LGA Package 133-Lead (15mm × 15mm × 4.32mm) (Reference LTC DWG # 05-08-1777 Rev A) aaa Z 15 BSC X 4.22 – 4.42 Y SEE NOTES DETAIL A 0.12 – 0.28 7 13.97 BSC 12 11 10 9 8 15 BSC 7 13.97 BSC MOLD CAP SUBSTRATE 6 5 1.27 BSC 0.27 – 0.37 3.95 – 4.05 4 Z bbb Z DETAIL B 3 2 PAD 1 CORNER 4 1 aaa Z PADS SEE NOTES PACKAGE TOP VIEW 0.630 ±0.025 SQ. 133x K J H G F E D C B A PACKAGE BOTTOM VIEW DETAIL B 6.9850 5.7150 4.4450 3.1750 1.9050 0.6350 0.0000 0.6350 1.9050 3.1750 4.4450 5.7150 6.9850 L 3 eee S X Y 0.630 M 6.9850 5.7150 DETAIL A 0.630 4.4450 3.1750 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS 1.9050 0.6350 0.0000 0.6350 3 LAND DESIGNATION PER JESD MO-222, SPP-010 4 DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE 1.9050 5. PRIMARY DATUM -Z- IS SEATING PLANE 3.1750 6. THE TOTAL NUMBER OF PADS: 133 4.4450 7 5.7150 6.9850 SUGGESTED PCB LAYOUT TOP VIEW ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY SYMBOL TOLERANCE aaa 0.15 bbb 0.10 eee 0.05 LTMXXXXXX µModule COMPONENT PIN “A1” TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION LGA 133 1212 REV A C(0.30) PAD 1