LGA Package 121-Lead (15mm × 15mm × 2.82mm) (Reference LTC DWG # 05-08-1775 Rev B) aaa Z SEE NOTES DETAIL A 15 BSC X 2.670 – 2.970 Y 11 10 9 8 7 6 5 4 3 2 7 1 A B PAD 1 CORNER C 4 D E 15 BSC 12.70 BSC MOLD CAP F SUBSTRATE G 0.27 – 0.37 H Z // bbb Z 2.40 – 2.60 J 1.27 BSC K DETAIL B L aaa Z PADS SEE NOTES PACKAGE TOP VIEW 0.635 ±0.025 SQ. 120x eee S X Y 12.70 BSC PACKAGE BOTTOM VIEW DETAIL B 6.350 5.080 3.810 2.540 0.9525 1.5875 1.270 0.000 1.270 2.540 3.810 5.080 6.350 3 6.350 DETAIL A 5.080 3.810 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2.540 2. ALL DIMENSIONS ARE IN MILLIMETERS 1.270 0.000 0.9525 1.5875 3 LAND DESIGNATION PER JESD MO-222, SPP-010 4 DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE 1.270 2.540 5. PRIMARY DATUM -Z- IS SEATING PLANE 3.810 6. THE TOTAL NUMBER OF PADS: 121 7 5.080 6.350 SUGGESTED PCB LAYOUT TOP VIEW ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY SYMBOL TOLERANCE aaa 0.15 bbb 0.10 eee 0.05 LTMXXXXXX µModule COMPONENT PIN “A1” TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION LGA 121 1212 REV B PAD 1 DIA (0.635)