DDB Package 8-Lead Plastic DFN (3mm × 2mm) (Reference LTC DWG # 05-08-1702 Rev B) 0.61 ±0.05 (2 SIDES) 3.00 ±0.10 (2 SIDES) R = 0.115 TYP 5 R = 0.05 TYP 0.40 ± 0.10 8 0.70 ±0.05 2.55 ±0.05 1.15 ±0.05 PACKAGE OUTLINE 0.25 ± 0.05 0.50 BSC 2.20 ±0.05 (2 SIDES) PIN 1 BAR TOP MARK (SEE NOTE 6) 0.200 REF RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS NOTE: 1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 2.00 ±0.10 (2 SIDES) 0.56 ± 0.05 (2 SIDES) 0.75 ±0.05 0 – 0.05 4 0.25 ± 0.05 1 0.50 BSC 2.15 ±0.05 (2 SIDES) BOTTOM VIEW—EXPOSED PAD PIN 1 R = 0.20 OR 0.25 × 45° CHAMFER (DDB8) DFN 0905 REV B