LGA Package 144-Lead (15mm × 15mm × 4.32mm) (Reference LTC DWG # 05-08-1843 Rev A) aaa Z 15 BSC X 4.22 – 4.42 Y SEE NOTES DETAIL A 3x, C (0.22 x45°) 0.12 – 0.28 7 13.97 BSC M L K J H 15 BSC SUBSTRATE F E 1.27 BSC 0.27 – 0.37 PAD 1 CORNER G 13.97 BSC MOLD CAP 3.95 – 4.05 D Z bbb Z DETAIL B 4 C B A aaa Z PACKAGE TOP VIEW PADS SEE NOTES 0.630 ±0.025 SQ. 143x 11 10 9 8 7 6 5 4 3 2 PACKAGE BOTTOM VIEW DETAIL B 1 DIA 0.630 PAD 1 6.9850 5.7150 4.4450 3.1750 1.9050 0.6350 0.0000 0.6350 1.9050 3.1750 4.4450 5.7150 eee S X Y 6.9850 12 3 6.9850 5.7150 DETAIL A 4.4450 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 3.1750 2. ALL DIMENSIONS ARE IN MILLIMETERS 1.9050 0.6350 0.0000 0.6350 3 LAND DESIGNATION PER JESD MO-222, SPP-010 4 DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE 1.9050 3.1750 5. PRIMARY DATUM -Z- IS SEATING PLANE 4.4450 6. THE TOTAL NUMBER OF PADS: 144 7 5.7150 6.9850 SUGGESTED PCB LAYOUT TOP VIEW ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY SYMBOL TOLERANCE aaa 0.15 bbb 0.10 eee 0.05 LTMXXXXXX µModule COMPONENT PIN “A1” TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION LGA 144 1112 REV A