aaa Z LGA Package 81-Lead (11.25mm × 11.25mm × 2.32mm) (Reference LTC DWG# 05-08-1809 Rev B) 11.250 BSC X 0.25 × 45 CHAMFER ×3 2.17 – 2.47 Y SEE NOTES DETAIL A J H G F E D C B 7 A PAD 1 1 PAD 1 CORNER 2 4 3 4 11.250 BSC MOLD CAP SUBSTRATE 0.27 – 0.37 6 7 Z bbb Z 1.90 – 2.10 5 10.160 BSC DETAIL B 8 1.27 BSC 9 aaa Z 0.630 ±0.025 SQ. 80x DETAIL B PACKAGE SIDE VIEW PADS SEE NOTES 10.160 BSC 3 PACKAGE BOTTOM VIEW 5.080 3.810 2.540 1.270 eee S X Y 0.000 1.5875 1.270 0.9525 2.540 3.810 5.080 PACKAGE TOP VIEW 5.080 DETAIL A 3.810 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2.540 1.270 2. ALL DIMENSIONS ARE IN MILLIMETERS 1.5875 0.9525 0.000 3 LAND DESIGNATION PER JESD MO-222, SPP-010 AND SPP-020 4 DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR A MARKED FEATURE 1.270 5. PRIMARY DATUM -Z- IS SEATING PLANE 2.540 LTMXXXXXX µModule COMPONENT PIN “A1” 6. THE TOTAL NUMBER OF PADS: 81 7 3.810 ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION LGA 81 0113 REV B 5.080 SUGGESTED PCB LAYOUT TOP VIEW SYMBOL TOLERANCE aaa 0.15 bbb 0.10