EVAL-IGBT-650V-TO247-4 Application Notes (2.4 MB, EN)

TR EN CHS T OP™ 5 i n T O -24 7 4p in E v alu ati o n
Bo ard
EVAL-IGBT-650V-TO247-4
EVAL-IGBT-650V-TO247-4-S
Authors:
Dr. Vladimir Scarpa
Klaus Sobe
Application Note
About this document
Scope and purpose
This document provides an operation guide to the TO-247 4pin Evaluation Board.
It provides detailed information about how to configure the board in each of its different operation modes.
Additionally, it is also explained how to set up several measurements and parameters, like gate resistor and
case temperature.
Finally, a description on how to conduct practical measurements with the board is given and how the user
can reproduce them using its own board sample.
Intended audience
TO-247 4pin Evaluation Board owners and any development Engineer interested on it.
Table of Contents
1
1.1
Introduction ................................................................................................................................... 1
Scope and Purpose ............................................................................................................................. 2
2
Board Overview .............................................................................................................................. 4
3
3.1
3.2
3.3
3.4
3.5
3.6
Eval Board Hardware and Configuration........................................................................................ 7
Package configuration: TO-247 and TO-247 4pin .............................................................................. 7
Gate Driver Configuration ................................................................................................................... 8
Heat sink temperature seting and monitoring ................................................................................ 10
Test points ......................................................................................................................................... 11
Current sensing ................................................................................................................................. 12
Configurable circuit topologies ........................................................................................................ 13
4
4.1
4.2
4.3
4.4
Measurements with the Eval board .............................................................................................. 15
Measurement as a switching cell ...................................................................................................... 15
Measurement using a coaxial shunt ................................................................................................. 15
Comparison between TO-247 4pin and standard TO-247 ............................................................... 17
Operation as a step-down DC-DC converter .................................................................................... 18
5
References ................................................................................................................................... 20
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Introduction
Warnings
Attention:
The board described is an evaluation board dedicated for a laboratory environment ONLY!
Because it operates at high voltages this board MUST only be operated by qualified and skilled
personnel familiar with all applicable safety standards.
Attention:
For safe operation please read the whole document before handling the evaluation board!
The board operates at high voltages and is deemed to be ‘Dangerous equipment’!
Attention:
DO NOT TOUCH THE BOARD DURING OPERATION!
Attention:
Even brief accidental contact during operation might result in severe injury or death!
Attention:
Depending on the configuration of the board as well as the chosen supply-voltage, lifethreatening voltages might be present!
Attention:
Always make sure that the capacitances are discharged before touching the board.
Attention:
Only qualified personnel are to be allowed to handle this board!
Application Note
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TRENCHSTOP™ 5 in TO-247 4pin Evaluation Board
Introduction
1
Introduction
This evaluation (Eval) board, order name EVAL-IGBT-650V-TO247-4/S, has been developed to be a simple but
accurate test bench. The board allows evaluating the performance advantages of the TRENCHSTOPTM 5
IGBTs in TO-247 4pin package. It can be easily configured to test IGBTs in standard TO-247 package. Before
using the Eval board, it is highly recommended to read the application note TRENCHSTOP™ 5 in TO-247 4pin
Package [1]
In the Eval board it possible to measure the IGBT losses during switching events. It has an optimized layout,
which features an overall commutation loop inductance below 35 ηH, including packages and sockets.
Different parameters can easily be set, like load current, DC-voltage, turn-on and turn-off gate resistors.
Case temperature can be adjusted through a power resistor implemented onto the heat sink.
The Eval board can be used in continuous operation. From the basic phase-leg topology, it is possible to
configure it as a step-down or step-up DC-DC converter.
Finally, this Eval board can serve as an example for PCB layout. Please note, however, that no standard has
been followed regarding distances between components and tracks. They have been defined with the main
scope of very low parasitic inductance on the power loop.
Chapter 2 of this document presents an overview on the Eval board and all its functionalities. Chapter 3
describes how to configure the hardware. Finally, Chapter 4 gives some practical examples of
measurements. The Appendix contains the full board schematic, the bill of material and the PCB layers of
the Eval board.
Figure 1
Discrete IGBT in TO-247 4pin package and the Eval board
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TRENCHSTOP™ 5 in TO-247 4pin Evaluation Board
Board Overview
2
Board Overview
The Eval board comes inside a case, as shown in Figure 2, containing:

The Eval board

Spare parts of IGBTs IKZ50N65EH5, IKZ50N65NH5 and IKW50N65H5, data sheets in [2]

Spare parts of IC drivers 1EDI60I12AF, datasheets in [3]

One adapter for oscilloscope probe

One USB drive containing all related documents, including this application note

25 mΩ coaxial shunt, EVAL-IGBT-650V-TO247-4S only
Spare
Documenta
Eval board
Spare Switches
Drivers +
Probe Adapter
Documentation
Coaxial Shunt
(Opt.)
Eval board
Figure 2
Eval board case and components contained inside
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TRENCHSTOP™ 5 in TO-247 4pin Evaluation Board
Board Overview
Figure 3 depicts the general block diagram of the Eval board. It contains a phase-leg consisting of two IGBTs,
S1 and S2, in either TO-247 or TO-247 4pin packages. Section 3.1 explains the required changes in the circuit
to correctly accommodate each of the packages.
AUX
Heat sink
AUX
SUPPLY
VIN+
SGND
S1
Sig1
EiceDriver™
Compact
Sig2
A
VL
S2
Shunt
VINTo Power Source GND
PGND
To Oscilloscope GND
TSNS+
TPOW+
Power
Resistor
TPOW -
Figure 3
NTC
TSNS -
Block diagram of the TO-247 4pin Evaluation Board.
Each gate driver block is composed of one single channel 1EDI60I12AF device. The auxiliary (AUX) supply
provides isolated voltages for the gate driver blocks. It has two connectors, AUX and SGND. The voltage
between the terminals VAUX, defines the driving voltage of the switches. Each of the IGBTs can be controlled
independently, through two channels named Sig 1 and Sig 2. These signals are referenced to SGND. A
detailed description of the gate circuitry and how to set up the gate driver parameters is presented in
section 3.2.
A top view to the Eval board is presented in Figure 4, marking the position of the board’s connectors.
VINVL
VIN+
TPOW+
TPOWTSNS+
TSNSPGND
SGND
Sig2
AUX
Sig1
Figure 4
Top view of the Eval board with connectors’ description
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TRENCHSTOP™ 5 in TO-247 4pin Evaluation Board
Board Overview
The heat sink can be heated up through an implemented power resistor. It is assembled onto the heat sink,
on the opposite side of the two IGBTs. When power is applied to the terminals TPOW+ and TPOW-, the
temperature of the resistor will increase and the heat will spread over the entire heat sink surface. A
temperature sensor (NTC) is also assembled onto the heat sink. Its resistance will vary according to the
NTC’s case temperature. The value can be read through the pins TNS+ and TNS-. Section 3.3 provides more
details on how to set the heat sink temperature and how to monitor it through the NTC sensor.
The bulk voltage is applied between terminals VIN+ and VIN-. The terminal VL will be connected according to
the test configuration desired. There is a connecting wire between the choke and VL. It can be used either for
placing a current probe or, if the wire is removed, to insert an extra choke. This might be required especially
for continuous operation, since the assembled choke has a low inductance value and small copper cross
section.
Table 1 summarizes the maximum voltages that can be applied to the terminals of the Eval board.
Table 1
Maximum voltages allowed on the Eval board’s terminals
Terminal
Description
Max. Value
Comment
AUX
Auxiliary voltage
17 V
Referenced to SGND
VIN+
Input voltage
650 V
Referenced to VIN-
Sig/Sig2
Sig/1Sig2
18 V
Referenced to SGND
TPOW+
Sig1/Sig2
12 V
Referenced to TPOW-
All measurement voltages on the board are referenced to PGND. To avoid disturbances on the sensing signal
due to common mode noise, it is recommended to connect the terminal PGND directly to the oscilloscope’s
ground. This connection can be done through a cable wire of at least 2 mm².
There are two versions of the Eval board. The model named EVAL-IGBT-650V-TO247-4-S includes an extra
coaxial shunt for more accurate current measurement. There is an according place for it on the PCB, located
between the emitter pin of the low side IGBT and the VIN- terminal. More details on the current sensing
options are presented in section 3.4.
The Eval board has dimensions 130.2 mm x 171.5 mm x 72 mm (W x L x H) and includes a heat sink of about
100 mm x 29.4 mm x 45 mm. The thermal resistance is approximately 3.5 K/W between a TO-247 case and
ambient.
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TRENCHSTOP™ 5 in TO-247 4pin Evaluation Board
Eval Board Hardware and Configuration
3
Eval Board Hardware and Configuration
This chapter is about how to setup the hardware. It will enable the user to properly configure the Eval board
according to the measurements intended.
3.1
Package configuration: TO-247 and TO-247 4pin
The TO-247 4pin package has an extra Kelvin emitter connection. This bypasses the emitter lead inductance
on the gate control loop, enhancing the IGBT’s switching speed and decreasing the switching energy [1]. The
pinout of the TO-247 4pin is therefore different from the standard TO-247 as compared in Figure 5.
C
G
G C
E
Figure 5
(right).
C
E2
E1
E2 G
E1
Pinout of standard TO-247 (left) and TO-247 4pin (center) packages; equivalent IGBT draw
In order to accommodate both packages, the Eval board features dedicated 5 pin sockets, as depicted in
Figure 6. Pins 1, 2, 3 and 5 feature 200 mils (5.08 mm) spacing horizontally from each other. Pin 4 distances
100 mils from pins 3 and 5.
To ease soldering and unsoldering of switches without damaging the PCB pads, the IGBT sockets contain
pin adapters as pictured in Figure 6. An extra vertical distance of 100 mils (2.54 mm) is therefore required for
pin 4.
IGBT Socket
TO-247-4
1
Figure 6
2
3
5
4
G
C
E1
1
2
3 4 5
200 mils
E2
G
100 mils
TO-247-3
100 mils
Detailed IGBT socket (left) and used pins according to assembled package (right)
Depending on which package is intend to be assembled, resistors R101 and R201 must be set as described in
Table 2. Their location on the top side of the board can be seen in Figure 7.
Table 2
Proper configuration of R101 and R201 for TO-247 and TO-247 4pin packages
Switch
Package
Resistor
Resistance Value
S1
TO-247
R101
0Ω
TO-247 4pin
R101
Not assembled
TO-247
R201
0Ω
TO-247 4pin
R201
Not assembled
S2
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TRENCHSTOP™ 5 in TO-247 4pin Evaluation Board
Eval Board Hardware and Configuration
The Eval board comes with IKZ50N65EH5 [2] parts assembled. This is a 50A IGBT from Infineon’s
TRENCHSTOP™ 5 H5 family in TO-247 4pin package. Therefore, R101 and R201 are initially not assembled.
R101
R201
X101
X201
Figure 7
Front view to the Eval board (left) and detailed picture where the driver configuration resistors
and jumpers are evidenced (right)
3.2
Gate Driver Configuration
A simplified schematic of the gate driver circuitry is depicted in Figure 8. Both pins 1 and 5 of the socket are
connected to the gate pins of the TO-247 and the TO-247 4pin respectively. Separated resistors Rg,on and Rg,off
are connected to the gate driver. An extra low pass filter composed of resistor Rf and capacitor Cf, initially
not assembled, can be used to filter the gate signals if desired. The component numbers in the schematic
are presented in Table 3Figure 9.
AUX
Aux.
Supply
VDRV
NEG (-VDRV)
0V
-VDRV
X101 or
C
X201
5V
G
Rg,off
Sigx
Rg,on
SGND
VDRV
1EDI60I12AF
Rf
Cf
E2
E1
R101 or
R201
Figure 8
Simplified schematic of the gate driver circuitry
Attention:
The jumpers X101 and X201 are initially positioned to “0V”. Please check that the jumpers are
present on the board before any operation.
The gate voltages are defined by the auxiliary voltage VAUX, between terminals AUX and SGND. In addition,
the user has two possibilities for the turn-off gate voltage -VDRV, according to the position of the jumpers
X101 and X201. Their exact location on the top side of the PCB is shown in Figure 7.
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Eval Board Hardware and Configuration
When the jumper is set to “0V”, Vg,off is zero. The turn-off voltage is negative if the jumper is positioned at
“NEG”, proportional to VAUX. At VAUX=13 V, the turn-on voltage VDRV will be 15V, and -VDRV will be -7.5 V in case
the jumper is set to “NEG”.
A summary with the component naming for the parts involved in the gate driver circuitry is presented in
Table 3. It also lists the resulting driving voltages according to VAUX and the position of jumpers X101 and
X201. For each Rg,on and Rg,off there is one extra pad; the names are given in brackets in Table 3. These pads
are initially empty and can be used in case the original pads are damaged during evaluation.
Table 3
Switch
S1
S2
Component numbers and jumper configuration of the gate driver circuitry, for both S1 and S2
switches
Event
Gate Resistors VDRV / -VDRV
Jumper
turn-on
R111 (R112)
1.15 x VAUX
X101 set to “0V”
Turn-off
R121 (R122)
0V
X101 set to “NEG”
Turn-on
R211 (R212)
0.75 x VAUX
Turn-off
R221 (R222)
0.57 x VAUX
X201 set to “0V”
Rf
Cf
R131
C131
R231
C231
Figure 9 highlights a detailed view of the bottom side of the Eval board. There the location of the
components present in Table 3 is given.
Figure 9
Bottom view of the Eval board PCB (left) and detailed picture, where the components for the
setup of gate circuitry are evidenced (right)
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TRENCHSTOP™ 5 in TO-247 4pin Evaluation Board
Eval Board Hardware and Configuration
3.3
Heat sink temperature setting and monitoring
To enable temperature controlled measurement, the Eval board contains a power resistor that can be used
to heat up the heat sink. The relationship between the voltage applied to the resistor’s terminals and the
heat sink temperature is depicted in Figure 10. These values can be slightly different according to the
ambient temperature and heat sink position with respect to any air flow.
Figure 10
Heat sink temperature as a function of the applied voltage over the power resistor
An NTC sensor is assembled onto the heat sink besides the switches and can be used to sense and monitor
the heat sink temperature. The sensor’s resistance as function of the heat sink temperature is presented in
Figure 11.
NTC Resistance
100
[kΩ]
10
1
0.1
25
50
75
100
125
150
Heat-sink temperature [°C]
Figure 11
Resistance of the NTC resistor as function of the heat sink temperature (right)
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Eval Board Hardware and Configuration
3.4
Test points
The most relevant signals of the Eval board are available for measurement through test points. In total,
there are five test points, all located on the bottom side of the Eval board as can be seen in Figure 12.
TP1
TP2
TP3
TP4
TP5
Figure 12
Detailed view of the test points on the back side of the Eval board
Table 4 contains the test points’ identification names and description. The reference for all test points is the
terminal PGND, which is connected to the emitter E1 of the low side switch S2 as depicted in Figure 3.
Table 4
Test point identification names and description
Test point
Identification name
Description
TP1
Vic
Filtered signal from metal foil shunt
TP2
Vge4
Gate-emitter (E1) voltage of TO-247 4pin
TP3
Vee
Voltage between E1 and E2 pins of TO-247 4pin
TP4
Vce
Collector-emitter (E1) voltage
TP5
Vge3
Gate-emitter voltage of standard TO-247
Attention:
In case non isolated probes are used for waveform measurement, the PGND terminal shall be
used as the only reference for all oscilloscope channels.
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TRENCHSTOP™ 5 in TO-247 4pin Evaluation Board
Eval Board Hardware and Configuration
3.5
Current sensing
There are two possibilities to measure the emitter current of S2 in the Eval board. A metal foil resistor is
initially assembled in the Eval board. It has a resistance of 50 mΩ typical and is labeled Ric2. Its location is
presented in Figure 14. A low pass RC filter, composed by R301 and C301, is connected in parallel to Ric2.
For a correct sensing of the emitter current, it is recommended to use the probe adapter contained in the
Eval board’s case. This avoids oscillations and enables a more accurate measurement of the switching
energy. This adapter shall be soldered on the test point TP1; please refer to Figure 12. Figure 13 shows how
the oscilloscope probe shall be connected through the adapter.
Probe Adapter
Figure 13
Probe adapter soldered on the Eval board
As an alternative to the metal foil resistor, a coaxial shunt can be used for current measurement. The model
EVAL-IGBT-650V-TO247-4-S contains a suitable shunt. The location of the shunt pad is shown in Figure 14.
Before the coaxial shunt is used, unsolder the foil shunt resistor Ric2 and the resistor R301. They are both
highlighted in Figure 14.
Test point
Coaxial Shunt
Foil Shunt
Figure 14
Detailed view of the test point Vic and where to connect the coaxial shunt
Application Note
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TRENCHSTOP™ 5 in TO-247 4pin Evaluation Board
Eval Board Hardware and Configuration
3.6
Configurable circuit topologies
The Eval board is adaptable to operate in different circuit topologies. Table 5 summarizes the main circuit
configurations that can be used for different kinds of measurement.
Table 5
Configurable circuit topologies with the Eval board
Configuration
Measureable results
Topology
VIN+
Conf. 1
Switching Cell
Conf. 2
Switching Cell using
coaxial shunt (opt.)
S1
VL
EON and EOFF at
defined:
− IC (max 150 A)
− VCE (max 650V)
− TC (max 125°C)
− Rg
Double Pulse
S2
VDC
VIN PGND
VIN+
S1
Conf. 3
Step-up Converter
− VOUT.Max=520V
− Po.Max=2kW
− (limited by Tj)
To Load
VL
Ext . L
S2
VDC
VIN PGND
EON and EOFF
Converter Efficiency
Measured THEAT SINK
To Oscill.GND
VIN+
S1
Conf. 4
Step-down Converter
− V.IN.MAX=520V
− Po.Max=2kW
− (limited by Tj)
To Load
VL
Ext . L
S2
VIN -
+
VDC
PGND
To Oscill.GND
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Eval Board Hardware and Configuration
In Conf. 1 and Conf. 2, the Eval board will operate as a switching cell. In these configurations, losses during
switching events can be measured, varying load current IC and supply voltage VDC.
To test the Eval board in Conf. 1 or Conf. 2:
1. Set R101 and R201 according to the package tested, please refer to Table 2
2. Set gate resistors Rg, on and Rg,off using Table 3 as a reference
3. Connect a voltage source between terminals AUX and SGND. This is the voltage VAUX that in
combination with jumpers X101 and X102 defines the driving voltages as described in Table 3
4. Connect a voltage source between TPOW+ and TPOW- to set the heat sink temperature, using the
left graph of Figure 10 as reference
5. Measure waveforms of S2 through test points as described in Table 4
6. Only for Conf. 2: Place the coaxial shunt as depicted in Figure 13. More details to be found in section
4.2
7. Connect a signal generator to terminal Sig2 to provide the double pulse signals
8. Connect a DC voltage source VDC between terminals VIN+ and VIN-.
In Conf. 3 and Conf. 4 of Table 5, the Eval board operates as a DC-DC converter in continuous operation. In
this case, an extra inductor shall be connected in series to the assembled choke.
To test the Eval board in Conf. 3:
1. Set R101 and R201 according to the package of the tested package, please refer to Table 2
2. Set gate resistors Rg, on and Rg,off using Table 3 as reference
3. Connect a voltage source between terminals AUX and SGND. This is the voltage VAUX that, in
combination with jumpers X101 and X102 defines the driving voltages as described in Table 3. In
order to avoid disturbances on the gate of S1 it is recommended to set X101 to NEG.
4. Place an external inductor choke Ext. L , able to handle the desired current
5. Measure waveforms of S2 through test points as described in Table 4
6. Connect a signal generator to terminal Sig2 to provide gate signals for S2
7. Connect a DC voltage source VDC between the external choke Ext. L and terminal VIN-; put a load
between terminals VIN+ and VIN-.
To test the Eval board in Conf. 4:
1.
Set R101 and R201 according to the tested package, as given in Table 2;
8. Connect a voltage source between terminals AUX and SGND. This the voltage VAUX that, in
combination with jumpers X101 and X102 defines the driving voltages, as described in Table 3Figure
9. In order to avoid disturbances on the gate of S2, it is recommended to set X102 to NEG;
2. Set gate resistors Rg, on and Rg,off using Table 3 as reference
3. Place an external inductor choke Ext. L, able to handle the required current
4. Measure waveforms of S2 through test points, as described in Table 4. Waveforms of S1 must be
measured with isolated probes.
5. Connect a signal generator to terminal Sig1 to provide gate signals for S1
6. Connect a DC voltage source VDC between terminals VIN+ and VIN-; put a load between the choke Ext.
L and terminal VIN-.
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TRENCHSTOP™ 5 in TO-247 4pin Evaluation Board
Measurements with the Eval board
4
Measurements with the Eval board
In the delivered setup, the Eval board is configured to accommodate switches in TO-247 4pin package. Thus,
resistors R101 and R102 are not assembled and the jumpers X101 and X102 are placed in the “0V” position as
in Figure 7.
Attention:
4.1
Before any operation with the Eval board, please check that the jumpers X101 and X201 are
present and positioned to “0V”. They could have gotten lost or fallen off during transportation.
Measurement in switching cell configuration
For the operation as switching cell – Conf. 1 of Table 5 – the assembled inductor can be used. Its inductance
value is a function of current as shown in Figure 15. Up to 32A, the value is 85 µH. At higher current levels,
the inductance starts to decay exponentially down to 20 µH at 150 A.
Choke Inductance
90
[µH]
60
30
0
0
50
100
150
Current [A]
Figure 15
Inductance of the assembled choke as function of current
After setting the voltage VDC of the power supply, the double pulse must be provided by the signal generator.
The length of the first pulse will depend on the required current to be switched as depicted on Figure 16.
Assuming a DC voltage VDC=400V, a pulse length of tp=10 µs results in a switched current of ISW=50A, while
tp=20 µs results in ISW=150A.
Switched current
150
Double Pulse
100
[A]
Pulse length
50
0
0
5
10
15
20
Pulse length [µs]
Figure 16
Inductor current as function of pulse length for VDC =400 V
4.2
Measurement using a coaxial shunt
The Eval board EVAL-IGBT-650V-TO247-4-S contains a coaxial shunt of 25 mΩ. Please consider the
instruction in section 3.5 on how to assemble it.
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TRENCHSTOP™ 5 in TO-247 4pin Evaluation Board
Measurements with the Eval board
Terminals VIN+, VIN- and VL must be connected as in Conf. 2 of Table 5. The assembled inductor can also be
used with the coaxial shunt. The graph in is valid to determine the switched current.
Figure 17 presents a test bench configured as Conf. 2. The auxiliary supply provides VAUX and the voltage to
the power resistor. The NTC sensor is measured through a multimeter. The double pulse signal to Sig2 is
given by a signal generator. The current signal coming from the shunt is connected to the oscilloscope
through a coaxial cable, featuring an impedance of 50 Ω. All other waveforms are taken by non isolated
probes from the test points on the PCB.
NTC Measurement
VIN+
Double pulse signals
S1
VL
Double Pulse
S2
VDC
Auxiliary
Supply
VIN -
Signal generator
Coaxial Shunt
PGND
Eval board
Figure 17
Eval board test bench in Conf. 2
Figure 18 shows the difference in the waveforms coming from the metal foil shunt used in Conf. 1 and the
coaxial shunt in Conf. 2 in both, turn-on and turn-off events, for different values of switched current. This
difference is mainly coming from the different bandwidth of the sensor.
In order to compensate the parasitic inductance of the measurement loop, the signal coming from the foil
shunt must be filtered using resistor R301 and capacitor C301 on the PCB. The cut-off frequency of the filter
is calculated to be 7.2 MHz. The coaxial shunt instead has a 1.2 GHz bandwidth.
10
0
0
Turn-ON
0
0 50
Isw=6A
Isw=6A
50100
100
150
150
200
Time [ns]
Time [ns]
60
60
40
20
20
0
0
0
0 50
Isw=50
A
Isw=50
A
50100
100
150
150
200
6
4
4
2
0
-2
200
CoaxialCoaxial
Metal foil
Metal foil
80
40
Curent [A]
Curent [A]
80
6
200
Time [ns]
Time [ns]
Curent [A]
10
Curent [A]
20
Turn-OFF
20
CoaxialCoaxial
Metal foil
Metal foil
CoaxialCoaxial
Metal foil
Metal foil
Isw=6A
Isw=6A
2
0
-2
0
40
0
40
80
80
120
120
160
200
160
200
Time [ns]
Time [ns]
50
50
40
40
30
30
20
20
10
10
0
0
Curent [A]
30
Curent [A]
30
Curent [A]
Curent [A]
Emitter Current Measurement
0
0
40
CoaxialCoaxial
Metal foil
Metal foil
Isw=50
A
Isw=50
A
40
80
80
160
120 120
Time [ns]
Time [ns]
160
200
200
Figure 18 Measured waveforms of the emitter current of an IKW50N65EH5 IGBT. Turn-on events are
depicted on the left side, turn-off on the right side, using both coaxial and metal foil shunts, for different
current values
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TRENCHSTOP™ 5 in TO-247 4pin Evaluation Board
Measurements with the Eval board
4.3
Comparison between TO-247 4pin and standard TO-247
In order to test switches in standard TO-247 package with the Eval board:
1. Unsolder the switches in TO-247 4 pin package
2. Solder 0 Ω resistors on both R101 and R102 – refer to Figure 7
3. Solder the switches in standard TO-247
The Eval board has been used to compare the switching behavior of the IKZ50N65EH5 in TO-247 4pin and
IKW50N65H5 as a standard TO-247 IGBT. The operation conditions are summarized in Table 6Figure 19. The
gate resistors Rg,on and Rg,off have been chosen so that the transient overvoltage across the switch and the copacked diode were lower than 520 V.
Table 6
Test conditions for the comparison between IKZ50N65EH5 and IKW50N65H5
Parameter
Description
VSW
Value
Unity
Switched voltage
400
V
ISW
Switched current
50
A
Tj
Junction temperature
25
°C
VDRV
Turn-on voltage
15
V
-VDRV
Turn-off voltage
0
V
Rg,on
Turn-on gate resistor
Rg,off
Device
Turn-off gate resistor
IKW50N65H5
6
IKZ50N65EH5
10
IKW50N65H5
10
IKZ50N65EH5
23
Ω
Figure 19 contains waveforms of both parts tested. During turn-on, it is possible to see how the switching
time is increased in the 3pin configuration. This leads to additional 600 µJ turn-on energy when compared
to the same die in 4pin package, representing an increase by 60%. The energy reduction introduced by TO247 4pin package can differ according to the measurement conditions like current switched, temperature
and PCB layout.
the faster the IGBT is able to switch,
the bigger the benefit from TO-247 4pin
Voltage [V]
15 GateBasically,
10 Gate Voltage [V]
becomes. 10
5
During turn-off,
the emitter current waveform
exhibits the effect of0 the parasitic emitter inductance. The fall
5
IKW50N65H5
IKW50N65H5 This
time of the 0emitter current almost doublesIKZ50N65EH5
in the IKZ50N65EH5-5when compared to the IKW50N65H5.
IKZ50N65EH5
leads to higher switching energy during turn-off.
0
50
100
150
200
250
0
Collector-Emitter Voltage [V]
400
0
50
100
150
200
Emitter Current [A]
40
EON = 1654 µJ
20
0
250
IKW50N65H5
IKZ50N65EH5
60
EON = 1009 µJ
50
100
150
200
200
250
IKW50N65H5
IKZ50N65EH5
200
Turn-OFF
Turn-ON
150
400
0
0
100
Collector-Emitter Voltage [V]
IKW50N65H5
IKZ50N65EH5
200
50
0
0
100
150
40
200
250
IKW50N65H5
IKZ50N65EH5
EOFF = 1136 µJ
20
0
0
250
50
60 Emitter Current [A]
EOFF = 627 µJ
50
100
150
200
250
Time [ns]
Time [ns]
Figure 19 Measured waveforms of an IKW50N65EH5 IGBT during turn-on (left) and turn-off (right) at IC=50
A and TC=25°C, in both, 4-pin and 3-pin configurations
Application Note
17
Revision1.0, 2015-04-13
TRENCHSTOP™ 5 in TO-247 4pin Evaluation Board
Measurements with the Eval board
4.4
Operation as a step-down DC-DC converter
For operation of the Eval board as a step-down DC-DC converter, terminals VIN+, VIN- and VL must be
connected as in Conf. 4 of Table 5. In addition, it is recommended to connect the terminals of the assembled
inductor and the current shunts, so that they do not conduct current during operation.
The maximum power the Eval board can process is limited by the chips’ junction temperature. Internal tests
using IKZ50N65EH5 devices as switches S1 and S2 revealed that the Eval board can process up to 2 kW at a
switching frequency of 20 kHz, input voltage 400 V and duty cycle 50%.
VIN+
S1
Thermal Camera
Ext . L
S2
NTC Measurement
To Load
VL
VIN -
+
VDC
PGND
Eval board
To Oscill.GND
External Inductor
Figure 20
Eval board test bench in Conf. 4
To handle higher power, external cooling fans can be positioned aside the heat sink. Figure 20 shows a
combination of four fans, each of them fed with 12 V. This is clearly an excessive cooling and was only done
to enable the operation under higher power and current, closer to the rated value of the tested IGBTs.
Alternatively, a bigger heat sink with lower thermal resistance could be used.
With extra cooling it is possible to operate the Eval board up to 6 kW, either with IKW50N65H5 or
IKZ50N65EH5 IGBTs as S1 and S2. Main operation conditions are summarized in Table 7.
Table 7
Test conditions for the comparison between IKZ50N65EH5 and IKW50N65H5
Parameter
Description
VIN
Value
Unity
Input voltage
400
V
VOUT
Output voltage
200
V
POUT
Output power
6
kW
fsw
Junction temperature
20
kHz
VDRV
Turn-on gate voltage
15
V
-VDRV
Turn-off gate voltage
0
V
Rg,on
Rg,off
Application Note
Turn-on gate voltage
Turn-off gate resistor
Device
IKW50N65H5
6
IKZ50N65EH5
10
IKW50N65H5
10
IKZ50N65EH5
23
18
Ω
Revision1.0, 2015-04-13
TRENCHSTOP™ 5 in TO-247 4pin Evaluation Board
Measurements with the Eval board
To compare the difference in temperature and losses between IKZ50N65EH5 and IKW50N65H5, a thermal
camera and a power meter have been used. Figure 21 presents thermal pictures of the switches under
operation. The case temperature of switches S1 and S2 are inside areas 1 and 2 of the pictures, respectively.
S1
S2
1 2
1 2
Figure 21
devices
Thermal pictures of the Eval board tested with IKZ50N65EH5 (left) and IKW50N65H5 (left) IGBT
Table 8 presents the main test results of the Eval board operating on the conditions described in Table 7.
The case temperatures listed in were measured using the thermal camera as described above. The heat sink
temperature was measured with the NTC sensor available on the Eval board. Values for efficiency and losses
are determined by the power meter. Losses from the auxiliary supply and the power consumed by the
cooling fans are not included.
Table 8
Results of the Eval board operating as a step-down converter for different IGBT devices
Devices
TC (S1)
[°C]
TC (S2)
[°C]
Ths
[°C]
Converter Losses 1
[W]
Converter Efficiency 1
[%]
IKW50N65H5
97.8
106
83.1
237.0
96.10
IKZ50N65EH5
79.8
93.1
77.1
222.1
96.35
IKZ50N65NH5
76.1
90.4
74.3
220.5
96.38
1
Converter losses and efficiency neither include losses due to the auxiliary supply nor the cooling effort
IKZ50N65EH5 in TO-247 4pin presented lower operation temperature and slightly higher efficiency in
comparison to IKW50N65H5. In addition IKZ50N65NH5 [2], which has a Rapid 2 co-packed diode, presented
2 W lower losses and operated at a temperature 3K lower than the IKZ50N65EH5.
Application Note
19
Revision1.0, 2015-04-13
TRENCHSTOP™ 5 in TO-247 4pin Evaluation Board
References
5
References
[1] TRENCHSTOP™ 5 IGBT in a Kelvin Emitter Configuration
[2] www.infineon.com/to-247-4
[3] 1EDI60I12AF webpage
Application Note
20
Revision1.0, 2015-04-13
TRENCHSTOP™ 5 in TO-247 4pin Evaluation Board
Appendix
Appendix
A.1
PCB Schematic
Figure 22
Circuit schematic of the power circuitry
Figure 23
Circuit schematic of the auxiliary power supply
Application Note
21
Revision1.0, 2015-04-13
TRENCHSTOP™ 5 in TO-247 4pin Evaluation Board
Appendix
A.2
Bill of Material
Table 9
Bill of materials of the Eval board
Designator
C001
C002
C003
C004
C005
C006
C007
C008
C009
C011
C021
C101
C102
C103
C104
C105
C201
C202
C203
C204
C205
C301
C1
C2
C3
C4
C5
C6
X101
X201
C105
C201
C202
C203
C204
C205
C1
C2
C3
C4
C5
C6
X101
Application Note
Description
Value
Voltage
Footprint
Capacitor Ceramic
Capacitor Ceramic
Capacitor Ceramic
Capacitor Ceramic
Capacitor Ceramic
Capacitor Ceramic
Capacitor Ceramic
Capacitor Ceramic
Capacitor Ceramic
Capacitor Ceramic
Capacitor Ceramic
Capacitor Ceramic
Capacitor Ceramic
Capacitor Ceramic
Capacitor Ceramic
Capacitor Ceramic
Capacitor Ceramic
Capacitor Ceramic
Capacitor Ceramic
Capacitor Ceramic
Capacitor Ceramic
Capacitor Ceramic
Capacitor Film
Capacitor Film
Capacitor Film
Capacitor Film
Capacitor Film
Capacitor Film
Header
Header
Capacitor Ceramic
Capacitor Ceramic
Capacitor Ceramic
Capacitor Ceramic
Capacitor Ceramic
Capacitor Ceramic
Capacitor Film
Capacitor Film
Capacitor Film
Capacitor Film
Capacitor Film
Capacitor Film
Header
4u7
100n
4u7
100p
100n
100n
4u7
4u7
4u7
100n
100n
4u7
4u7
4u7
4u7
4u7
4u7
4u7
4u7
4u7
4u7
470p
60u
60u
100n
100n
100n
100n
25V
25V
25V
25V
25V
25V
25V
25V
25V
25V
25V
25V
25V
25V
25V
25V
25V
25V
25V
25V
25V
25V
800V
800V
1000V
1000V
1000V
1000V
C 0805
C 0805
C 0805
C 0805
C 0805
C 0805
C 1206
C 0805
C 0805
C 0805
C 0805
C 1206
C 0805
C 0805
C 0805
C 0805
C 1206
C 0805
C 0805
C 0805
C 0805
C 0805
4u7
4u7
4u7
4u7
4u7
4u7
60u
60u
100n
100n
100n
100n
25V
25V
25V
25V
25V
25V
800V
800V
1000V
1000V
1000V
1000V
C 0805
C 1206
C 0805
C 0805
C 0805
C 0805
22
Revision1.0, 2015-04-13
TRENCHSTOP™ 5 in TO-247 4pin Evaluation Board
Appendix
Designator
X201
HS1
IC001
IC002
IC101
IC201
L1
D_12V_1
D_12V_2
D_VIN_1
D_VIN_2
R111
R121
R211
R221
Ric2
Rsns
Rpow
R001
R003
R004
R011
R012
R021
R022
R091
R092
R093
R094
R301
D001
D101
D102
D103
D201
D202
D203
Application Note
Description
Header
Heat sink
Voltage Regulator 5V
Half bridge Driver
IGBT driver, ±6.0 A
IGBT driver, ±6.0 A
Inductor
LED
LED
LED
LED
Resistor MELF
Resistor MELF
Resistor MELF
Resistor MELF
Resistor Metal Foil
Thermistor NTC
Resistor Power
Resistor Thick Film
Resistor Thick Film
Resistor Thick Film
Resistor Thick Film
Resistor Thick Film
Resistor Thick Film
Resistor Thick Film
Resistor Thick Film
Resistor Thick Film
Resistor Thick Film
Resistor Thick Film
Resistor Thick Film
Silicon Schottky Diode
Silicon Schottky Diode
Silicon Schottky Diode
Silicon Schottky Diode
Silicon Schottky Diode
Silicon Schottky Diode
Silicon Schottky Diode
Value
Voltage
Footprint
SOT223
8-Lead SOIC
DSO-8-51
DSO-8-51
90u
10R
33R
10R
33R
R050
10k
4R7
68k
15R
15R
4k7
0R
4k7
0R
115k
115k
115k
5k9
47R
23
MELF 0102
MELF 0102
MELF 0102
MELF 0102
400V
400V
400V
TO-220
TO-247
R 0805
R 0805
R 0805
R 0805
R 0805
R 0805
R 0805
R 2010
R 2010
R 2010
R 0805
R 0805
SC79
SC79
SC79
SC79
SC79
SC79
SC79
Revision1.0, 2015-04-13
TRENCHSTOP™ 5 in TO-247 4pin Evaluation Board
Appendix
.3
Board layers
Figure 24
Top layer
VIN -
5V
VCC1
PGND
Figure 25
Internal layer 1
Application Note
24
Revision1.0, 2015-04-13
TRENCHSTOP™ 5 in TO-247 4pin Evaluation Board
Appendix
VIN +
SGND
COM1
VMID
PGND
COM2
Figure 26
Internal layer 2
Figure 27
Bottom layer
Application Note
to VL
25
Revision1.0, 2015-04-13
TRENCHSTOP™ 5 in TO-247 4pin Evaluation Board
Appendix
Revision History
Major changes since the last revision
Page or Reference
--
Application Note
Description of change
First Release
26
Revision1.0, 2015-04-13
Trademarks of Infineon Technologies AG
AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, CoolGaN™, CoolMOS™, CoolSET™, CoolSiC™, CORECONTROL™, CROSSAVE™, DAVE™, DI-POL™, DrBLADE™,
EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, ISOFACE™, IsoPACK™, iWafer™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OPTIGA™, OptiMOS™, ORIGA™, POWERCODE™, PRIMARION™, PrimePACK™,
PrimeSTACK™, PROFET™, PRO-SIL™, RASIC™, REAL3™, ReverSave™, SatRIC™, SIEGET™, SIPMOS™, SmartLEWIS™, SOLID FLASH™, SPOC™, TEMPFET™,
thinQ!™, TRENCHSTOP™, TriCore™.
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Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim
Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA.
muRata™ of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Technologies, Inc.
Openwave™ of Openwave Systems Inc. RED HAT™ of Red Hat, Inc. RFMD™ of RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun
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TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design
Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited.
Last Trademarks Update 2014-07-17
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Edition 2015-04-13
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