DEMA Package 16-Lead Plastic DFN (3mm × 4mm) (Reference LTC DWG # 05-08-1744 Rev B) 0.93 ± 0.05 0.53 ± 0.05 0.70 ± 0.05 1.21 ± 0.05 3.50 ± 0.05 3.38 ± 0.05 1.32 ± 0.05 1.53 ± 0.05 0.93 ± 0.05 2.10 ± 0.05 PACKAGE OUTLINE 0.23 ± 0.05 0.45 BSC 3.15 REF RECOMMENDED SOLDER PAD LAYOUT APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED R = 0.115 TYP 9 10 4.00 ± 0.10 0.16 ± 0.05 15 16 0.40 ± 0.10 2.45 ± 0.10 3.00 ± 0.10 1.32 ± 0.10 PIN 1 TOP MARK (SEE NOTE 6) R = 0.100 TYP 0.200 REF 0.75 ±0.05 0.63 ± 0.05 0.93 ± 0.10 1.53 ± 0.10 8 7 PIN 1 NOTCH R = 0.20 OR 0.25 × 45° CHAMFER 2 1 0.23 ± 0.05 0.45 BSC (DE16MA) DFN 0808 REV B 3.15 REF BOTTOM VIEW—EXPOSED PAD 0.00 – 0.05 NOTE: 1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE