DC3 Package 3-Lead Plastic DFN (2mm × 2mm) (Reference LTC DWG # 05-08-1717 Rev A) 1.35 ±0.05 (2 SIDES) 1.00 ±0.05 1.30 ±0.05 (2 SIDES) 2.00 ±0.05 PACKAGE OUTLINE 0.25 ± 0.05 0.50 BSC RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS 1.35 ± 0.05 (2 SIDES) 2.00 ±0.10 (4 SIDES) PIN 1 BAR TOP MARK (SEE NOTE 6) 1.00 ± 0.05 (2 SIDES) 0.40 ±0.10 0.200 REF 0.75 ±0.05 0.70 ±0.05 R = 0.05 TYP PIN 1 NOTCH R = 0.20 OR 0.25 × 45° CHAMFER 3 1 R = 0.125 TYP 0.25 ± 0.05 0.50 BSC BOTTOM VIEW—EXPOSED PAD (DC3) DFN 0309 REV A 0.00 – 0.05 NOTE: 1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (W-TBD) 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE