LGA Package 77-Lead (15mm × 9mm × 4.32mm) (Reference LTC DWG # 05-08-1856 Rev B) aaa Z SEE NOTES DETAIL A 9 BSC X 4.22 – 4.42 Y 7 6 5 4 3 2 7 1 PAD 1 DIA (0.635) A B PAD 1 CORNER C 4 D E 15 BSC 12.70 BSC MOLD CAP F SUBSTRATE G 0.27 – 0.37 H Z // bbb Z 3.95 – 4.05 J 1.27 BSC K DETAIL B L aaa Z PADS SEE NOTES 3 0.635 ±0.025 SQ. 76x 0.9525 1.5875 DETAIL B 7.62 BSC PACKAGE BOTTOM VIEW 3.810 eee S X Y 2.540 1.270 0.000 1.270 2.540 3.810 4.1275 3.4925 PACKAGE TOP VIEW 6.350 5.080 DETAIL A 3.810 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2.540 2. ALL DIMENSIONS ARE IN MILLIMETERS 1.270 0.000 0.9525 1.5875 3 LAND DESIGNATION PER JESD MO-222, SPP-010 4 DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE 1.270 2.540 5. PRIMARY DATUM -Z- IS SEATING PLANE 3.810 6. THE TOTAL NUMBER OF PADS: 77 5.080 7 6.350 SUGGESTED PCB LAYOUT TOP VIEW ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY SYMBOL TOLERANCE aaa 0.15 bbb 0.10 eee 0.05 LTMXXXXXX µModule COMPONENT PIN “A1” TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION LGA 77 1212 REV B