FE Package 24-Lead Plastic TSSOP (4.4mm) (Reference LTC DWG # 05-08-1771 Rev B) Exposed Pad Variation AA 7.70 – 7.90* (.303 – .311) 3.25 (.128) 3.25 (.128) 24 23 22 21 20 19 18 17 16 15 14 13 6.60 ±0.10 2.74 (.108) 4.50 ±0.10 6.40 2.74 (.252) (.108) BSC SEE NOTE 4 0.45 ±0.05 1.05 ±0.10 0.65 BSC 1 2 3 4 5 6 7 8 9 10 11 12 RECOMMENDED SOLDER PAD LAYOUT 4.30 – 4.50* (.169 – .177) 0.09 – 0.20 (.0035 – .0079) 0.25 REF 0.50 – 0.75 (.020 – .030) NOTE: 1. CONTROLLING DIMENSION: MILLIMETERS MILLIMETERS 2. DIMENSIONS ARE IN (INCHES) 3. DRAWING NOT TO SCALE 1.20 (.047) MAX 0° – 8° 0.65 (.0256) BSC 0.195 – 0.30 (.0077 – .0118) TYP 0.05 – 0.15 (.002 – .006) FE24 (AA) TSSOP REV B 0910 4. RECOMMENDED MINIMUM PCB METAL SIZE FOR EXPOSED PAD ATTACHMENT *DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.150mm (.006") PER SIDE