PD Package 16-Lead Plastic UTQFN (3mm × 3mm) (Reference LTC DWG #05-08-1738 Rev Ø) 0.70 ± 0.05 3.50 ± 0.05 (4 SIDES) 1.50 REF 2.10 ± 0.05 1.45 ± 0.05 1.45 ± 0.05 PACKAGE OUTLINE 0.25 ± 0.05 0.50 BSC RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 3.00 ± 0.10 PIN 1 TOP MARK (NOTE 6) PIN 1 NOTCH R = 0.20 TYP OR 0.25 × 45° CHAMFER R = 0.115 TYP 0.55 ± 0.05 R = 0.05 TYP 15 0.40 ± 0.10 1 1.45 ± 0.10 3.00 ± 0.10 16 1.50 REF 2 1.45 ± 0.10 (PD16) UTQFN 1106 REV Ø 0.125 REF 0.25 ± 0.05 0.00 – 0.05 0.50 BSC NOTE: BOTTOM VIEW—EXPOSED PAD 1. DRAWING CONFORMS TO JEDEC PACKAGE VARIATION (TBI) 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE