LGA Package 68-Lead (15mm × 9mm × 4.32mm) (Reference LTC DWG# 05-08-1893 Rev B) DETAIL A G A aaa Z SEE NOTES F E D C B 7 A PAD 1 1 PAD “A1” CORNER 2 b 4 3 4 5 D MOLD CAP F SUBSTRATE 6 7 H1 8 9 Z // bbb Z H2 X aaa Z 11 e b DIA (0.630) 68x Y E 10 e DETAIL B eee S X Y PADS SEE NOTES G DETAIL B PACKAGE TOP VIEW 3 PACKAGE BOTTOM VIEW 2. ALL DIMENSIONS ARE IN MILLIMETERS 3.810 2.540 1.270 0.000 1.270 2.540 3.810 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 DETAIL A 6.350 0.630 ±0.025 Ø 68x 5.080 3.810 2.540 1.270 0.000 1.270 2.540 3.810 5.080 6.350 SUGGESTED PCB LAYOUT TOP VIEW DIMENSIONS SYMBOL A b D E e F G H1 H2 aaa bbb eee MIN 4.22 0.60 0.27 3.95 NOM 4.32 0.63 15.00 9.00 1.27 12.70 7.62 0.32 4.00 MAX 4.42 0.66 3 LAND DESIGNATION PER JESD MO-222 4 DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE NOTES 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. THE TOTAL NUMBER OF PADS: 68 7 0.37 4.05 0.15 0.10 0.05 TOTAL NUMBER OF LGA PADS: 68 COMPONENT PIN “A1” TRAY PIN 1 BEVEL ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY LTMXXXXXX µModule PACKAGE IN TRAY LOADING ORIENTATION LGA 68 1212 REV B