DE/UE Package 12-Lead Plastic DFN (4mm × 3mm) (Reference LTC DWG # 05-08-1695 Rev D) 0.70 ± 0.05 3.60 ± 0.05 2.20 ± 0.05 3.30 ± 0.05 1.70 ± 0.05 PACKAGE OUTLINE 0.25 ± 0.05 0.50 BSC 2.50 REF RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 4.00 ± 0.10 (2 SIDES) 7 R = 0.115 TYP 0.40 ± 0.10 12 R = 0.05 TYP PIN 1 TOP MARK (NOTE 6) 0.200 REF 3.30 ± 0.10 3.00 ± 0.10 (2 SIDES) 1.70 ± 0.10 0.75 ± 0.05 6 0.25 ± 0.05 1 0.50 BSC 2.50 REF 0.00 – 0.05 BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING PROPOSED TO BE A VARIATION OF VERSION (WGED) IN JEDEC PACKAGE OUTLINE M0-229 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE PIN 1 NOTCH R = 0.20 OR 0.35 × 45° CHAMFER (UE12/DE12) DFN 0806 REV D