UHG Package Variation: UHG52 (39) 52-Lead Plastic QFN (5mm × 8mm) (Reference LTC DWG # 05-08-1846 Rev B) 43 41 39 6.40 REF 35 34 33 32 31 30 29 28 37 27 0.70 ± 0.05 44 26 25 24 46 5.50 ± 0.05 4.10 ± 0.05 23 48 22 3.20 REF 21 2.90 ±0.05 50 20 5.90 ±0.05 51 19 18 PACKAGE OUTLINE 2 4 6 0.80 BSC 7 9 11 12 13 14 15 16 0.40 BSC 17 0.20 ± 0.05 7.10 ± 0.05 8.50 ± 0.05 RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 51 50 48 46 44 R = 0.10 TYP 0.75 ± 0.05 5.00 ± 0.10 0.00 – 0.05 46 48 PIN 1 NOTCH R = 0.30 TYP OR 0.35 × 45° CHAMFER 50 51 0.40 ±0.10 PIN 1 TOP MARK (SEE NOTE 6) 43 43 41 41 39 39 7 37 37 9 35 35 6.40 REF 2 44 R = 0.10 TYP 2 4 4 6 6 7 9 34 34 11 33 33 12 32 32 12 13 31 31 14 30 30 13 14 15 29 29 8.00 ± 0.10 16 28 17 27 11 0.80 BSC 0.60 TYP 0.40 BSC 15 5.90 ±0.10 2.90 ±0.10 28 27 0.20 ± 0.05 16 17 0.70 TYP 0.200 REF 0.75 ± 0.05 26 25 24 23 22 21 20 19 18 (UHG39) QFN 0410 REV B 3.20 REF BOTTOM VIEW—EXPOSED PAD 18 19 20 21 22 23 24 25 26 0.00 – 0.05 NOTE: 1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE