VCC = 3.0 V; IOL = 32 mA - - 0.5 V - - 10 A LOW-level output voltage VOL II input leakage current VCC = 0 V or 3.6 V; VI = 5.5 V VCC = 3.6 V; VI = VCC or GND - - ±1 A IOFF output off current VCC = 0 V; VI or VO = 0 V to 4.5 V - - ±100 A ICCH quiescent supply current VCC = 3.6 V; outputs HIGH; VI = GND or VCC, IO = 0 V - - 0.02 mA ICCL quiescent supply current VCC = 3.6 V; outputs LOW; VI = GND or VCC; IO = 0 V - 1.5 3 mA ICC additional supply current per input pin[2] VCC = 3 V to 3.6 V; one input at VCC 0.6 V; other inputs at VCC or GND - - 0.2 A CI input capacitance VI = 3 V or 0 V - 3 - pF [1] All typical values are at VCC = 3.3 V and Tamb = 25C. [2] This is the increase in supply current for each input at the specified voltage level other than VCC or GND. 74LVT04 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 28 April 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 4 of 13 74LVT04 NXP Semiconductors 3.3 V Hex inverter 10. Dynamic characteristics Table 7. Dynamic characteristics GND = 0 V; for test circuit, see Figure 6. Symbol Parameter LOW to OFF-state propagation delay tPLH 40 C to +85 C Conditions OFF-state to LOW propagation delay VCC = 2.7 V Max - - 4.7 ns 1.0 2.6 3.9 ns nA to nY; see Figure 5 ns VCC = 2.7 V VCC = 3.3 V 0.3 V [1] Min nA to nY; see Figure 5 VCC = 3.3 V 0.3 V tPHL Unit Typ[1] - - 3.2 1.0 2.5 3.5 ns All typical values are at VCC = 3.3 V and Tamb = 25C. 11. Waveforms 9, 90 Q$LQSXW 90 *1' W 3+/ W 3/+ 92+ 90 Q<RXWSXW 92/ 90 PQD VM = 50%; VI = GND to VCC. VM = 1.5 V; VI = GND to 2.7 V Fig 5. The input nA to output nY propagation delays 74LVT04 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 28 April 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 5 of 13 74LVT04 NXP Semiconductors 3.3 V Hex inverter tW VI 90 % negative pulse VM VM 10 % 0V tf tr tr tf VI 90 % positive pulse VM VM 10 % 0V tW VCC VI PULSE GENERATOR VO DUT RT CL RL 001aaf615 Test data is given in Table 8. Definitions test circuit: RT = termination resistance should be equal to output impedance Zo of the pulse generator. CL = load capacitance including jig and probe capacitance. RL = Load resistance. Fig 6. Table 8. Test circuit for measuring switching times Test data Input Load VI fi 2.7 V 10 MHz 500 ns 74LVT04 Product data sheet tW tr, tf CL RL 2.5 ns 50 pF 500 All information provided in this document is subject to legal disclaimers. Rev. 2 — 28 April 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 6 of 13 74LVT04 NXP Semiconductors 3.3 V Hex inverter 12. Package outline SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 D E A X c y HE v M A Z 8 14 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 7 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.35 0.014 0.0075 0.34 0.16 0.15 inches 0.010 0.057 0.069 0.004 0.049 0.05 0.244 0.039 0.041 0.228 0.016 0.028 0.024 0.01 0.01 0.028 0.004 0.012 θ 8o o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. Fig 7. REFERENCES OUTLINE VERSION IEC JEDEC SOT108-1 076E06 MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Package outline SOT108-1 (SO14) 74LVT04 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 28 April 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 7 of 13 74LVT04 NXP Semiconductors 3.3 V Hex inverter SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm D SOT337-1 E A X c y HE v M A Z 8 14 Q A2 A (A 3) A1 pin 1 index θ Lp L 7 1 detail X w M bp e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) θ mm 2 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 6.4 6.0 5.4 5.2 0.65 7.9 7.6 1.25 1.03 0.63 0.9 0.7 0.2 0.13 0.1 1.4 0.9 8o o 0 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT337-1 Fig 8. REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 MO-150 Package outline SOT337-1 (SSOP14) 74LVT04 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 28 April 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 8 of 13 74LVT04 NXP Semiconductors 3.3 V Hex inverter 76623SODVWLFWKLQVKULQNVPDOORXWOLQHSDFNDJHOHDGVERG\ZLGWKPP ' 627 ( $ ; F \ +( Y 0 $ = 4 $ SLQLQGH[ $ $ $ ș /S / H GHWDLO; Z 0 ES PP VFDOH ',0(16,216PPDUHWKHRULJLQDOGLPHQVLRQV 81,7 $ PD[ $ $ $ ES F ' ( H +( / /S 4 Y Z \ = ș PP R R 1RWHV 3ODVWLFRUPHWDOSURWUXVLRQVRIPPPD[LPXPSHUVLGHDUHQRWLQFOXGHG 3ODVWLFLQWHUOHDGSURWUXVLRQVRIPPPD[LPXPSHUVLGHDUHQRWLQFOXGHG 287/,1( 9(56,21 627 Fig 9. 5()(5(1&(6 ,(& -('(& -(,7$ (8523($1 352-(&7,21 ,668('$7( 02 Package outline SOT402-1 (TSSOP14) 74LVT04 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 28 April 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 9 of 13 74LVT04 NXP Semiconductors 3.3 V Hex inverter 13. Abbreviations Table 9. Abbreviations Acronym Description ESD ElectroStatic Discharge HBM Human Body Model 14. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes 74LVT04 v.2 20140428 Product data sheet - 74LVT04_1 Modifications: 74LVT04_1 74LVT04 Product data sheet • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • Legal texts have been adapted to the new company name where appropriate. Imported the data sheet into the latest template 19960828 Product specification - All information provided in this document is subject to legal disclaimers. Rev. 2 — 28 April 2014 - © NXP Semiconductors N.V. 2014. All rights reserved. 10 of 13 74LVT04 NXP Semiconductors 3.3 V Hex inverter 15. Legal information 15.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 15.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 15.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. 74LVT04 Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 2 — 28 April 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 11 of 13 74LVT04 NXP Semiconductors 3.3 V Hex inverter Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 16. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] 74LVT04 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 28 April 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 12 of 13 74LVT04 NXP Semiconductors 3.3 V Hex inverter 17. Contents 1 2 3 4 5 5.1 5.2 6 7 8 9 10 11 12 13 14 15 15.1 15.2 15.3 15.4 16 17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4 Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Contact information. . . . . . . . . . . . . . . . . . . . . 12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP Semiconductors N.V. 2014. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 28 April 2014 Document identifier: 74LVT04